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NOIX1SN8000B-LTI1

Onsemi

NOIX1SN8000B-LTI1 by Onsemi

NOIX1SN8000B-LTI1 by Onsemi is an Image Sensor with 3.2x3.2um pixel size, 32.4 MHz master clock, and 4096 horizontal pixels. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high frame rate of 128 fps and wide spectral response range of 300-1000nm.

Median Price

$396.990

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 56 parts In-Stock

1+ parts

$352.880

100+ parts

$331.710

1k+ parts

$310.530

10k+ parts

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56

$352.880

$331.710

$310.530

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Verical

USA . 56 parts In-Stock

1+ parts

$441.100

100+ parts

$414.637

1k+ parts

$388.163

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56

$441.100

$414.637

$388.163

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DigiKey

USA . 42 parts In-Stock

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Flip Electronics (Authorized)

USA . 42 parts In-Stock

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Digiode

USA . 1,048 parts In-Stock

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$389.234

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1,048

$389.234

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Vyrian

USA . 6,648 parts In-Stock

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Flip Electronics

USA . 44 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,003 parts In-Stock

1+ parts

$368.748

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1,003

$368.748

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Corohmni

South Africa . 384 parts In-Stock

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$409.720

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384

$409.720

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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SupplyDigital Components

Austria . 5,948 parts In-Stock

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Kulean Microsystems

USA . 4,235 parts In-Stock

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TANS Electronics

Latvia . 3,588 parts In-Stock

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Problanco Electronics

Mexico . 1,668 parts In-Stock

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1,668

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UHIMA Technologies

Türkiye . 635 parts In-Stock

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635

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GreenTree Electronics

Israel . 50 parts In-Stock

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Perfect Parts

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Overview

Capture every detail with the NOIX1SN8000B-LTI1 by Onsemi, a top-of-the-line image sensor designed to deliver impeccable quality and unmatched performance. Manufactured by the trusted brand Onsemi, this sensor is perfect for a wide range of applications, from professional photography to industrial automation. With its advanced features and cutting-edge technology, this sensor offers customers exceptional value, precise results, and endless possibilities. Upgrade your imaging experience with the NOIX1SN8000B-LTI1 and see the world in a whole new light.

Feature Benefit Bullets

Pixel Size (um): 3.2X3.2

Small pixel size allows for high resolution images and better detail in the captured images.

Maximum Supply Voltage: 1.3 V

Low maximum supply voltage reduces power consumption and heat generation, making the product energy efficient.

Master Clock: 32.4 MHz

High master clock frequency enables fast processing of image data, resulting in quick capture and transfer of images.

Body Width: 19.9 inch

Compact body width allows for easy integration into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high image quality, making them a popular choice in the industry.

Maximum Operating Temperature: 85 °C

Wide operating temperature range ensures the product can function in various environmental conditions without overheating.

Horizontal Pixel: 4096

High horizontal pixel count results in detailed and high-resolution images, making the product suitable for various applications.

Vertical Pixel: 2160

High vertical pixel count ensures excellent image quality and clarity, enhancing the overall performance of the product.

Output Interface Type: I2C/SPI INTERFACE

Versatile output interface options provide flexibility in connecting the image sensor to different platforms and devices.

Technical Specifications

Image Sensors NOIX1SN8000B-LTI1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER; IT ALSO OPERATES AT ANALOG VOLTAGE OF 2.7 V TO 2.9V

Array Type:

FRAME

Body Width:

19.9 inch

Body Height:

2.54 mm

Body Length/Diameter:

20.88 mm

Dynamic Range:

68 dB

Frame Rate:

128 fps

Horizontal Pixel:

4096

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

32.4 MHz

Mounting Feature:

Maximum Operating Current:

240 mA

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/1.1

Output Interface Type:

I2C/SPI INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.2X3.2

Sensors or Transducers Type:

Spectral Response (nm):

300-1000

Maximum Supply Voltage:

1.3 V

Minimum Supply Voltage:

1.1 V

Termination Type:

SOLDER

Vertical Pixel:

2160

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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