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KAI-0330D

Onsemi

KAI-0330D by Onsemi

The Onsemi KAI-0330D is a 9x9 um CCD image sensor with 648 (H) x 484 (V) pixels. It operates b/w -20 to 40 °C, with output range of 12-15.5V and dynamic range of 58 dB. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.

Median Price

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Lifecycle Status

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3

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1k+

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Vyrian

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Digiode

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SupplyDigital Components

Austria . 6,359 parts In-Stock

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TANS Electronics

Latvia . 4,972 parts In-Stock

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Kulean Microsystems

USA . 2,095 parts In-Stock

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Corphita

USA . 1,992 parts In-Stock

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Problanco Electronics

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UHIMA Technologies

Türkiye . 58 parts In-Stock

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Overview

Unlock the power of crisp, high-quality imaging with the KAI-0330D by Onsemi. This advanced image sensor offers unparalleled precision and performance, perfect for a wide range of applications. Whether you're capturing stunning photos or enhancing security systems, this innovative product delivers unmatched value and reliability. Trust in Onsemi's reputation for excellence and elevate your projects with the KAI-0330D.

Feature Benefit Bullets

Pixel Size (um): 9X9

Smaller pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 15 V

Higher maximum supply voltage allows for better performance and flexibility in power management.

Body Width: 10.03 inch

Compact size makes it easy to integrate into various devices and systems.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors are known for their high-quality image capture and low noise performance.

Body Height: 3.18 mm

Low profile design allows for versatile placement and mounting options.

Package Shape or Style: RECTANGULAR

Rectangular shape provides a balanced and efficient design for optimal performance.

Minimum Supply Voltage: 7 V

Lower minimum supply voltage helps save power and can extend battery life.

Maximum Operating Temperature: 40 °C

Wide operating temperature range makes it suitable for various environments and applications.

Horizontal Pixel: 648

High horizontal pixel count allows for detailed and high-resolution image capture.

Output Range: 12-15.5V

Wide output range provides flexibility in signal processing and compatibility with different systems.

Output Type: ANALOG VOLTAGE

Analog output allows for real-time data processing and compatibility with other analog devices.

Minimum Operating Temperature: -20 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Dynamic Range: 58 dB

High dynamic range allows for capturing a wide range of light intensities with minimal distortion.

Vertical Pixel: 484

High vertical pixel count contributes to better image quality and resolution.

Body Length/Diameter: 17.7 mm

Compact and slim body design for easy integration and versatile mounting options.

Array Type: LINEAR

Linear array type allows for precise and efficient image capture for various applications.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting makes installation and replacement of the sensor easier and more secure.

Technical Specifications

Image Sensors KAI-0330D attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC SHUTTER

Array Type:

LINEAR

Body Width:

10.03 inch

Body Height:

3.18 mm

Body Length/Diameter:

17.7 mm

Dynamic Range:

58 dB

Horizontal Pixel:

648

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-20 Cel

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15 V

Minimum Supply Voltage:

7 V

Vertical Pixel:

484

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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