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AR0132AT6C00XPD20

Onsemi

AR0132AT6C00XPD20 by Onsemi

Onsemi's AR0132AT6C00XPD20 is a 1/3-inch CMOS image sensor with 1280x960 resolution. It operates at -40 to 105 °C, with a pixel size of 3.75um and a max supply voltage of 1.95V. Ideal for applications requiring high dynamic range and fast frame rates up to 60fps.

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Problanco Electronics

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Overview

Capture every moment with crystal clarity and precision using the AR0132AT6C00XPD20 Image Sensor by Onsemi. As a leader in image sensor technology, Onsemi delivers top-quality sensors that are perfect for a wide range of applications, from automotive to security systems. With a high dynamic range of 115 dB and a frame rate of 60 fps, this sensor ensures stunning image quality and smooth video capture. Trust Onsemi to provide you with the best in imaging technology, and bring your projects to life with the AR0132AT6C00XPD20.

Feature Benefit Bullets

Pixel Size (um): 3.75

Smaller pixel size allows for higher resolution and better image quality.

Maximum Supply Voltage: 1.95 V

Allows for higher voltage input, providing more power for processing data and improving performance.

Master Clock: 50 MHz

High master clock frequency enables fast data processing and high frame rates.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors offer low power consumption and high sensitivity, making them ideal for imaging applications.

Minimum Supply Voltage: 1.7 V

Provides flexibility in power input options while maintaining stable performance.

Maximum Operating Temperature: 105 °C

Wide operating temperature range allows for use in various environments and conditions.

Horizontal Pixel: 1280

Higher horizontal pixel count results in sharper and more detailed images.

Output Range: 0.40-1.50V

Wide output range allows for capturing images with different levels of brightness and contrast.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and integration with other digital systems.

Minimum Operating Temperature: -40 °C

Ability to operate in extreme cold temperatures expands the range of possible applications.

Maximum Operating Current: 130 mA

Low operating current consumption helps conserve power and extend battery life.

Dynamic Range: 115 dB

Wide dynamic range allows for capturing images with both bright and dark areas in high detail.

Vertical Pixel: 960

Higher vertical pixel count enhances the overall image resolution and quality.

Optical Format (inch): 1/3

Common optical format size ensures compatibility with a wide range of lenses and accessories.

Output Interface Type: 2-WIRE INTERFACE

Simplified output interface makes it easy to connect the sensor to other devices and systems.

Frame Rate: 60 fps

High frame rate enables smooth and fluid video recording and motion capture.

Array Type: LINEAR

Linear array configuration simplifies image processing and data analysis tasks.

Technical Specifications

Image Sensors AR0132AT6C00XPD20 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT ALSO OPERATES AT ANALOG SUPPLY VOLTAGE 2.5-3.1 V; ELECTRONIC ROLLING SHUTTER

Array Type:

LINEAR

Dynamic Range:

115 dB

Frame Rate:

60 fps

Horizontal Pixel:

1280

Master Clock:

50 MHz

Maximum Operating Current:

130 mA

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Pixel Size (um):

3.75

Sensors or Transducers Type:

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.7 V

Vertical Pixel:

960

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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