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AR0144CSSM20SUKA0-CPBR1

Onsemi

AR0144CSSM20SUKA0-CPBR1 by Onsemi

The Onsemi AR0144CSSM20SUKA0-CPBR1 is a 1280x800 CMOS image sensor with a 1/4-inch optical format. It features a 2-wire interface, solder termination, and surface mounting for applications in digital cameras, smartphones, and automotive imaging systems.

Median Price

$13.660

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

AR0144CSSM20SUKA0-CPBR1 by Onsemi
Compare Share

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 469 parts In-Stock

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$13.660

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469

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Flip Electronics (Authorized)

USA . 50 parts In-Stock

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Digiode

USA . 886 parts In-Stock

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$13.120

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886

$13.120

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Vyrian

USA . 4,458 parts In-Stock

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VNN

France . 3,281 parts In-Stock

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Nova Conductors

Japan . 650 parts In-Stock

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650

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Flip Electronics

USA . 50 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 259 parts In-Stock

1+ parts

$11.610

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259

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Corphita

USA . 1,355 parts In-Stock

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$12.429

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$12.429

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Corohmni

South Africa . 405 parts In-Stock

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$13.810

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405

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Kulean Microsystems

USA . 7,891 parts In-Stock

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Problanco Electronics

Mexico . 7,507 parts In-Stock

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SupplyDigital Components

Austria . 6,498 parts In-Stock

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Perfect Parts

USA . 5,040 parts In-Stock

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Argo Parts USA

USA . 4,267 parts In-Stock

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Continental Prestige Electronics

USA . 4,167 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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GreenTree Electronics

Israel . 1,500 parts In-Stock

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1,500

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UHIMA Technologies

Türkiye . 85 parts In-Stock

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85

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TANS Electronics

Latvia . 66 parts In-Stock

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66

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Netroflash

USA . 50 parts In-Stock

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Overview

Capture life's most precious moments in stunning detail with the AR0144CSSM20SUKA0-CPBR1 image sensor by Onsemi. As a leading manufacturer of cutting-edge imaging technology, Onsemi delivers unmatched quality and reliability in every product. Ideal for a wide range of applications, this CMOS image sensor offers exceptional value and performance. Whether you're capturing memories or enhancing security, trust Onsemi to provide the perfect solution for your imaging needs.

Feature Benefit Bullets

Body Width: 5.545 inch

The compact body width allows for easy integration into a variety of devices without taking up too much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their low power consumption and high-quality image capture, making this product efficient and reliable.

Body Height: 0.77 mm

The slim body height enables sleek designs and potential for use in thin devices where space is limited.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for easy placement and alignment within devices, ensuring a secure and stable fit.

Horizontal Pixel: 1280

With a high horizontal pixel count, this image sensor can capture detailed and sharp images, making it ideal for applications requiring high resolution.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of tin, silver, and copper for terminal finish ensures good conductivity and durability, enhancing the reliability and longevity of the product.

Vertical Pixel: 800

The vertical pixel count contributes to the overall image quality and detail captured by the sensor, providing clear and accurate images.

Body Length/Diameter: 5.565 mm

The precise body length/diameter measurement allows for easy installation and compatibility in a wide range of devices without any fitting issues.

Optical Format (inch): 1/4

The 1/4 inch optical format is a standard size in the industry, making this product widely compatible with existing systems and applications.

Termination Type: SOLDER

The solder termination type ensures a secure and reliable connection, preventing any potential connectivity issues and maintaining the product performance over time.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the connection process and allows for easy integration with other devices, providing a convenient setup for users.

Array Type: SINGLE FRAME

The single frame array type simplifies the image capture process and improves efficiency, making this product suitable for applications requiring real-time imaging.

Mounting Feature: SURFACE MOUNT

The surface mounting feature enables easy and secure installation on circuit boards, enhancing the product's stability and durability in various environments.

Technical Specifications

Image Sensors AR0144CSSM20SUKA0-CPBR1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER

Array Type:

SINGLE FRAME

Body Width:

5.545 inch

Body Height:

.77 mm

Body Length/Diameter:

5.565 mm

Horizontal Pixel:

1280

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/4

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

800

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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