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KAI-1020-ABB-JD-BA

Onsemi

KAI-1020-ABB-JD-BA by Onsemi

KAI-1020-ABB-JD-BA by Onsemi is a 1000x1000 pixel CCD image sensor with 7.4um pixel size and 58dB dynamic range. It outputs analog voltage in the range of 500mV, suitable for applications requiring high-quality imaging such as industrial machine vision systems and scientific cameras.

Median Price

$838.580

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2 parts In-Stock

1+ parts

$838.580

100+ parts

$788.260

1k+ parts

$712.790

10k+ parts

$712.790

2

$838.580

$788.260

$712.790

$712.790

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,464 parts In-Stock

1+ parts

$644.024

100+ parts

-

1k+ parts

-

10k+ parts

-

1,464

$644.024

-

-

-

Vyrian

USA . 8,592 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,592

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 257 parts In-Stock

1+ parts

$610.128

100+ parts

-

1k+ parts

-

10k+ parts

-

257

$610.128

-

-

-

Corohmni

South Africa . 262 parts In-Stock

1+ parts

$677.920

100+ parts

-

1k+ parts

-

10k+ parts

-

262

$677.920

-

-

-

Continental Prestige Electronics

USA . 2 parts In-Stock

1+ parts

$677.920

100+ parts

-

1k+ parts

-

10k+ parts

-

2

$677.920

-

-

-

TANS Electronics

Latvia . 7,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,403

-

-

-

-

SupplyDigital Components

Austria . 6,637 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,637

-

-

-

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Kulean Microsystems

USA . 5,232 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,232

-

-

-

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Problanco Electronics

Mexico . 4,132 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,132

-

-

-

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UHIMA Technologies

Türkiye . 226 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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226

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-

Overview

Unlock the possibilities of high-quality imaging with the KAI-1020-ABB-JD-BA by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch image sensors like this one, offering unparalleled clarity and precision for a wide range of applications. Whether you're capturing stunning photographs or enhancing security systems, this image sensor provides exceptional value with its advanced technology and reliable performance. Elevate your projects with the KAI-1020-ABB-JD-BA and experience the difference that Onsemi brings to the table.

Feature Benefit Bullets

Pixel Size: 7.4X7.4 um

High resolution and image quality due to small pixel size.

Body Width: 27.94 inch

Large body width for better stability and durability of the image sensor.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors provide high-quality images with low noise levels, making this product suitable for high-end applications.

Body Height: 3.42 mm

Compact body height allows for easy integration into various devices.

Package Shape or Style: SQUARE

Square package shape provides ease of mounting and alignment in systems.

Horizontal Pixel: 1000

High horizontal pixel count for detailed and sharp images.

Output Range: 500mV

Stable output range ensures consistent performance of the image sensor.

Output Type: ANALOG VOLTAGE

Analog voltage output allows for easy integration with existing systems.

Dynamic Range: 58 dB

Wide dynamic range for capturing both dark and bright areas in the scene.

Vertical Pixel: 1000

High vertical pixel count for detailed and sharp images.

Body Length/Diameter: 27.94 mm

Optimal body length/diameter ratio for a compact yet stable design.

Spectral Response (nm): 300-1000

Wide spectral response range for capturing a broad range of colors and light frequencies.

Data Rate: 40 Mbps

High data rate for fast and efficient image transfer and processing.

Termination Type: SOLDER

Solder termination provides secure and reliable connections.

Array Type: INTERLINE

Interline array type for improved image quality and reduced noise levels.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature for easy and secure installation in devices.

Technical Specifications

Image Sensors KAI-1020-ABB-JD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY 12 UV/ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

27.94 inch

Body Height:

3.42 mm

Body Length/Diameter:

27.94 mm

Data Rate:

40 Mbps

Dynamic Range:

58 dB

Horizontal Pixel:

1000

Mounting Feature:

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Spectral Response (nm):

300-1000

Termination Type:

SOLDER

Vertical Pixel:

1000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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