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AR0138AT3C00XUEA0-DRBR-E

Onsemi

AR0138AT3C00XUEA0-DRBR-E by Onsemi

Onsemi's AR0138AT3C00XUEA0-DRBR-E is a 1/2.6" CMOS image sensor with 1288x968 resolution, 4.2um pixel size, and 69fps frame rate. Ideal for surface mount applications requiring high-quality imaging in compact devices like smartphones and tablets.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,394 parts In-Stock

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Vyrian

USA . 1,373 parts In-Stock

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1,373

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Distributors (Availability)

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Native Components

USA . 66 parts In-Stock

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$9.484

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66

$9.484

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Northwest PG Solutions

USA . 1,500 parts In-Stock

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$10.433

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$9.389

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$10.433

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Problanco Electronics

Mexico . 7,685 parts In-Stock

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7,685

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SupplyDigital Components

Austria . 4,933 parts In-Stock

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4,933

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TANS Electronics

Latvia . 3,411 parts In-Stock

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Kulean Microsystems

USA . 3,013 parts In-Stock

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3,013

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Corphita

USA . 299 parts In-Stock

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299

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UHIMA Technologies

Türkiye . 231 parts In-Stock

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Corohmni

South Africa . 86 parts In-Stock

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Overview

Enhance your imaging experience with the AR0138AT3C00XUEA0-DRBR-E by Onsemi, a top-quality image sensor designed to deliver exceptional performance in a compact design. Onsemi, a renowned manufacturer in the industry, ensures reliability and innovation in every product they create. Ideal for various applications in digital cameras, security systems, and industrial automation, this image sensor captures crystal-clear images with a high frame rate of 69 fps. Elevate your projects with the superior quality and advanced features of the AR0138AT3C00XUEA0-DRBR-E today!

Feature Benefit Bullets

Pixel Size (um): 4.2X4.2

High resolution pixels provide detailed and sharp images.

Body Width: 9 inch

Compact and small form factor for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS technology offers low power consumption and high image quality.

Body Height: 1.4 mm

Slim profile enables versatile installation options in different devices.

Package Shape or Style: RECTANGULAR

Standard rectangular shape for easy assembly and compatibility with mounting systems.

Horizontal Pixel: 1288

High horizontal resolution for capturing wide scenes with clarity.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Multiple terminal finish options ensure reliable connections and durability.

Vertical Pixel: 968

Vertical resolution for capturing detailed images with depth.

Body Length/Diameter: 10 mm

Suitable size for compact devices without compromising on image quality.

Optical Format (inch): 1/2.6

Optimal optical format for balancing size and performance in imaging applications.

Termination Type: SOLDER

Secure termination method for stable and long-lasting connections.

Output Interface Type: 2-WIRE INTERFACE

Efficient data transfer using a standard 2-wire interface for seamless integration.

Frame Rate: 69 fps

High frame rate allows for smooth and real-time image capture.

Array Type: SINGLE FRAME

Single frame array design simplifies imaging system architecture and processing.

Mounting Feature: SURFACE MOUNT

Convenient surface mounting capability for easy installation and flexibility in device design.

Technical Specifications

Image Sensors AR0138AT3C00XUEA0-DRBR-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

SINGLE FRAME

Body Width:

9 inch

Body Height:

1.4 mm

Body Length/Diameter:

10 mm

Frame Rate:

69 fps

Horizontal Pixel:

1288

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/2.6

Output Interface Type:

2-WIRE INTERFACE

Package Shape or Style:

Pixel Size (um):

4.2X4.2

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

968

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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