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KAF-1603-ABA-CD-B2

Onsemi

KAF-1603-ABA-CD-B2 by Onsemi

The Onsemi KAF-1603-ABA-CD-B2 is a CCD image sensor with 9x9 um pixel size, offering 1536 horizontal and 1024 vertical pixels. It operates b/w -60 to 60 °C, with a dynamic range of 74 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

$3,339.935

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6 parts In-Stock

1+ parts

$1,169.360

100+ parts

$1,099.200

1k+ parts

$1,029.040

10k+ parts

-

6

$1,169.360

$1,099.200

$1,029.040

-

DigiKey

USA . 6 parts In-Stock

1+ parts

$1,415.620

100+ parts

-

1k+ parts

-

10k+ parts

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6

$1,415.620

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-

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Arrow

USA . 10 parts In-Stock

1+ parts

$5,264.250

100+ parts

-

1k+ parts

-

10k+ parts

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10

$5,264.250

-

-

-

Verical

USA . 10 parts In-Stock

1+ parts

$5,264.250

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$5,264.250

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 258 parts In-Stock

1+ parts

$1,293.112

100+ parts

-

1k+ parts

-

10k+ parts

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258

$1,293.112

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-

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Vyrian

USA . 8,852 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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8,852

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6 parts In-Stock

1+ parts

$1,155.000

100+ parts

-

1k+ parts

-

10k+ parts

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6

$1,155.000

-

-

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Corphita

USA . 1,217 parts In-Stock

1+ parts

$1,225.053

100+ parts

-

1k+ parts

-

10k+ parts

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1,217

$1,225.053

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-

-

Corohmni

South Africa . 245 parts In-Stock

1+ parts

$1,361.170

100+ parts

-

1k+ parts

-

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245

$1,361.170

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TANS Electronics

Latvia . 5,610 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,610

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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5,000

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Kulean Microsystems

USA . 3,180 parts In-Stock

1+ parts

-

100+ parts

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3,180

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SupplyDigital Components

Austria . 386 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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386

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Problanco Electronics

Mexico . 217 parts In-Stock

1+ parts

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217

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UHIMA Technologies

Türkiye . 82 parts In-Stock

1+ parts

-

100+ parts

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82

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Overview

Unleash the power of cutting-edge imaging technology with the KAF-1603-ABA-CD-B2 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in their image sensors. With applications ranging from medical imaging to industrial inspection, this product offers unmatched value and benefits to customers. Experience crystal-clear images, exceptional performance, and seamless integration with the KAF-1603-ABA-CD-B2, setting new standards in the world of image sensors.

Feature Benefit Bullets

Pixel Size (um) 9X9

The small pixel size allows for high resolution imaging, capturing fine details accurately.

Maximum Supply Voltage 15.5 V

The high maximum supply voltage enables efficient operation and ensures reliable performance.

Body Width 20.19 inch

The compact body width makes it easy to integrate this image sensor into various devices or systems.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality imaging capabilities, making this product suitable for demanding applications.

Package Shape or Style RECTANGULAR

The rectangular package shape offers versatility in mounting options and facilitates easy integration into different designs.

Minimum Supply Voltage 14.5 V

The low minimum supply voltage helps in saving power and ensures efficient energy usage.

Maximum Operating Temperature 60 °C

With a high maximum operating temperature, this image sensor can withstand harsh environmental conditions and extended operation.

Horizontal Pixel 1536

The high number of horizontal pixels results in a wide field of view and detailed image capture.

Minimum Operating Temperature -60 °C

The low minimum operating temperature allows this image sensor to function in extreme cold environments without any issues.

Housing CERAMIC

The ceramic housing provides durability and protection, making the image sensor suitable for rugged applications.

Dynamic Range 74 dB

A high dynamic range enables this image sensor to capture a wide range of light intensities accurately, resulting in high-quality images.

Vertical Pixel 1024

The vertical pixel count contributes to the overall image resolution and detail, ensuring clear and sharp images.

Body Length/Diameter 34.54 mm

The compact body length/diameter makes this image sensor easy to handle and install in space-constrained applications.

Data Rate 10 Mbps

The high data rate allows for fast and reliable data transfer, ensuring real-time image capture and processing.

Termination Type SOLDER

The solder termination type offers a secure and reliable connection for the image sensor, minimizing the risk of data loss or interference.

Array Type FULL FRAME

A full-frame array type ensures that the image sensor captures the entire scene in one shot, eliminating the need for stitching multiple images together.

Mounting Feature THROUGH HOLE MOUNT

The through-hole mounting feature simplifies the installation process and provides a secure mounting option for the image sensor.

Technical Specifications

Image Sensors KAF-1603-ABA-CD-B2 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 10 MICRO VOLT PER ELECTRON

Array Type:

FULL FRAME

Body Width:

20.19 inch

Body Length/Diameter:

34.54 mm

Data Rate:

10 Mbps

Dynamic Range:

74 dB

Horizontal Pixel:

1536

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

-60 Cel

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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