Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NOIS1SM1000A-HHC by Onsemi is a 1024x1024 CMOS image sensor with 15x15 um pixel size. Operating temperature ranges from -40 to 85 °C, with analog voltage output and 11 fps frame rate. Ideal for applications requiring high-resolution imaging in a compact square package.
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The small pixel size ensures high resolution and sharp image quality.
The wide body width allows for easy installation and stability.
CMOS image sensor technology provides high-quality images with low power consumption.
The compact body height makes it suitable for applications where space is limited.
The square package shape is easy to mount and offers efficient use of space.
The high maximum operating temperature allows for use in a variety of environments.
The high number of horizontal pixels results in detailed and high-resolution images.
Analog voltage output provides compatibility with a wide range of systems.
The low minimum operating temperature ensures reliable performance in cold conditions.
The matte tin terminal finish provides a durable and reliable connection.
The low operating current ensures energy efficiency and prolonged battery life.
Ceramic housing offers durability and heat resistance for long-term use.
The high number of vertical pixels enhances image clarity and detail.
The compact body length/diameter makes it easy to integrate into various designs.
Solder termination provides a secure and reliable connection for long-term use.
The fast frame rate ensures smooth video capture and motion detection.
The frame array type offers efficient image capture and processing capabilities.
Surface mounting feature allows for easy and secure installation in various applications.
Image Sensors NOIS1SM1000A-HHC attributes and parameters. Explore more Image Sensors devices from Onsemi
Array Type:
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Frame Rate:
Horizontal Pixel:
Housing:
JESD-609 Code:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Type:
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Pixel Size (um):
Sensors or Transducers Type:
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PCN Assembly/Origin - Test Site Transer 05/Jun/2014
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
FDLL4148
National Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
SMBJ18CA
Bytesonic Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138
Infineon Technologies
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Maximum Drain Current (Abs) (ID): .2 A; Maximum Feedback Capacitance (Crss): 8 pF;
1N4148
New Jersey Semiconductor Products
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NXP Semiconductors
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Terminals: 3; Maximum Drain Current (ID): .2 A; Operating Mode: ENHANCEMENT MODE;
M39029/56-351
Glenair
CONNECTOR ACCESSORY; Associated Backshell Military - Specifications: MIL-DTL-38999; Material: COPPER ALLOY; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: FEMALE; DIN Conformity: NO;
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
2N2222A
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
Texas Instruments
1N4148 by Texas Instruments is a rectifier diode with max reverse recovery time of 0.004 us and max forward voltage of 1V. Ideal for applications requiring low reverse current such as signal demodulation circuits. Operates at max temp of 200°C, making it suitable for high-temperature environments.
Diotec Electronics
MBR0520LT1
Motorola
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
MMBF170LT1G
Rochester Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Package Style (Meter): SMALL OUTLINE; No. of Terminals: 3;
2N7002
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 260; Package Shape: RECTANGULAR;
C1206C104M5RACTU
KEMET C1206C104M5RACTU is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It has X7R temperature characteristics, -55 to 125°C operating range, and ±20% tolerance. Ideal for surface mount applications in electronics requiring stable capacitance across temperatures.
Onsemi
LL4148
Diotec Semiconductor Ag
CL10B104KB8NNNC
Samsung Electro-mechanics
CL10B104KB8NNNC by Samsung Electro-mechanics is a ceramic capacitor with capacitance of 0.1uF and rated DC voltage of 50V. It has a negative tolerance of 10% and temperature coefficient of 15ppm/°C, suitable for surface mount applications in various electronic devices. With dimensions of 1.6mm x 0.8mm x 0.9mm, it operates b/w -55 to 125 °C providing stable performance in compact designs.
2H8652
Image Sensors;
AR0144CSSC20SUD20
The Onsemi AR0144CSSC20SUD20 is a 1/4-inch CMOS image sensor with 1280x800 resolution and 3x3 um pixel size. Featuring a 2-wire interface, it offers a frame rate of 60 fps. Ideal for applications requiring high-quality imaging in compact devices like smartphones and surveillance cameras.
MT9P006I12STCU
The Onsemi MT9P006I12STCU image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras and industrial imaging systems.
KAI-04050-CBA-JB-B2
KAI-04050-CBA-JB-B2 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates at temperatures from -50 to 70 °C and has a dynamic range of 64 dB. This CCD sensor is ideal for applications requiring high-quality imaging in various environments.
AR0521SR2C09SURA0-DP1
Onsemi's AR0521SR2C09SURA0-DP1 is a 12x12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. It features a square package style, solder termination, and 2-wire interface for surface mount applications in various imaging devices.
AR0134CSSM00SUEA0-DPBR
The Onsemi AR0134CSSM00SUEA0-DPBR image sensor features 3.75um pixel size, 1.95V max supply voltage, and 50MHz master clock. Ideal for applications requiring high-resolution imaging with a 1280x960 pixel array, such as surveillance cameras or industrial machine vision systems.
MT9P001I12STC-B-DR
The Onsemi MT9P001I12STC-B-DR image sensor features 2.20x2.20 um pixel size, 48 MHz master clock, and 70.1 dB dynamic range. Ideal for applications requiring high-resolution imaging with a frame rate of 15 fps in a compact 1/2.5-inch optical format.
AR0147ATSC00XUEA0-DPBR
Onsemi's AR0147ATSC00XUEA0-DPBR is a 3x3 um CMOS image sensor with 1344H x 968V pixels, offering a dynamic range of 140 dB. Operating at -40 to 110 °C, it has a max supply voltage of 1.26 V and outputs digital voltage. Ideal for applications requiring high-resolution imaging at up to 60 fps.
NOIP1SN0500A-QTI
NOIP1SN0500A-QTI by Onsemi is an Image Sensor with 4.80X4.80 um pixel size, 72 MHz master clock, and 800x600 resolution. Ideal for digital imaging applications requiring high frame rates up to 545 fps in a compact SQUARE package suitable for SURFACE mounting.
MT9V024IA7XTM-DR1
MT9V024IA7XTM-DR1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for applications requiring high-quality imaging such as surveillance cameras and industrial machine vision systems.
MT9V127IA3XTC-TP
MT9V127IA3XTC-TP by Onsemi is a 5.60x5.60 um CMOS image sensor with 27 MHz master clock, ideal for digital voltage output applications. Operating at -40 to 105 °C, it offers a dynamic range of 74.8 dB and supports a frame rate of 60 fps, making it suitable for surface mount installations in various imaging systems.
KAI-02150-ABA-JD-BA
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Optical Format (inch): 2/3;
CYII5SC1300AB-QDC
CYII5SC1300AB-QDC by Onsemi is an image sensor with 1280x1024 pixels, 6.7x6.7um pixel size, and 40MHz master clock. It operates b/w -30 to 65 °C, outputs digital voltage from 0.50-2.20V, and has a dynamic range of 64dB. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
AR0135CS2C19SUEA0-DPBR1
The Onsemi AR0135CS2C19SUEA0-DPBR1 is a 1/3 inch CMOS image sensor with a square package. It features tin/silver/copper terminal finish, suitable for surface mount applications. With dimensions of 9mm x 9mm x 1.55mm, it is ideal for frame array imaging in various devices.
AR0147ATSC00XUEG0-TPBR
Onsemi's AR0147ATSC00XUEG0-TPBR is a 3x3 um CMOS image sensor with 1344H x 968V pixels, offering a dynamic range of 140 dB. Operating at -40 to 110 °C, it has a max supply voltage of 1.26 V and output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and low-light sensitivity in compact devices.
NOIP1FN010KA-GDI
IMAGE SENSOR,CMOS;
NOIP1SN0300A-QDI
NOIP1SN0300A-QDI by Onsemi features 4.80X4.80 um pixel size, 72 MHz master clock, and 640x480 resolution. This image sensor is ideal for applications requiring high-speed digital imaging with a dynamic range of 60 dB.
AMIS-720233-B
IMAGE SENSOR,CMOS; Power Supplies (V): 5; Horizontal Pixel: 64; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 50 Cel; Vertical Pixel: 1;
AR0330CM1C21SHKA0-CR
The Onsemi AR0330CM1C21SHKA0-CR image sensor features 2.2x2.2 um pixel size, 27 MHz master clock, and 2304 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras, automotive vision systems, and industrial imaging solutions.
AR0233AT2B17XUEA0-DRBR-E
Onsemi's AR0233AT2B17XUEA0-DRBR-E is a CMOS image sensor with 2048x1280 resolution, 41.58 dB dynamic range, and MIPI output interface. Ideal for applications requiring high-quality imaging at 60 fps, such as surveillance cameras and automotive vision systems.
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CYIS1SM1000AA-HHC
Cypress
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1-4.25V; Terminal Finish: Gold (Au);
NOIS1SC1000A-HHC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Body Height: 4.17 mm; Frame Rate: 11 fps;
NOIS1SM0250A-HHC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 1-4.25V; Horizontal Pixel: 512;
NOIS1SM0250A-HWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 1-4.25V; Array Type: FRAME;
NOIS1SM0250A-WWC
IMAGE SENSOR,CMOS; Output Type: ANALOG VOLTAGE; Output Range: 1-4.25V; Pixel Size (um): 25X25; Frame Rate: 29 fps; Vertical Pixel: 512;
NOIS1SM0250S-HHC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 1-4.25V; Dynamic Range: 74 dB;
NOIS1SM0250S-HWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Output Range: 1-4.25V; Vertical Pixel: 512;
NOIS1SM1000A-HWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Array Type: FRAME; Optical Format (inch): 1;
NOIS1SM1000S-HHC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Maximum Operating Temperature: 85 Cel; Termination Type: SOLDER;
NOIS1SM1000S-HWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: SQUARE; Minimum Operating Temperature: -40 Cel; Body Length/Diameter: 29.21 mm;
Supply Digital Components
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12,000 In-Stock
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