Loading...

NOIS1SM0250A-HHC

Onsemi

NOIS1SM0250A-HHC by Onsemi

NOIS1SM0250A-HHC by Onsemi is a 25x25 um CMOS image sensor with 512x512 pixels, offering an 8 MHz master clock and 74 dB dynamic range. Ideal for applications requiring high-resolution imaging at temperatures ranging from 0 to 65 °C, it outputs analog voltage in the range of 1-4.25V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,610 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,610

-

-

-

-

Digiode

USA . 2,452 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,452

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 720 parts In-Stock

1+ parts

$21.230

100+ parts

-

1k+ parts

-

10k+ parts

-

720

$21.230

-

-

-

SupplyDigital Components

Austria . 6,212 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,212

-

-

-

-

TANS Electronics

Latvia . 4,450 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,450

-

-

-

-

Problanco Electronics

Mexico . 4,405 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,405

-

-

-

-

Kulean Microsystems

USA . 2,947 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,947

-

-

-

-

Corphita

USA . 1,875 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,875

-

-

-

-

UHIMA Technologies

Türkiye . 433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

433

-

-

-

-

Corohmni

South Africa . 157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

157

-

-

-

-

Overview

Capture every moment in stunning clarity with the NOIS1SM0250A-HHC Image Sensor from Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality sensors that guarantee exceptional performance and reliability. Ideal for a wide range of applications, this sensor boasts a high pixel size of 25x25 um, along with a fast master clock of 8 MHz. With a compact square package design and a wide operating temperature range, this sensor is perfect for capturing crisp images in any environment. Experience the value and benefits of superior image quality with the NOIS1SM0250A-HHC Image Sensor by Onsemi.

Feature Benefit Bullets

Pixel Size (um): 25X25

Smaller pixel size allows for higher resolution imaging and better clarity in capturing details.

Master Clock: 8 MHz

High master clock frequency enables fast data processing and image capture.

Body Width: 29.2 inch

Wide body width provides stability and durability to the image sensor, making it suitable for various applications.

Power Supplies (V): 5

Low power supply requirement of 5V ensures energy efficiency and compatibility with different systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology offers high-quality image capture with low power consumption, making it a reliable choice.

Body Height: 17.77 mm

Compact body height allows for easy integration into different devices or systems.

Package Shape or Style: SQUARE

Square package shape provides easy mounting and alignment for installation.

Maximum Operating Temperature: 65 °C

High maximum operating temperature range ensures reliable performance even in challenging environments.

Horizontal Pixel: 512

High horizontal pixel count allows for detailed and high-resolution images.

Output Range: 1-4.25V

Wide output range provides flexibility in signal processing and compatibility with different systems.

Output Type: ANALOG VOLTAGE

Analog voltage output ensures accurate and precise signal transmission for image data.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature range ensures performance in various conditions.

Terminal Finish: Matte Tin (Sn)

Matte tin terminal finish offers corrosion resistance and durability for long-term use.

Housing: ALUMINIUM

Aluminum housing provides lightweight and sturdy protection for the image sensor.

Dynamic Range: 74 dB

High dynamic range allows for capturing a wide range of light intensities and details in the image.

Vertical Pixel: 512

High vertical pixel count ensures detailed image capture in both horizontal and vertical directions.

Body Length/Diameter: 29.2 mm

Compact body length/diameter enables easy integration and installation.

Data Rate: 8 Mbps

High data rate allows for fast and efficient transfer of image data for processing.

Termination Type: SOLDER

Solder termination type ensures secure and reliable connections for signal transmission.

Frame Rate: 29 fps

High frame rate enables smooth and high-quality video recording and imaging.

Array Type: FRAME

Frame array type allows for organized and systematic image capture for processing.

Mounting Feature: SURFACE MOUNT

Surface mounting feature provides easy and secure installation on different surfaces.

Technical Specifications

Image Sensors NOIS1SM0250A-HHC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

29.2 inch

Body Height:

17.77 mm

Body Length/Diameter:

29.2 mm

Data Rate:

8 Mbps

Dynamic Range:

74 dB

Frame Rate:

29 fps

Horizontal Pixel:

512

Housing:

ALUMINIUM

JESD-609 Code:

e3

Master Clock:

8 MHz

Mounting Feature:

Maximum Operating Temperature:

65 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

1

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

25X25

Power Supplies (V):

5

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Terminal Finish:

Matte Tin (Sn)

Termination Type:

SOLDER

Vertical Pixel:

512

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 10