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NOIL1SE0300A-QDC

Onsemi

NOIL1SE0300A-QDC by Onsemi

NOIL1SE0300A-QDC by Onsemi is an Image Sensor with 640x480 resolution, 9.9um pixel size, and 80MHz master clock. Ideal for digital output applications, it operates b/w -40 to 70 °C temperature range with a dynamic range of 61dB.

Median Price

$181.360

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 2,664 parts In-Stock

1+ parts

$169.300

100+ parts

-

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2,664

$169.300

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Rochester

USA . 2,661 parts In-Stock

1+ parts

$181.360

100+ parts

$170.480

1k+ parts

$159.600

10k+ parts

-

2,661

$181.360

$170.480

$159.600

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Verical

USA . 2,595 parts In-Stock

1+ parts

-

100+ parts

$213.100

1k+ parts

$199.500

10k+ parts

-

2,595

-

$213.100

$199.500

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 529 parts In-Stock

1+ parts

$200.564

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529

$200.564

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Vyrian

USA . 1,941 parts In-Stock

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1,941

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Distributors (Availability)

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AZTECH Wire

Italy . 207 parts In-Stock

1+ parts

$16.190

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-

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207

$16.190

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Corohmni

South Africa . 160 parts In-Stock

1+ parts

$178.060

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-

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160

$178.060

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Corphita

USA . 1,660 parts In-Stock

1+ parts

$190.008

100+ parts

-

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1,660

$190.008

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

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3,000

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Continental Prestige Electronics

USA . 2,714 parts In-Stock

1+ parts

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2,714

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TANS Electronics

Latvia . 2,401 parts In-Stock

1+ parts

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2,401

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Problanco Electronics

Mexico . 2,374 parts In-Stock

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2,374

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Kulean Microsystems

USA . 1,404 parts In-Stock

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1,404

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SupplyDigital Components

Austria . 939 parts In-Stock

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939

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UHIMA Technologies

Türkiye . 176 parts In-Stock

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176

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Overview

Elevate your imaging experience with the NOIL1SE0300A-QDC by Onsemi, a cutting-edge image sensor that offers unparalleled quality and performance. Manufactured by Onsemi, a leader in the industry known for their innovative solutions, this sensor is designed to meet the demanding requirements of various applications. With its advanced features and superior capabilities, this product delivers exceptional value, benefits, and advantages to customers seeking top-notch imaging solutions. Upgrade your imaging system today with the NOIL1SE0300A-QDC and experience the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 9.9X9.9

Small pixel size allows for high resolution images to be captured with fine detail.

Maximum Supply Voltage: 2.625 V

Low supply voltage helps in reducing power consumption and extending battery life.

Master Clock: 80 MHz

High master clock speed allows for fast data processing and image capture.

Body Width: 14.22 inch

Compact body width makes it suitable for integration into compact devices.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors provide high image quality, low power consumption, and fast data readout.

Package Shape or Style: SQUARE

Square package shape allows for easier handling and integration into PCB designs.

Array Type: FRAME

Frame array type provides efficient image capturing and processing capabilities.

Frame Rate: 250 fps

High frame rate enables capturing of fast-moving objects and smooth video recording.

Technical Specifications

Image Sensors NOIL1SE0300A-QDC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

14.22 inch

Body Height:

1.55 mm

Body Length/Diameter:

14.22 mm

Dynamic Range:

61 dB

Frame Rate:

250 fps

Horizontal Pixel:

640

Housing:

CERAMIC

JESD-609 Code:

e3

Master Clock:

80 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/2

Output Interface Type:

3-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

9.9X9.9

Power Supplies (V):

2.5

Sensitivity (V/lx.s):

17 V/lx.s

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

2.625 V

Terminal Finish:

Matte Tin (Sn)

Termination Type:

SOLDER

Vertical Pixel:

480

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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