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NOIL1SM0300A-WWC

Onsemi

NOIL1SM0300A-WWC by Onsemi

NOIL1SM0300A-WWC by Onsemi is an Image Sensor with 640x480 resolution, 9.9um pixel size, and 80MHz master clock. It operates b/w -40 to 70 °C and offers a dynamic range of 61dB. Ideal for digital output applications requiring high sensitivity at a frame rate of up to 250fps.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 3,443 parts In-Stock

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Digiode

USA . 1,684 parts In-Stock

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AZTECH Wire

Italy . 457 parts In-Stock

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$9.660

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SupplyDigital Components

Austria . 5,482 parts In-Stock

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TANS Electronics

Latvia . 3,799 parts In-Stock

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Kulean Microsystems

USA . 3,776 parts In-Stock

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UHIMA Technologies

Türkiye . 522 parts In-Stock

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Corohmni

South Africa . 431 parts In-Stock

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Problanco Electronics

Mexico . 375 parts In-Stock

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Corphita

USA . 228 parts In-Stock

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Overview

Unlock the potential of cutting-edge imaging technology with the NOIL1SM0300A-WWC by Onsemi. Crafted with precision and expertise, this image sensor offers unparalleled quality and performance in a compact package. Ideal for a wide range of applications, from security cameras to medical imaging devices, this sensor delivers crisp and clear images with a high dynamic range. Experience the value of superior technology and innovation with the NOIL1SM0300A-WWC - where quality meets excellence.

Feature Benefit Bullets

Pixel Size (um): 9.9X9.9

Provides high resolution images with fine details.

Maximum Supply Voltage: 2.625 V

Operates efficiently within a safe voltage range.

Master Clock: 80 MHz

Ensures fast processing speeds for real-time applications.

Body Width: 14.22 inch

Compact design for easy integration into various systems.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

Utilizes CMOS technology for low power consumption and high performance.

Package Shape or Style: SQUARE

Space-efficient packaging for better utilization of space.

Maximum Operating Temperature: 70 °C

Can function in a wide range of temperatures for versatility.

Horizontal Pixel: 640

High horizontal pixel count for detailed image capture.

Output Type: DIGITAL OUTPUT

Provides digital output signals for easy data processing.

Minimum Operating Temperature: -40 °C

Capable of operating in very low temperatures for diverse applications.

Housing: CERAMIC

Durable ceramic housing for long-lasting performance and protection.

Dynamic Range: 61 dB

High dynamic range for clear image quality in different lighting conditions.

Vertical Pixel: 480

Vertical pixel count for capturing images with good resolution.

Body Length/Diameter: 14.22 mm

Compact size for easy installation and use.

Optical Format (inch): 1/2

Standard optical format for compatibility with various lenses.

Termination Type: SOLDER

Reliable solder termination for secure connections.

Output Interface Type: 3-WIRE INTERFACE

Compatibility with standard 3-wire interfaces for easy integration.

Frame Rate: 250 fps

High frame rate for capturing fast-moving objects with clarity.

Array Type: FRAME

Frame array type for organized image capture.

Sensitivity (V/lx.s): 17 V/lx.s

High sensitivity for capturing images in low-light conditions.

Mounting Feature: SURFACE MOUNT

Easy surface mounting for quick and convenient installation.

Technical Specifications

Image Sensors NOIL1SM0300A-WWC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

14.22 inch

Body Height:

1.55 mm

Body Length/Diameter:

14.22 mm

Dynamic Range:

61 dB

Frame Rate:

250 fps

Horizontal Pixel:

640

Housing:

CERAMIC

Master Clock:

80 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/2

Output Interface Type:

3-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

9.9X9.9

Sensitivity (V/lx.s):

17 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

2.625 V

Termination Type:

SOLDER

Vertical Pixel:

480

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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