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NOIL2SM1300A-GWC

Onsemi

NOIL2SM1300A-GWC by Onsemi

NOIL2SM1300A-GWC by Onsemi is an image sensor with 1280x1024 pixels, 14x14 um pixel size, and a max supply voltage of 2.625V. Ideal for digital output applications, this CMOS sensor operates at temperatures ranging from 0 to 70 °C and offers a frame rate of up to 500 fps.

Median Price

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Lifecycle Status

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Digiode

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Vyrian

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Problanco Electronics

Mexico . 7,912 parts In-Stock

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SupplyDigital Components

Austria . 6,895 parts In-Stock

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TANS Electronics

Latvia . 5,622 parts In-Stock

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Kulean Microsystems

USA . 2,394 parts In-Stock

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Corphita

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UHIMA Technologies

Türkiye . 702 parts In-Stock

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Corohmni

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Overview

Discover the cutting-edge technology of the NOIL2SM1300A-GWC by Onsemi, a top-tier manufacturer in the industry. As a high-quality image sensor, this product offers unparalleled precision and reliability for a wide range of applications. With its advanced features and superior performance, customers can expect crisp images and seamless functionality. Unlock endless possibilities with the NOIL2SM1300A-GWC and experience the true value it brings to your projects. Choose excellence, choose Onsemi.

Feature Benefit Bullets

Pixel Size (um): 14X14

The small pixel size allows for higher resolution images to be captured, providing crisp and clear pictures.

Maximum Supply Voltage: 2.625 V

The higher maximum supply voltage allows for efficient power usage and better performance of the image sensor.

Master Clock: 315 MHz

With a high master clock frequency, the image sensor can operate at a fast speed, capturing images quickly and accurately.

Body Width: 30.5 inch

The compact body width makes this image sensor suitable for applications where space is limited.

Power Supplies (V): 2.5

The power supply voltage of 2.5V ensures that the image sensor operates efficiently while consuming minimal power.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensors are known for their high image quality, low power consumption, and fast readout speeds, making them an excellent choice for various imaging applications.

Body Height: 3.75 mm

The low body height allows for easy integration into different devices and systems without taking up much space.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy mounting and compatibility with different electronic systems.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures the image sensor can operate efficiently even under low power conditions.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature allows the image sensor to perform reliably in various environmental conditions.

Horizontal Pixel: 1280

With a high horizontal pixel count, the image sensor can capture detailed and high-resolution images.

Output Type: DIGITAL OUTPUT

Digital output simplifies data processing and transmission, making it easier to integrate the image sensor into digital systems.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures that the image sensor can function reliably in cold environments.

Housing: CERAMIC

Ceramic housing provides durability and thermal stability, ensuring the image sensor can withstand harsh operating conditions.

Dynamic Range: 57 dB

The high dynamic range allows the image sensor to capture a wide range of light intensities, resulting in high-quality images with excellent contrast.

Vertical Pixel: 1024

With a high vertical pixel count, the image sensor can capture detailed images with a high level of accuracy.

Body Length/Diameter: 35.5 mm

The moderate body length/diameter makes this image sensor suitable for a wide range of applications without compromising on performance.

Optical Format (inch): 1.4

The optical format determines the sensor's field of view, and a value of 1.4 inches ensures a suitable field of view for different imaging requirements.

Termination Type: SOLDER

Solder termination ensures a secure connection and reliable signal transmission, making the image sensor suitable for long-term use.

Output Interface Type: 3-WIRE INTERFACE

The 3-wire interface simplifies connectivity and data transfer, making it easy to integrate the image sensor into various systems and devices.

Frame Rate: 500 fps

With a high frame rate of 500 fps, the image sensor can capture fast-moving objects or scenes without motion blur, making it ideal for applications requiring high-speed imaging.

Array Type: FRAME

The frame array type allows the image sensor to capture images in a frame-by-frame manner, enabling precise image acquisition and processing.

Mounting Feature: SURFACE MOUNT

The surface mount feature enables easy and secure mounting of the image sensor on PCBs or other surfaces, simplifying the integration process.

Technical Specifications

Image Sensors NOIL2SM1300A-GWC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

30.5 inch

Body Height:

3.75 mm

Body Length/Diameter:

35.5 mm

Dynamic Range:

57 dB

Frame Rate:

500 fps

Horizontal Pixel:

1280

Housing:

CERAMIC

Master Clock:

315 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

1.4

Output Interface Type:

3-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

14X14

Power Supplies (V):

2.5

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Termination Type:

SOLDER

Vertical Pixel:

1024

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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