Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NOIL1SE3000A-GDC by Onsemi is an 8x8 um CMOS image sensor with a max supply voltage of 2.25V and master clock at 206 MHz. Ideal for applications requiring high-speed digital output, this rectangular package sensor offers a dynamic range of 80 dB and operates b/w temperatures of 0 to 60 °C.
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The small pixel size allows for high resolution images to be captured, resulting in clear and detailed pictures.
Low maximum supply voltage helps in reducing power consumption and heat generation, making the product energy efficient.
High master clock frequency enables fast data processing and high frame rates, making the product suitable for applications requiring quick image capture.
Compact body width allows for easy integration into various devices without taking up too much space.
Stable power supply voltage ensures reliable and consistent performance of the image sensor.
CMOS sensors are known for their low power consumption and high sensitivity, making the product efficient and capable of capturing clear images in various lighting conditions.
Low body height allows for a slim and sleek design of the product, making it suitable for applications where space is limited.
Rectangular package shape provides easy mounting and alignment of the image sensor in devices, simplifying the integration process.
The minimum supply voltage ensures stable operation of the image sensor under varying voltage conditions, enhancing reliability.
High maximum operating temperature allows for the image sensor to be used in a wide range of environments without the risk of overheating.
High horizontal pixel count results in wide and detailed images, suitable for applications requiring high-resolution image capture.
Digital output simplifies data transmission and processing, making the product compatible with digital systems and devices.
Low minimum operating temperature ensures the image sensor can function in cold environments without performance degradation.
Matte tin terminal finish provides good solderability, ensuring secure and reliable connections for the image sensor.
Low maximum operating current contributes to the energy efficiency of the product, prolonging battery life in portable devices.
Ceramic housing offers durability and protection to the image sensor, making it suitable for rugged environments.
High dynamic range allows the image sensor to capture both bright and dark areas in a scene accurately, resulting in well-balanced and natural-looking images.
High vertical pixel count enhances the image sensor's ability to capture detailed and high-resolution images with good vertical coverage.
The compact body length/diameter ratio allows for easy integration and placement of the image sensor in various devices.
The optical format of 1.2 inches provides a good compromise between sensor size and image quality, making the product versatile for different applications.
Solder termination ensures secure and reliable connections for the image sensor, preventing signal loss or interference.
High frame rate allows for capturing fast-moving objects and scenes with smooth and clear motion, making the product suitable for applications requiring high-speed image capture.
Frame array type provides efficient and organized pixel arrangement, enabling the image sensor to capture detailed and structured images.
Surface mounting feature simplifies the installation process of the image sensor in devices, reducing assembly time and effort.
Image Sensors NOIL1SE3000A-GDC attributes and parameters. Explore more Image Sensors devices from Onsemi
Array Type:
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Body Height:
Body Length/Diameter:
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Frame Rate:
Horizontal Pixel:
Housing:
JESD-609 Code:
Master Clock:
Mounting Feature:
Maximum Operating Current:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Type:
Package Shape or Style:
Pixel Size (um):
Power Supplies (V):
Sensors or Transducers Type:
Sub-Category:
Maximum Supply Voltage:
Minimum Supply Voltage:
Terminal Finish:
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Vertical Pixel:
PCN Obsolescence/ EOL - Mult Dev EOL 01/Oct/2021
PCN Design/Specification - LUP3000 MicroLens Material Chg 13/Nov/2017
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
SMBJ18CA
General Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
M39029/56351
Souriau
CONNECTOR ACCESSORY; MIL Conformity: YES; Contact Gender: FEMALE; Insertion Tools: M81969/14-10; Tool Settings: M22520/2-10; DIN Conformity: NO;
STMicroelectronics
2N7002
Bytesonic Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Position: DUAL; Minimum Operating Temperature: -55 Cel;
LM358MX
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM317T
Analog Devices
ADJUSTABLE POSITIVE SINGLE OUTPUT STANDARD REGULATOR; No. of Terminals: 3; Terminal Form: THROUGH-HOLE; No. of Functions: 1; Package Body Material: PLASTIC/EPOXY; Surface Mount: NO;
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
STM32H753IIK6
STM32H753IIK6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like CAN, ETHERNET, and USB. Ideal for industrial applications requiring high-speed processing and extensive connectivity options.
SS14
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
C0603X104K5RACAUTO
KEMET Corporation
C0603X104K5RACAUTO by KEMET Corp is a ceramic capacitor with capacitance of 0.1 uF and rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate b/w -55 to 125 °C. This SMT package is commonly used in automotive applications due to its AEC-Q200 reference standard.
2N2222A
Crimson Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Baneasa S A
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
IRLML6402TRPBF
International Rectifier
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.3 W; Peak Reflow Temperature (C): 260; Package Style (Meter): SMALL OUTLINE;
RC0603FR-0710KL
Yageo
Yageo's RC0603FR-0710KL is a fixed resistor with 10000 ohm resistance, 1% tolerance, and 0.1 W power dissipation. It operates b/w -55 to 155 °C and is ideal for surface mount applications in electronics requiring precise resistance values.
LM358AN
Texas Instruments
LM358AN by Texas Instruments is an Operational Amplifier with 2 functions. It has a Max Input Offset Voltage of 5000 uV and Nominal Common Mode Reject Ratio of 85 dB. Widely used in voltage-feedback applications due to its high Min Voltage Gain of 15000 and Unity Gain Bandwidth of 1000 kHz.
Rectron
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Package Shape: ROUND;
Diotec Semiconductor Ag
LL4148
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
BSS138-7-F
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Drain Current (ID): .2 A; Minimum DS Breakdown Voltage: 50 V; Operating Mode: ENHANCEMENT MODE;
STM32H753ZIT6
STM32H753ZIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, offering 20-Ch 16-Bit ADC and 2-Ch 12-Bit DAC channels. With a clock frequency of up to 48 MHz, it is ideal for industrial applications requiring CAN, Ethernet, and USB connectivity. This microcontroller operates b/w -40°C to +85°C temperature range.
KAI-02150-CBA-JB-B2-T
Onsemi
Onsemi's KAI-02150-CBA-JB-B2-T is a 5.5x5.5 um pixel size CCD image sensor with 1920H x 1080V resolution, offering a dynamic range of 64 dB. Operating b/w -50 to 70 °C, it requires a power supply of 14.5-15.5 V and is suitable for industrial imaging applications due to its high-quality image capture capabilities.
OV5640-A71A
Omnivision Technologies
Image Sensors;
MT9V023
The Onsemi MT9V023 is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 752 (H) x 480 (V) resolution and a dynamic range of 120 dB. Operating at up to 60 fps with a master clock of 26 MHz, it is ideal for applications requiring high-quality imaging in varying lighting conditions.
NOIP1SE2000A-LTI
NOIP1SE2000A-LTI by Onsemi features 4.8X4.8 um pixel size, 360 MHz master clock, and 1920x1200 resolution. Ideal for image sensing applications with a spectral response of 400-1000 nm and frame rate of 230 fps.
AR0135CS2C19SUD20
IMAGE SENSOR,CMOS; Optical Format (inch): 1/3; Additional Features: GLOBAL SHUTTER; Array Type: FRAME;
TSL1402R
Ams Ag
TSL1402R by Ams Ag is an image sensor with a pixel size of 63.5X55.5 um and output range of 1.60-2.40V, suitable for applications requiring a dynamic range of 72 dB. With a spectral response of 300-1100 nm, this CCD sensor operates b/w temperatures of 0 to 70 °C, making it ideal for various imaging solutions.
AR0144CSSM20SUKA0-CRBR
The Onsemi AR0144CSSM20SUKA0-CRBR is a 1/4 inch CMOS image sensor with 1280x800 resolution and 3x3 um pixel size. It features a 2-wire interface, solder termination, and operates at 60 fps. Ideal for applications requiring high-quality imaging in compact devices like smartphones and tablets.
KAI-0340-CBA-CB-AA-S
IMAGE SENSOR,CCD;
AR0238CSSC12SHRA0-DP1
Onsemi's AR0238CSSC12SHRA0-DP1 is a 3x3 um CMOS image sensor with 1928H x 1088V pixels, offering a dynamic range of 96 dB. Operating at 48 MHz master clock, it has a digital current output interface and supports frame rates up to 60 fps. Ideal for applications requiring high-resolution imaging in automotive, surveillance, and industrial sectors.
MT9V128IA3XTC-TR
MT9V128IA3XTC-TR by Onsemi is a 5.6x5.6 um CMOS image sensor with 680H x 512V pixels, offering a dynamic range of 74.8 dB and operating at up to 105°C. Ideal for applications requiring a digital voltage output interface, such as frame arrays in need of high-speed imaging at 60 fps.
KAF-8300-AXC-CD-AA
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON; Minimum Operating Temperature: -10 Cel;
KAI-02150-AAA-JP-BA
Onsemi's KAI-02150-AAA-JP-BA is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. Operating b/w -50 to 70°C, it requires 14.5-15.5V supply voltage and features through-hole mounting. Ideal for high-resolution imaging applications in various industries.
AR0132AT6C00XPEA0-DPBR1
Onsemi's AR0132AT6C00XPEA0-DPBR1 image sensor features 3.75um pixel size, 50MHz master clock, and 115dB dynamic range. Ideal for applications requiring high-resolution imaging with a frame rate of 60fps in a compact square package.
KAE-01093-FBB-SD-EE
The Onsemi KAE-01093-FBB-SD-EE is an image sensor with 1024x1024 pixels, 9x9 um pixel size, and 95 dB dynamic range. It operates b/w -50 to 60 °C and has a data rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
MT9V131C12STC-DR
MT9V131C12STC-DR by Onsemi is a 640x480 CMOS image sensor with 5.60um pixel size and 27 MHz master clock. Ideal for digital cameras, it offers a dynamic range of 60 dB and operates at temperatures ranging from -20 to 70 °C.
KAF-18500-NXA-JH-AA-08
The Onsemi KAF-18500-NXA-JH-AA-08 is a CCD image sensor with 6.8X6.8 um pixel size, offering a dynamic range of 68.1 dB and 5270 horizontal pixels for high-quality imaging applications. With a max supply voltage of 15.5 V and operating temperature range from 0 to 60 °C, it is suitable for industrial cameras and scientific imaging systems requiring precise data capture at up to 24 Mbps data rate.
KAI-47051-QXA-JD-AE
KAI-47051-QXA-JD-AE by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 66 dB dynamic range. Ideal for applications requiring high-resolution imaging such as industrial machine vision systems or scientific cameras due to its 8856 (H) x 5280 (V) pixel array and INTERLINE design.
ASX340AT2C00XPED0-DPBR1
Onsemi's ASX340AT2C00XPED0-DPBR1 is a 5600x5600 pixel CMOS image sensor with 27 MHz master clock. It operates b/w -40 to 85 °C, offering a dynamic range of 87 dB. Ideal for applications requiring high-resolution imaging and fast frame rates.
KAI-08052-FBA-JD-BA
KAI-08052-FBA-JD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 3296 horizontal pixels, and 2472 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
MT9M021IA3XTMZ-TPBR
MT9M021IA3XTMZ-TPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 50MHz master clock. Ideal for applications requiring high-quality digital imaging at up to 60fps, it operates b/w -30 to 70°C with a dynamic range of 64dB.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NOIL1SM0300A-QDC
NOIL1SM0300A-QDC by Onsemi is an Image Sensor with 640x480 resolution, 9.9um pixel size, and 80MHz master clock. Ideal for digital output applications, it operates b/w -40 to 70°C temperature range and offers a dynamic range of 61dB.
NOIL2SM1300A-GDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Output Interface Type: 3-WIRE INTERFACE; Pixel Size (um): 14X14;
NOIL1SC4000A-GDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: SQUARE; Body Width: 42 inch; Power Supplies (V): 2.5;
NOIL1SE0300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: SQUARE; Body Length/Diameter: 14.22 mm; Frame Rate: 250 fps;
NOIL1SM0300A-WWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: SQUARE; Horizontal Pixel: 640; Minimum Operating Temperature: -40 Cel;
NOIL1SM4000A-GDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: SQUARE; Power Supplies (V): 2.5; Dynamic Range: 90 dB;
NOIL1SN3000A-GDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Dynamic Range: 80 dB; Master Clock: 206 MHz;
NOIL2SC1300A-GDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Optical Format (inch): 1.4; Frame Rate: 500 fps;
NOIL2SM1300A-GWC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL OUTPUT; Package Shape or Style: RECTANGULAR; Output Interface Type: 3-WIRE INTERFACE; Array Type: FRAME;
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