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NOIL2SC1300A-GDC

Onsemi

NOIL2SC1300A-GDC by Onsemi

NOIL2SC1300A-GDC by Onsemi is a CMOS image sensor with 1280x1024 pixels, 14x14 um pixel size, and 315 MHz master clock. It operates at 2.375-2.625 V, has a dynamic range of 57 dB, and offers digital output via a 3-wire interface. Ideal for high-speed imaging applications requiring a frame rate of up to 500 fps.

Median Price

$5,297.720

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12 parts In-Stock

1+ parts

$3,245.440

100+ parts

$3,180.840

1k+ parts

$3,115.930

10k+ parts

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12

$3,245.440

$3,180.840

$3,115.930

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Chip1Stop

Japan . 5 parts In-Stock

1+ parts

$7,350.000

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5

$7,350.000

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Flip Electronics (Authorized)

USA . 12 parts In-Stock

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12

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Distributors (In-Stock)

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Digiode

USA . 280 parts In-Stock

1+ parts

$3,083.168

100+ parts

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280

$3,083.168

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Vyrian

USA . 5,152 parts In-Stock

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5,152

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Flip Electronics

USA . 12 parts In-Stock

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12

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Distributors (Availability)

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AZTECH Wire

Italy . 418 parts In-Stock

1+ parts

$8.590

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418

$8.590

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Corohmni

South Africa . 144 parts In-Stock

1+ parts

$1,913.590

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144

$1,913.590

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Corphita

USA . 434 parts In-Stock

1+ parts

$2,920.896

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434

$2,920.896

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TANS Electronics

Latvia . 7,152 parts In-Stock

1+ parts

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7,152

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SupplyDigital Components

Austria . 7,130 parts In-Stock

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7,130

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Kulean Microsystems

USA . 4,939 parts In-Stock

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4,939

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UHIMA Technologies

Türkiye . 551 parts In-Stock

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551

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Problanco Electronics

Mexico . 163 parts In-Stock

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163

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Perfect Parts

USA . 49 parts In-Stock

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Overview

Elevate your imaging capabilities with the NOIL2SC1300A-GDC by Onsemi. As a leading manufacturer of image sensors, Onsemi delivers top-notch quality and innovation in every product. The NOIL2SC1300A-GDC is designed to provide superior performance in a compact package, making it ideal for a wide range of applications. Experience stunning image clarity and precision with this cutting-edge sensor, offering customers unmatched value and benefits. Upgrade your technology with the NOIL2SC1300A-GDC and unlock endless possibilities in imaging.

Feature Benefit Bullets

Pixel Size (um): 14X14

The small pixel size allows for high resolution images to be captured, making this image sensor ideal for applications where detailed images are needed.

Maximum Supply Voltage: 2.625 V

The higher maximum supply voltage provides flexibility in powering the image sensor and ensures stable operation under varying voltage conditions.

Master Clock: 315 MHz

The high master clock frequency enables fast data readout and processing, making this image sensor suitable for applications requiring high-speed image capture.

Body Width: 30.5 inch

The compact body width allows for easy integration into small devices or systems, making this image sensor versatile for a variety of applications.

Power Supplies (V): 2.5

The stable power supply of 2.5V ensures reliable performance of the image sensor and consistent image quality output.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

The CMOS sensor technology offers low power consumption, high sensitivity, and fast readout speeds, making this image sensor a top choice for various imaging applications.

Body Height: 3.75 mm

The slim body height allows for minimal space requirements and easy integration, making this image sensor suitable for compact devices and systems.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides a standard form factor for easy mounting and integration, making this image sensor compatible with industry-standard PCB layouts.

Minimum Supply Voltage: 2.375 V

The low minimum supply voltage ensures energy efficiency and extends battery life in portable devices using this image sensor.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in harsh environmental conditions, making this image sensor suitable for outdoor or industrial applications.

Horizontal Pixel: 1280

The high horizontal pixel count provides detailed image resolution and clarity, making this image sensor ideal for applications requiring high-definition imaging.

Output Type: DIGITAL OUTPUT

The digital output simplifies data processing and communication with external devices, ensuring easy integration and compatibility with digital imaging systems.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature range ensures reliable performance even in cold environments, making this image sensor suitable for a wide range of operating conditions.

Terminal Finish: Matte Tin (Sn)

The matte tin terminal finish provides good solderability and corrosion resistance, ensuring secure connections and long-term reliability in the image sensor's operation.

Housing: CERAMIC

The ceramic housing offers excellent thermal stability and durability, providing protection to internal components and ensuring long-term performance of the image sensor.

Dynamic Range: 57 dB

The high dynamic range allows for capturing a wide range of light intensities in a scene, ensuring accurate and detailed image output in high-contrast environments.

Vertical Pixel: 1024

The high vertical pixel count contributes to the overall image resolution and quality, making this image sensor ideal for applications requiring vertical detail in imaging.

Body Length/Diameter: 35.5 mm

The compact body length/diameter provides a small footprint for easy integration and space-saving design, making this image sensor suitable for compact devices and systems.

Optical Format (inch): 1.4

The optical format of 1.4 inches provides compatibility with standard optical components and lenses, ensuring easy integration into imaging systems and devices.

Termination Type: SOLDER

The solder termination type ensures secure and reliable electrical connections, providing stable performance and long-term reliability of the image sensor.

Output Interface Type: 3-WIRE INTERFACE

The 3-wire interface simplifies connectivity with external devices and systems, enabling easy data transmission and control of the image sensor in various applications.

Frame Rate: 500 fps

The high frame rate of 500 frames per second allows for capturing fast-moving objects or scenes with smooth motion blur, making this image sensor suitable for high-speed imaging applications.

Array Type: FRAME

The frame array type allows for capturing complete frames of images, ensuring accurate and consistent image output in various imaging applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature enables easy and secure attachment to PCBs or electronic assemblies, ensuring quick and reliable integration of the image sensor into various devices and systems.

Technical Specifications

Image Sensors NOIL2SC1300A-GDC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

30.5 inch

Body Height:

3.75 mm

Body Length/Diameter:

35.5 mm

Dynamic Range:

57 dB

Frame Rate:

500 fps

Horizontal Pixel:

1280

Housing:

CERAMIC

JESD-609 Code:

e3

Master Clock:

315 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

1.4

Output Interface Type:

3-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

14X14

Power Supplies (V):

2.5

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Terminal Finish:

Matte Tin (Sn)

Termination Type:

SOLDER

Vertical Pixel:

1024

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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