Loading...

MT9V032C12STC-DP

Onsemi

MT9V032C12STC-DP by Onsemi

Onsemi's MT9V032C12STC-DP is a 1/3 inch CMOS image sensor with 6x6 um pixel size. It operates at a max supply voltage of 3.6 V and has a master clock of 26.6 MHz. Ideal for applications requiring high-resolution imaging in devices such as cameras, drones, and surveillance systems due to its compact square package and digital current output interface.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,888 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,888

-

-

-

-

Digiode

USA . 1,101 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,101

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 925 parts In-Stock

1+ parts

$19.060

100+ parts

-

1k+ parts

-

10k+ parts

-

925

$19.060

-

-

-

TANS Electronics

Latvia . 8,134 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,134

-

-

-

-

Kulean Microsystems

USA . 7,619 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,619

-

-

-

-

SupplyDigital Components

Austria . 5,833 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,833

-

-

-

-

Problanco Electronics

Mexico . 5,572 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,572

-

-

-

-

Perfect Parts

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,240

-

-

-

-

Corphita

USA . 2,011 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,011

-

-

-

-

S.R.D Solutions

India . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Corohmni

South Africa . 252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

252

-

-

-

-

Futuretech Components

Singapore . 250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

250

-

-

-

-

UHIMA Technologies

Türkiye . 217 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

217

-

-

-

-

Overview

Enhance your imaging solutions with the Onsemi MT9V032C12STC-DP Image Sensor. Manufactured by Onsemi, known for their high-quality products, this sensor offers exceptional value and performance. Ideal for a wide range of applications, this sensor boasts a compact design and impressive specifications, making it perfect for capturing detailed images with precision. Upgrade your imaging systems with this advanced sensor and experience the unparalleled quality and reliability that Onsemi is renowned for.

Feature Benefit Bullets

Pixel Size (um): 6X6

Smaller pixel size allows for higher resolution image capture, making this image sensor suitable for applications where detailed images are required.

Maximum Supply Voltage: 3.6 V

With a higher maximum supply voltage, this image sensor can operate effectively in a wide range of voltage environments, increasing its versatility.

Master Clock: 26.6 MHz

A high master clock frequency ensures fast data processing and image capture, making this image sensor ideal for applications requiring real-time image analysis.

Body Width: 11.43 inch

The compact body width of this image sensor allows for easy integration into various devices, making it suitable for space-constrained applications.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

Being a CMOS image sensor, it offers low power consumption and high noise immunity, making it a reliable choice for long-term use.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies connectivity and communication with other devices, enhancing the overall usability of this image sensor.

Technical Specifications

Image Sensors MT9V032C12STC-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER, IT ALSO HAVE DYNAMIC RANGE 80 DB-100 DB IN HDR MODE

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

2.3 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

54.4 dB

Frame Rate:

60 fps

Horizontal Pixel:

752

Housing:

CERAMIC

Master Clock:

26.6 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

480

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20