Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NOIV2SN2000A-QDC by Onsemi is a 1920x1200 CMOS image sensor with 4.80x4.80 um pixel size, operating at 62 MHz clock speed. It has a wide temperature range of 0-70 °C and low power consumption of 10 mA, suitable for high-resolution imaging applications in industrial and automotive sectors.
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Higher pixel size results in better image quality and sensitivity, making this image sensor a good choice for capturing detailed images.
Operates at a low maximum supply voltage, helping to consume less power and extend the battery life of devices.
High master clock frequency allows for fast data processing and efficient operation of the image sensor.
Compact body width enables easy integration into various devices and systems.
Stable power supply voltage ensures reliable performance of the image sensor in different operating conditions.
CMOS image sensor technology offers high image quality, low power consumption, and fast readout speeds, making it a popular choice in modern devices.
Low body height allows for compact device designs and easy integration into slim devices.
Square package shape provides good alignment and positioning during assembly, ensuring proper functioning of the image sensor.
Even lower minimum supply voltage helps in reducing power consumption and improving overall energy efficiency of the image sensor.
Withstands high operating temperatures, making it suitable for use in various environments and applications.
High horizontal pixel count results in detailed and high-resolution images, making this image sensor ideal for applications requiring fine image quality.
Capable of operating at low temperatures, allowing for use in cold climates or refrigerated environments.
Low operating current consumption helps in conserving power and extending the operational life of the image sensor.
Ceramic housing offers durability, thermal stability, and protection to the sensitive components of the image sensor, ensuring long-term reliability.
Good dynamic range allows the image sensor to capture both bright and dark areas accurately, resulting in well-exposed images with details in highlights and shadows.
Adequate vertical pixel count provides balanced image resolution, contributing to overall image clarity and detail.
Compact body length/diameter facilitates easy installation and integration into devices, particularly those with space constraints.
Fits standard 2/3-inch optical formats and compatible with a wide range of lenses, allowing for versatility in capturing different types of images.
High data rate facilitates fast transmission of image data, enabling quick processing and efficient transfer of images to other devices or systems.
Solder termination provides reliable electrical connections and secure attachment of the image sensor to circuit boards, ensuring stable performance.
4-wire interface offers a simple and efficient connection method, making it easy to integrate the image sensor into different systems and devices.
Decent frame rate allows for smooth and fluid video recording or image capture, suitable for applications requiring real-time imaging.
Frame array type offers organized and structured pixel arrangement, contributing to improved image quality and clarity.
Surface mount capability simplifies the installation process and ensures secure attachment to circuit boards, enhancing the overall reliability of the image sensor.
Image Sensors NOIV2SN2000A-QDC attributes and parameters. Explore more Image Sensors devices from Onsemi
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PCN Obsolescence/ EOL - Mult Dev EOL 18/Oct/2018
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
LL4148
TDK
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); No. of Phases: 1; No. of Elements: 1; Maximum Output Current: .2 A;
LM358D-T
Philips Semiconductors
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
FDV303N
Onsemi
FDV303N by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage, 0.68A Drain Current, and 0.45 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at temperatures ranging from -55 to 150°C. Package style is SMALL OUTLINE with GULL WING terminals for surface mount assembly.
NXP Semiconductors
LM358D-T by NXP Semiconductors is a dual operational amplifier with 70dB CMRR, 1000kHz unity gain bandwidth, and 9000uV max input offset voltage. Widely used in commercial applications due to its small outline package and low bias current of 0.5uA.
SS14
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Jinan Jingheng Electronics
Sangdest Microelectronics (Nanjing)
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Changzhou Galaxy Century Microelectronics
BAV99
Plessey Semiconductors Discrete Components Div
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Transistor Application: SWITCHING; JESD-609 Code: e3;
LM358M
LM107H
Advanced Micro Devices
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Bias Current (IIB) @25C: .075 uA;
87832-1420
Molex
87832-1420 by Molex is a 14-contact board connector with 0.079" pitch, suitable for commercial applications. It features matte tin over nickel finish, glass-filled polyamide insulator, and polarization key for easy assembly. Withstanding voltage of 1400VAC and operating temperature range from -55 to 105°C make it reliable for various electronic devices.
SMBJ18CA
Weitron Technology
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
STM32F103C8T6
STMicroelectronics
STM32F103C8T6 by STMicroelectronics is a 32-bit microcontroller with 48 terminals, operating at up to 16 MHz. It features 10-Ch 12-Bit ADC channels and 7 DMA channels, suitable for industrial applications requiring low power consumption and high-speed connectivity via CAN, I2C(2), SPI(2), USART(3), USB.
Diotec Semiconductor Ag
LM555CM
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Forward International Electronics
RECTIFIER DIODE; Surface Mount: YES; Maximum Operating Temperature: 150 Cel; No. of Elements: 1; No. of Phases: 1; Maximum Output Current: 1 A;
KAI-2020-ABA-CD-AE
KAI-2020-ABA-CD-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It has a dynamic range of 60 dB and outputs analog voltage data at a rate of 40 Mbps. This rectangular CCD sensor is suitable for applications requiring high-quality imaging in industrial or scientific settings.
MT9V126IA3XTC-DR
MT9V126IA3XTC-DR by Onsemi is an image sensor with 5.60x5.60 um pixel size, 27 MHz master clock, and 1/4 inch optical format. It operates b/w -40 to 105 °C and has a dynamic range of 74.6 dB. Ideal for applications requiring a digital voltage output interface, such as frame arrays in cameras with a frame rate of 30 fps.
AR0138AT3B00XUEA0-DRBR
Onsemi's AR0138AT3B00XUEA0-DRBR is a 1/2.6" CMOS image sensor with 1288x968 resolution, 4.2um pixel size, and 69fps frame rate. Ideal for surface mount applications in cameras, this sensor features a solder termination type and 2-wire interface for seamless integration.
KAF-09000-ABA-DD-AE
The Onsemi KAF-09000-ABA-DD-AE is a 3056x3056 pixel CCD image sensor with 12x12 um pixel size. It operates b/w -60 to 60 °C and offers a dynamic range of 84 dB. Ideal for high-resolution imaging applications, it features a spectral response of 300-1100 nm and data rate of 10 Mbps.
AR0330CS1C12SPKA0-CP
The Onsemi AR0330CS1C12SPKA0-CP is a 1/3 inch CMOS image sensor with 2304x1296 pixels. It operates at 27 MHz with a dynamic range of 69.5 dB and outputs digital voltage from 0.40-1.40V. Ideal for applications requiring high-resolution imaging and fast frame rates up to 60 fps, it features a compact square package suitable for surface mounting.
KAC-00401-CBC-LB-A0
Onsemi's KAC-00401-CBC-LB-A0 Image Sensor features 6.7X6.7um pixel size, 3.3V power supply, and operates b/w -40 to 105 °C. With 768x488 pixels, it is ideal for surface mount applications in various imaging systems.
KAI-08050-CBA-JB-AE
KAI-08050-CBA-JB-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. Its rectangular package style and solder termination make it suitable for industrial machine vision applications requiring high-resolution imaging in a 4/3 optical format.
KAI-04050-ABA-JD-AE
KAI-04050-ABA-JD-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 2336 (H) x 1752 (V) pixels, offering a dynamic range of 64 dB. It features an interline array type and solder termination, suitable for applications in industrial imaging systems and machine vision cameras.
KAI-50140-AXB-JD-AE
KAI-50140-AXB-JD-AE by Onsemi is an image sensor with 4.5x4.5 um pixel size, 60 MHz master clock, and 10440 horizontal pixels. It operates b/w -50 to 60 °C and has a dynamic range of 60 dB. Ideal for digital output applications in various industries due to its high performance and reliability.
NOM03A6-AY17G
IMAGE SENSOR,CMOS;
TC241-10
Texas Instruments
TC241-10 by Texas Instruments is an image sensor with 754x244 pixels, pixel size of 11.5X27 um, and operates at temperatures from -10 to 45 °C. It requires a power supply of 12V and features THROUGH HOLE MOUNTing. Ideal for applications requiring high-resolution imaging in various environments.
KAI-43140-AXA-JP-B1
Onsemi's KAI-43140-AXA-JP-B1 is a 4.5x4.5 um CCD image sensor with 8040 (H) x 5360 (V) pixels, offering a dynamic range of 60 dB. It operates b/w -50 to 70 °C and requires a supply voltage of 14.5-15.5 V, making it suitable for high-resolution imaging applications in industrial and scientific fields.
KAI-4011M
The Onsemi KAI-4011M is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 60dB dynamic range. It operates at a supply voltage range of 14.5V to 15.5V and outputs analog voltage signals. Ideal for applications requiring high-resolution imaging with precise color reproduction and low noise levels.
AMIS-720442-A
Image Sensors; Power Supplies (V): 5; Vertical Pixel: 1; Horizontal Pixel: 128; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 50 Cel;
KAI-08670-AXA-JD-B1
Onsemi's KAI-08670-AXA-JD-B1 image sensor features 7.4x7.4 um pixel size, 40 MHz master clock, and 3600 horizontal pixels. Ideal for applications requiring high-quality imaging with a max supply voltage of 15.5 V and operating temperature range from -50 to 70 °C.
KLI-8023-RAA-ED-AA
KLI-8023-RAA-ED-AA by Onsemi is an Image Sensor with 9x9 um pixel size, 8002 horizontal pixels, and 87 dB dynamic range. Ideal for applications requiring a CCD image sensor with a spectral response of 350-850 nm, operating at temperatures from 0 to 70 °C.
AR0234CSSM00SUKA0-CP1
The Onsemi AR0234CSSM00SUKA0-CP1 is a CMOS image sensor with 1920x1200 resolution, 3x3 um pixel size, and 71.4 dB dynamic range. It operates at -40 to 85 °C and has a frame rate of 120 fps. Ideal for applications requiring high-quality digital imaging in automotive or surveillance systems.
NOIP1SE2000A-QTI
NOIP1SE2000A-QTI by Onsemi is a 1920x1200 CMOS image sensor with 4.8x4.8 um pixel size, offering a dynamic range of 60 dB and sensitivity of 7.5 V/lx.s. It operates b/w -40 to 85 °C, has a max supply voltage of 1.9 V, and supports a frame rate of up to 230 fps. Ideal for high-resolution imaging applications requiring fast capture speeds and precise light sensitivity.
NOIX2SN9400B-LTI1
NOIX2SN9400B-LTI1 by Onsemi is an Image Sensor with 3.2X3.2 um pixel size, 32.4 MHz master clock, and 3072 horizontal pixels. It operates b/w -40 to 85 °C and outputs digital voltage via I2C/SPI interface. Ideal for applications requiring high-resolution imaging at a fast frame rate like surveillance systems or industrial cameras.
KAI-04050-CBA-JD-BA
KAI-04050-CBA-JD-BA by Onsemi is an image sensor with 5.5x5.5um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates at temperatures from -50 to 70 °C and has a dynamic range of 64 dB. Ideal for applications requiring high-quality imaging in various environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
NOIV1SN025KA-GDC
NOIV1SN025KA-GDC by Onsemi is a CMOS image sensor with 4.50x4.50 um pixel size, 310 MHz master clock, and 56.2 dB dynamic range. It is used in applications requiring high-resolution imaging at 53 fps, such as surveillance cameras and industrial machine vision systems.
NOIV1SE1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Power Supplies (V): 3.3; Minimum Supply Voltage: 1.6 V; Maximum Operating Current: 75 mA;
NOIV1SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 75 mA; Dynamic Range: 53 dB;
NOIV2SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Height: 2.2 mm; Array Type: FRAME; Body Length/Diameter: 14.22 mm;
NOIV1SN2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC; Optical Format (inch): 2/3;
NOIV1SN025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Spectral Response (nm): 400-1000; Body Length/Diameter: 43.1 mm;
NOIV1SE2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Array Type: FRAME; Maximum Operating Temperature: 70 Cel; Output Interface Type: 4-WIRE INTERFACE;
NOIV1SN1300A-XXC
IMAGE SENSOR,CMOS; Package Shape or Style: SQUARE; Horizontal Pixel: 1280; Dynamic Range: 53 dB; Additional Features: GLOBAL SHUTTER, ROLLING SHUTTER; Body Length/Diameter: 10.617 mm;
NOIV1SE5000A-QDC
NOIV1SE5000A-QDC by Onsemi is an image sensor with 4.80x4.80 um pixel size, 62 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring high-resolution imaging at a max supply voltage of 2V and operating temperature up to 70°C.
NOIV1SE012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Vertical Pixel: 3072;
NOIV1SE025KA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 400-1000; Minimum Operating Temperature: -40 Cel; Array Type: FRAME;
NOIV1SN012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC;
NOIV1SN025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: FRAME; Maximum Operating Temperature: 85 Cel; Housing: CERAMIC;
NOIV1SN012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 340 MHz; Maximum Supply Voltage: 2 V;
NOIV1SE016KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Output Interface Type: 4-WIRE INTERFACE; Vertical Pixel: 4096;
NOIV1SE025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Array Type: FRAME; Maximum Supply Voltage: 2 V;
NOIV1SN016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Spectral Response (nm): 400-1000;
NOIV1SE012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Master Clock: 340 MHz;
NOIV1SE016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 915 mA; Body Length/Diameter: 43.1 mm;
NOIV1SE025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 2 V; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 775 mA;
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