Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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NOIV2SN2000A-QDC by Onsemi is a 1920x1200 CMOS image sensor with 4.80x4.80 um pixel size, operating at 62 MHz clock speed. It has a wide temperature range of 0-70 °C and low power consumption of 10 mA, suitable for high-resolution imaging applications in industrial and automotive sectors.
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Higher pixel size results in better image quality and sensitivity, making this image sensor a good choice for capturing detailed images.
Operates at a low maximum supply voltage, helping to consume less power and extend the battery life of devices.
High master clock frequency allows for fast data processing and efficient operation of the image sensor.
Compact body width enables easy integration into various devices and systems.
Stable power supply voltage ensures reliable performance of the image sensor in different operating conditions.
CMOS image sensor technology offers high image quality, low power consumption, and fast readout speeds, making it a popular choice in modern devices.
Low body height allows for compact device designs and easy integration into slim devices.
Square package shape provides good alignment and positioning during assembly, ensuring proper functioning of the image sensor.
Even lower minimum supply voltage helps in reducing power consumption and improving overall energy efficiency of the image sensor.
Withstands high operating temperatures, making it suitable for use in various environments and applications.
High horizontal pixel count results in detailed and high-resolution images, making this image sensor ideal for applications requiring fine image quality.
Capable of operating at low temperatures, allowing for use in cold climates or refrigerated environments.
Low operating current consumption helps in conserving power and extending the operational life of the image sensor.
Ceramic housing offers durability, thermal stability, and protection to the sensitive components of the image sensor, ensuring long-term reliability.
Good dynamic range allows the image sensor to capture both bright and dark areas accurately, resulting in well-exposed images with details in highlights and shadows.
Adequate vertical pixel count provides balanced image resolution, contributing to overall image clarity and detail.
Compact body length/diameter facilitates easy installation and integration into devices, particularly those with space constraints.
Fits standard 2/3-inch optical formats and compatible with a wide range of lenses, allowing for versatility in capturing different types of images.
High data rate facilitates fast transmission of image data, enabling quick processing and efficient transfer of images to other devices or systems.
Solder termination provides reliable electrical connections and secure attachment of the image sensor to circuit boards, ensuring stable performance.
4-wire interface offers a simple and efficient connection method, making it easy to integrate the image sensor into different systems and devices.
Decent frame rate allows for smooth and fluid video recording or image capture, suitable for applications requiring real-time imaging.
Frame array type offers organized and structured pixel arrangement, contributing to improved image quality and clarity.
Surface mount capability simplifies the installation process and ensures secure attachment to circuit boards, enhancing the overall reliability of the image sensor.
Image Sensors NOIV2SN2000A-QDC attributes and parameters. Explore more Image Sensors devices from Onsemi
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PCN Obsolescence/ EOL - Mult Dev EOL 18/Oct/2018
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148WS
Continental Device India
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
ULN2803A
Texas Instruments
ULN2803A by Texas Instruments is a peripheral driver with 8 functions. It has a max supply voltage of 3V and can operate in temperatures ranging from -40 to 85°C. This IC is commonly used as a buffer or inverter based peripheral driver for various applications.
SDR0604-101KL
Bourns
SDR0604-101KL by Bourns is a surface mount fixed inductor with a nominal inductance of 100 uH. It is a general purpose inductor suitable for power applications, with a max rated current of 0.52 A and a self-resonance frequency of 9 MHz.
ERJU06F10R0V
Panasonic
ERJU06F10R0V by Panasonic is an 0805 size SMT fixed resistor with a resistance of 10 ohm and 1% tolerance. It operates b/w -55 to 155 °C, suitable for AEC-Q200 standards in automotive applications due to its high temperature coefficient of 100 ppm/°C. With a max operating voltage of 150 V and power dissipation of 0.125 W, it is ideal for surface mounting type.
BAV99
Formosa Microsemi
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
2N2222A
Boca Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148W-T
Rectron
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Bytesonic Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
SMBJ18CA
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Panjit International
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
MBR0520LT1G
Onsemi
MBR0520LT1G by Onsemi is a Schottky rectifier diode with a max forward voltage of 0.385V and output current of 0.5A. It operates b/w -65°C to 125°C, has a peak reflow temperature of 260°C, and a repetitive peak reverse voltage of 20V. This diode is ideal for applications requiring high-speed switching in compact electronic devices.
BSS138
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
KSZ9031RNXIA
Microchip Technology
KSZ9031RNXIA by Microchip is a 48-terminal Ethernet transceiver with data rate of 1000 Mbps. Operating temperature range from -40 to 85°C makes it suitable for industrial applications. This square-shaped chip carrier has a very thin profile and matte tin finish, ideal for network interfaces.
FDLL4148
FDLL4148 by Onsemi is a single rectifier diode with a max reverse recovery time of 0.004 us. With a max forward voltage of 1V and output current of 0.2A, it is ideal for applications requiring fast switching speeds in electronic circuits. The diode's glass package body material and isolated case connection make it suitable for surface mount designs operating at temperatures up to 175°C.
STM32H743BIT6
STMicroelectronics
STM32H743BIT6 by STMicroelectronics is a 32-bit microcontroller with Cortex-M7 CPU, 208 terminals, and 1085440 bytes of RAM. It features 2 DAC channels, 32 ADC channels, and operates at a max clock frequency of 48 MHz. Ideal for industrial applications requiring high-speed processing and extensive peripheral connectivity.
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Kec
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Transistor Application: SWITCHING; Package Body Material: PLASTIC/EPOXY;
M39029/58-360
Defense Logistics Agency
CONNECTOR ACCESSORY; Contact Type: CRIMP REAR RELEASE; Mating Contacts: M39029/56-348, M39029/57-354; Insertion Tool Sources: MILITARY; Contact Gender: MALE; Alternate Contact Sources: MILITARY;
AT90CAN128-16AUR
AT90CAN128-16AUR by Microchip: 16 MHz clock, 8-bit data RAM, and 131072 ROM words. Ideal for industrial applications with CAN, SPI, TWI connectivity and low power mode. Contains 4 timers, 8 ADC channels, and supports up to 10-bit analog to digital conversion.
11KAI-04070-CBA-JD-BA
The Onsemi 11KAI-04070-CBA-JD-BA is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 70.5dB dynamic range. It operates b/w -50 to 70 °C, suitable for industrial imaging applications requiring high-resolution and low-light performance. The rectangular package style with through-hole mounting makes it easy to integrate into various systems.
KAF-3200-ABA-CD-B2
The Onsemi KAF-3200-ABA-CD-B2 is a CCD image sensor with 6.8X6.8 um pixel size, offering 2184 horizontal and 1472 vertical pixels. It operates b/w -60 to 60 °C, has a dynamic range of 78 dB, and spectral response of 200-1100 nm. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
AR0237CSSC00PRA0-DR
Onsemi's AR0237CSSC00PRA0-DR is a 1/2.7 inch CMOS image sensor with 1928x1088 resolution, 3x3 um pixel size, and 96 dB dynamic range. It operates at -30 to 85 °C, with a max supply voltage of 1.95V and output range of 0.4-1.5V. Ideal for applications requiring high-quality digital imaging at up to 60 fps frame rate.
AR0134CSSM00SUEA0-DRBR
Onsemi's AR0134CSSM00SUEA0-DRBR is a 1/3" CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. Ideal for applications requiring high-speed digital current output at up to 60fps frame rate, such as surveillance cameras and industrial machine vision systems.
KAI-0330-ABA-CB-AA
The Onsemi KAI-0330-ABA-CB-AA is a 9x9 um CCD image sensor with 648 (H) x 484 (V) pixels. It operates at temperatures from -50 to 70 °C and has a dynamic range of 57 dB. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
MT9P031I12STM-DP
Onsemi's MT9P031I12STM-DP is a 2.2x2.2um CMOS image sensor with 2592Hx1944V pixels, offering a dynamic range of 70.1dB and operating at temperatures from -30 to 70°C. It has a digital voltage output interface, operates on 1.7-1.9V supply voltage, and is suitable for frame array applications in various industries like surveillance and automotive systems.
KAC-1310
The Onsemi KAC-1310 is a CMOS image sensor with 1280x1024 pixels, 6x6 um pixel size, and operates on a 3.3V power supply. It has a temperature range of 0 to 40 °C and is designed for surface mount applications in various imaging systems.
MT9V032C12STM-TP
Onsemi's MT9V032C12STM-TP is a 1/3" CMOS image sensor with 6x6 um pixel size, offering 752H x 480V resolution. Operating at up to 26.6 MHz master clock, it provides a dynamic range of 54.4 dB and supports digital current output interface. Ideal for applications requiring high-quality imaging at temperatures ranging from -30°C to 70°C.
MT9P401I12STC
The Onsemi MT9P401I12STC is a 2.2x2.2um image sensor with 2592H x 1944V pixels, operating at -30 to 70 °C. It requires a 2.8V power supply and features surface mounting, making it ideal for high-resolution imaging applications in various industries.
KAI-0340-AAA-CF-AA-DUAL
KAI-0340-AAA-CF-AA-DUAL by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. It is ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
KAE-02152-ABB-SP-FA
Onsemi's KAE-02152-ABB-SP-FA is a 2/3 inch CCD image sensor with 1920x1080 pixels, offering a dynamic range of 86 dB. It operates b/w -40 to 40 °C and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-08050-CBA-JB-AE
KAI-08050-CBA-JB-AE by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. Its rectangular package style and solder termination make it suitable for industrial machine vision applications requiring high-resolution imaging in a 4/3 optical format.
AR0239ATSH00XUEA0-DRBR-E
Onsemi's AR0239ATSH00XUEA0-DRBR-E is a 3x3 um CMOS image sensor with 1936H x 1188V pixels, offering a dynamic range of 128 dB. Operating at -40 to 105 °C, it has a digital voltage output interface and supports frame rates up to 90 fps. Ideal for applications requiring high-resolution imaging in automotive and surveillance systems.
ICX409AL
Sony
Sony ICX409AL image sensor features 752x582 pixels, 6.5x6.25 um pixel size, and 1/3 inch optical format. Ideal for applications requiring a max supply voltage of 15.45V, with an operating temperature range of -10 to 60 °C and outputting analog voltage signals.
NOIX3SE012KB-LTI1
NOIX3SE012KB-LTI1 by Onsemi is an Image Sensor with 3.2X3.2 um Pixel Size, 32.4 MHz Master Clock, and 4096 Horizontal Pixels. Ideal for applications requiring high-resolution imaging such as surveillance cameras, industrial inspection systems, and medical imaging devices due to its superior performance and digital output interface (I2C/SPI).
AR0231AT7R00XUEA0-DRBR-E
Onsemi's AR0231AT7R00XUEA0-DRBR-E is a CMOS image sensor with 3um pixel size, 27 MHz master clock, and 120dB dynamic range. Ideal for digital cameras, surveillance systems, and automotive applications due to its high resolution and fast frame rate of 60fps.
KAI-1003-AAA-CR-B2
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Horizontal Pixel: 1024; Minimum Operating Temperature: 0 Cel;
S11108
Hamamatsu Photonics Kk
The Hamamatsu Photonics Kk S11108 image sensor features a 14x14 um pixel size, 2048 horizontal pixels, and 72.04 dB dynamic range. With a max supply voltage of 5.25 V, it is ideal for applications requiring high-resolution imaging in environments with temperatures ranging from -40 to 85 °C.
AS0149ATSC00XUEA0-DRBR-E
IMAGE SENSOR,CMOS;
NOIP3SE5000A-LTI
NOIP3SE5000A-LTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592 (H) x 2048 (V) pixels, operating at 45 fps. It has a dynamic range of 60 dB and spectral response of 400-1000 nm. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
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NOIV1SN025KA-GDC
NOIV1SN025KA-GDC by Onsemi is a CMOS image sensor with 4.50x4.50 um pixel size, 310 MHz master clock, and 56.2 dB dynamic range. It is used in applications requiring high-resolution imaging at 53 fps, such as surveillance cameras and industrial machine vision systems.
NOIV1SE1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Power Supplies (V): 3.3; Minimum Supply Voltage: 1.6 V; Maximum Operating Current: 75 mA;
NOIV1SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 75 mA; Dynamic Range: 53 dB;
NOIV2SN1300A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Height: 2.2 mm; Array Type: FRAME; Body Length/Diameter: 14.22 mm;
NOIV1SN2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC; Optical Format (inch): 2/3;
NOIV1SN025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Spectral Response (nm): 400-1000; Body Length/Diameter: 43.1 mm;
NOIV1SE2000A-QDC
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Array Type: FRAME; Maximum Operating Temperature: 70 Cel; Output Interface Type: 4-WIRE INTERFACE;
NOIV1SN1300A-XXC
IMAGE SENSOR,CMOS; Package Shape or Style: SQUARE; Horizontal Pixel: 1280; Dynamic Range: 53 dB; Additional Features: GLOBAL SHUTTER, ROLLING SHUTTER; Body Length/Diameter: 10.617 mm;
NOIV1SE5000A-QDC
NOIV1SE5000A-QDC by Onsemi is an image sensor with 4.80x4.80 um pixel size, 62 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring high-resolution imaging at a max supply voltage of 2V and operating temperature up to 70°C.
NOIV1SE012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Vertical Pixel: 3072;
NOIV1SE025KA-GDC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Spectral Response (nm): 400-1000; Minimum Operating Temperature: -40 Cel; Array Type: FRAME;
NOIV1SN012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 1.6 V; Housing: CERAMIC;
NOIV1SN025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: FRAME; Maximum Operating Temperature: 85 Cel; Housing: CERAMIC;
NOIV1SN012KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Master Clock: 340 MHz; Maximum Supply Voltage: 2 V;
NOIV1SE016KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Output Interface Type: 4-WIRE INTERFACE; Vertical Pixel: 4096;
NOIV1SE025KA-GTI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 85 Cel; Array Type: FRAME; Maximum Supply Voltage: 2 V;
NOIV1SN016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -40 Cel; Spectral Response (nm): 400-1000;
NOIV1SE012KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Housing: CERAMIC; Master Clock: 340 MHz;
NOIV1SE016KA-GDI
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Output Type: CURRENT OUTPUT; Package Shape or Style: RECTANGULAR; Maximum Operating Current: 915 mA; Body Length/Diameter: 43.1 mm;
NOIV1SE025KA-GWC
IMAGE SENSOR,CMOS; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 2 V; Maximum Operating Temperature: 85 Cel; Maximum Operating Current: 775 mA;
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