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NOIL2SM1300A-GDC

Onsemi

NOIL2SM1300A-GDC by Onsemi

NOIL2SM1300A-GDC by Onsemi is an image sensor with 14x14 um pixel size, 315 MHz master clock, and 1280 horizontal pixels. Ideal for digital output applications in cameras, offering a max supply voltage of 2.625 V and operating temperature range of 0-70 °C.

Median Price

$1,751.710

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 34 parts In-Stock

1+ parts

$1,495.450

100+ parts

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34

$1,495.450

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Rochester

USA . 1 parts In-Stock

1+ parts

$2,007.970

100+ parts

$1,968.010

1k+ parts

$1,927.840

10k+ parts

-

1

$2,007.970

$1,968.010

$1,927.840

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 194 parts In-Stock

1+ parts

$1,420.678

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194

$1,420.678

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IBS Electronics

USA . 12 parts In-Stock

1+ parts

$6,093.918

100+ parts

$2,045.154

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-

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12

$6,093.918

$2,045.154

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Vyrian

USA . 4,234 parts In-Stock

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4,234

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Nova Conductors

Japan . 700 parts In-Stock

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700

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LIBRA Elektronik GmbH

Germany . 3 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,879 parts In-Stock

1+ parts

$1,345.905

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1,879

$1,345.905

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Ampacity Inc.

Singapore . 7 parts In-Stock

1+ parts

$2,766.580

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7

$2,766.580

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SupplyDigital Components

Austria . 8,112 parts In-Stock

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8,112

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TANS Electronics

Latvia . 3,350 parts In-Stock

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3,350

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Continental Prestige Electronics

USA . 2,996 parts In-Stock

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2,996

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Netroflash

USA . 2,000 parts In-Stock

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2,000

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Argo Parts USA

USA . 1,912 parts In-Stock

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Kulean Microsystems

USA . 738 parts In-Stock

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738

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UHIMA Technologies

Türkiye . 603 parts In-Stock

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603

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Problanco Electronics

Mexico . 400 parts In-Stock

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400

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Corohmni

South Africa . 272 parts In-Stock

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272

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Perfect Parts

USA . 69 parts In-Stock

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69

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Overview

Elevate your imaging experience with the NOIL2SM1300A-GDC by Onsemi. As a leader in image sensor technology, Onsemi delivers unparalleled quality and reliability in every product. The NOIL2SM1300A-GDC offers a wide range of applications in various industries, providing exceptional value and benefits to customers seeking high-performance image sensors. Discover new possibilities and capture stunning visuals with the NOIL2SM1300A-GDC from Onsemi.

Feature Benefit Bullets

Pixel Size (um): 14X14

The small pixel size allows for high resolution images to be captured, making this image sensor ideal for applications where fine details need to be preserved.

Maximum Supply Voltage: 2.625 V

The higher maximum supply voltage provides flexibility in power supply design and allows for efficient operation of the sensor.

Master Clock: 315 MHz

The high master clock frequency enables fast data readout and high frame rates, making this sensor suitable for capturing fast-moving objects or high-speed processes.

Body Width: 30.5 inch

The compact body width makes it easy to integrate this image sensor into a variety of devices or systems without taking up too much space.

Power Supplies (V): 2.5

The standard power supply voltage ensures compatibility with a wide range of systems and simplifies the design process.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

Being a CMOS image sensor, it offers low power consumption, high sensitivity, and good noise performance, making it a versatile choice for various imaging applications.

Body Height: 3.75 mm

The low profile body height allows for a sleek and compact design when integrating this image sensor in space-constrained applications.

Package Shape or Style: RECTANGULAR

The rectangular package shape facilitates easy mounting and alignment of the sensor, simplifying the manufacturing process.

Minimum Supply Voltage: 2.375 V

The lower minimum supply voltage helps in achieving energy efficiency and can extend the battery life of battery-powered devices that use this image sensor.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range ensures reliable performance even in demanding environmental conditions, making this sensor suitable for a wide range of applications.

Horizontal Pixel: 1280

The high horizontal pixel count results in detailed and high-resolution images, making this sensor suitable for applications requiring precise image capture.

Output Type: DIGITAL OUTPUT

The digital output simplifies the interface with external devices and makes it easy to process and analyze the captured image data.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures the sensor can operate effectively even in cold environments, expanding its versatility in various applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and durability, ensuring a reliable connection between the sensor and the circuit board.

Housing: CERAMIC

The ceramic housing offers thermal stability and durability, protecting the sensitive components inside and ensuring reliable operation over an extended period.

Dynamic Range: 57 dB

The high dynamic range allows the sensor to capture a wide range of light intensities accurately, making it ideal for applications with high contrast scenes.

Vertical Pixel: 1024

The vertical pixel count contributes to the overall image resolution and quality, allowing the sensor to capture detailed images with clarity.

Body Length/Diameter: 35.5 mm

The moderate body length/diameter provides a balance between compactness and ease of integration, making it suitable for a variety of applications.

Optical Format (inch): 1.4

The 1.4-inch optical format provides compatibility with various lenses and optical systems, offering flexibility in designing the imaging setup.

Termination Type: SOLDER

The solder termination type ensures a secure and reliable connection between the sensor and the circuit board, enhancing the overall durability and longevity of the product.

Output Interface Type: 3-WIRE INTERFACE

The 3-wire interface simplifies the connection and communication with external devices, making it easier to integrate this sensor into different systems or platforms.

Frame Rate: 500 fps

The high frame rate allows for capturing fast-moving subjects with smooth and detailed motion, making this sensor suitable for applications requiring high-speed imaging.

Array Type: FRAME

The frame array type enables simultaneous capture of the entire image, resulting in efficient image acquisition and processing for real-time applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the assembly process and allows for easy integration into compact devices or systems, enhancing the overall usability of the sensor.

Technical Specifications

Image Sensors NOIL2SM1300A-GDC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FRAME

Body Width:

30.5 inch

Body Height:

3.75 mm

Body Length/Diameter:

35.5 mm

Dynamic Range:

57 dB

Frame Rate:

500 fps

Horizontal Pixel:

1280

Housing:

CERAMIC

JESD-609 Code:

e3

Master Clock:

315 MHz

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Optical Format (inch):

1.4

Output Interface Type:

3-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

14X14

Power Supplies (V):

2.5

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

2.625 V

Minimum Supply Voltage:

2.375 V

Terminal Finish:

MATTE TIN

Termination Type:

SOLDER

Vertical Pixel:

1024

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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