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KAI-29052-QXA-JD-B1

Onsemi

KAI-29052-QXA-JD-B1 by Onsemi

KAI-29052-QXA-JD-B1 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 6576 horizontal pixels, and 4384 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings at frame rates up to 4 fps.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,248 parts In-Stock

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Digiode

USA . 518 parts In-Stock

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Kulean Microsystems

USA . 5,575 parts In-Stock

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SupplyDigital Components

Austria . 3,596 parts In-Stock

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Problanco Electronics

Mexico . 796 parts In-Stock

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TANS Electronics

Latvia . 667 parts In-Stock

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Corphita

USA . 510 parts In-Stock

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UHIMA Technologies

Türkiye . 272 parts In-Stock

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Corohmni

South Africa . 114 parts In-Stock

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Overview

Capture stunning images with the KAI-29052-QXA-JD-B1 by Onsemi, a high-quality image sensor that delivers exceptional performance. Manufactured by Onsemi, a leading provider of cutting-edge imaging solutions, this sensor is perfect for a wide range of applications in industries such as security, automotive, and medical imaging. With its advanced technology and superior capabilities, the KAI-29052-QXA-JD-B1 offers customers unparalleled value, benefits, and advantages, making it the ideal choice for all their imaging needs.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

The small pixel size allows for high resolution images to be captured with great detail.

Maximum Supply Voltage: 15.5 V

Higher maximum voltage provides flexibility in power supply options and can accommodate varying operating conditions.

Body Width: 45.34 inch

The wider body allows for more space for components and wiring, making installation and integration easier.

Sensors or Transducers Type: IMAGE SENSOR, CCD

The use of CCD image sensor technology ensures high-quality image capture and low noise levels.

Package Shape or Style: RECTANGULAR

The rectangular shape allows for easy mounting and integration into different systems and devices.

Minimum Supply Voltage: 14.5 V

Lower minimum voltage requirement helps in efficient power consumption and extends battery life in portable devices.

Maximum Operating Temperature: 70 °C

The high operating temperature range ensures reliable performance in various environments and conditions.

Dynamic Range: 66 dB

The wide dynamic range allows for capturing images in both bright and low-light conditions with excellent contrast.

Optical Format (inch): 1.7

The large optical format size enables the sensor to capture more light, resulting in better image quality.

Frame Rate: 4 fps

The decent frame rate ensures smooth video recording or fast image capture for real-time monitoring applications.

Technical Specifications

Image Sensors KAI-29052-QXA-JD-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

3.61 mm

Body Length/Diameter:

47.24 mm

Data Rate:

40 Mbps

Dynamic Range:

66 dB

Frame Rate:

4 fps

Horizontal Pixel:

6576

Mounting Feature:

Maximum Operating Current:

11 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1.7

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

4384

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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