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KAI-2020-AAA-CF-AE

Onsemi

KAI-2020-AAA-CF-AE by Onsemi

Onsemi's KAI-2020-AAA-CF-AE image sensor features 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. With a dynamic range of 60 dB, it is ideal for applications requiring high-resolution imaging in industrial and scientific fields.

Median Price

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Lifecycle Status

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Digiode

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Problanco Electronics

Mexico . 4,933 parts In-Stock

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Kulean Microsystems

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TANS Electronics

Latvia . 4,274 parts In-Stock

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UHIMA Technologies

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Corphita

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SupplyDigital Components

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Overview

Unlock the power of cutting-edge imaging technology with the KAI-2020-AAA-CF-AE by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that push boundaries and set new standards. Ideal for a wide range of applications, this versatile sensor offers unparalleled performance, reliability, and precision. Elevate your projects with the superior value, benefits, and advantages that the KAI-2020-AAA-CF-AE provides, revolutionizing the way you capture images and inspiring innovation every step of the way.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

Smaller pixel size provides higher resolution and better image quality.

Maximum Supply Voltage: 15.5 V

Higher supply voltage allows for efficient operation and better performance.

Body Width: 20.32 inch

Compact size makes it suitable for various applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensor technology offers high-quality image capture with low noise.

Body Height: 4.44 mm

Low profile design enables easy integration into different systems.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for efficient placement and mounting in devices.

Minimum Supply Voltage: 14.5 V

Relatively low minimum supply voltage helps in power efficiency.

Horizontal Pixel: 1600

Higher number of horizontal pixels results in sharper and detailed images.

Output Type: ANALOG VOLTAGE

Analog voltage output is suitable for analog signal processing applications.

Dynamic Range: 60 dB

Wide dynamic range allows for capturing details in both bright and dark areas of an image.

Vertical Pixel: 1200

Greater number of vertical pixels enhances the overall image resolution.

Body Length/Diameter: 33.02 mm

Moderate length/diameter for a balanced form factor and easy handling.

Data Rate: 40 Mbps

High data rate enables fast transfer of image data for real-time applications.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections in a circuit.

Array Type: INTERLINE

Interline CCD array provides fast readout speed and reduced image lag.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting offers strong mechanical support and stability in various environments.

Technical Specifications

Image Sensors KAI-2020-AAA-CF-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 30 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

20.32 inch

Body Height:

4.44 mm

Body Length/Diameter:

33.02 mm

Data Rate:

40 Mbps

Dynamic Range:

60 dB

Horizontal Pixel:

1600

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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