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KAI-2020-AAA-CP-BA

Onsemi

KAI-2020-AAA-CP-BA by Onsemi

KAI-2020-AAA-CP-BA by Onsemi is an Image Sensor with 7.4x7.4 um pixel size, 1600 horizontal pixels, and 1200 vertical pixels. It operates b/w -50 to 70 °C and has a dynamic range of 68 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.

Median Price

$10,812.500

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 20 parts In-Stock

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$10,812.500

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20

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Verical

USA . 20 parts In-Stock

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$10,812.500

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20

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Distributors (In-Stock)

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Digiode

USA . 1,269 parts In-Stock

1+ parts

$10,271.875

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1,269

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Vyrian

USA . 5,285 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 621 parts In-Stock

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$9,731.250

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621

$9,731.250

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Corohmni

South Africa . 324 parts In-Stock

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$10,812.500

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324

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Problanco Electronics

Mexico . 8,222 parts In-Stock

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SupplyDigital Components

Austria . 6,050 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Kulean Microsystems

USA . 4,656 parts In-Stock

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TANS Electronics

Latvia . 2,694 parts In-Stock

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UHIMA Technologies

Türkiye . 737 parts In-Stock

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737

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Overview

Revolutionize your imaging experience with the KAI-2020-AAA-CP-BA by Onsemi. This cutting-edge image sensor boasts superior quality and reliability, thanks to Onsemi's renowned manufacturing expertise. Ideal for a wide range of applications, this sensor offers unparalleled value with its high performance and versatility. Capture stunning images with ease and precision, while enjoying the benefits of advanced technology at your fingertips. Upgrade your imaging solutions today with the KAI-2020-AAA-CP-BA and experience the difference for yourself.

Feature Benefit Bullets

Pixel Size (um) 7.4X7.4

Small pixel size allows for high resolution and detailed image capture.

Maximum Supply Voltage 15.5 V

High maximum supply voltage ensures reliable and stable performance.

Body Width 20.32 inch

Compact body width allows for easy integration into various devices or systems.

Sensors or Transducers Type IMAGE SENSOR,CCD

CCD sensor type provides high-quality image output with low noise.

Body Height 4.44 mm

Low body height enables slim design and flexibility in product applications.

Package Shape or Style RECTANGULAR

Rectangular package shape offers efficient use of space and easy mounting.

Minimum Supply Voltage 14.5 V

Low minimum supply voltage helps in power efficiency and extends battery life.

Maximum Operating Temperature 70 °C

High maximum operating temperature ensures reliability in various environmental conditions.

Horizontal Pixel 1600

High horizontal pixel count allows for wider image capture and better detail.

Minimum Operating Temperature -50 °C

Low minimum operating temperature enables use in extreme cold environments.

Housing CERAMIC

Ceramic housing provides durability and protection for the sensor.

Dynamic Range 68 dB

High dynamic range enables the sensor to capture a wide range of light intensities.

Vertical Pixel 1200

High vertical pixel count allows for detailed image capture in the vertical direction.

Body Length/Diameter 33.02 mm

Optimal body length/diameter ratio for efficient use of space and easy integration.

Termination Type SOLDER

Solder termination offers secure and reliable connections for the sensor.

Array Type INTERLINE

Interline array type allows for fast readout and high-speed operation.

Mounting Feature THROUGH HOLE MOUNT

Through hole mounting feature provides secure and stable installation in various systems.

Technical Specifications

Image Sensors KAI-2020-AAA-CP-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 DB

Array Type:

INTERLINE

Body Width:

20.32 inch

Body Height:

4.44 mm

Body Length/Diameter:

33.02 mm

Dynamic Range:

68 dB

Horizontal Pixel:

1600

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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