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KAI-0330-AAA-CP-BA-DUALOUTPUT

Onsemi

KAI-0330-AAA-CP-BA-DUALOUTPUT by Onsemi

KAI-0330-AAA-CP-BA-DUALOUTPUT by Onsemi is an image sensor with 9x9 um pixel size, 648 horizontal pixels, and 484 vertical pixels. It operates at a max supply voltage of 15.5V and min supply voltage of 12V. Ideal for applications requiring high-quality imaging in a compact form factor.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,244 parts In-Stock

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Digiode

USA . 1,828 parts In-Stock

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TANS Electronics

Latvia . 8,222 parts In-Stock

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Problanco Electronics

Mexico . 7,634 parts In-Stock

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SupplyDigital Components

Austria . 2,140 parts In-Stock

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Kulean Microsystems

USA . 521 parts In-Stock

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Corphita

USA . 413 parts In-Stock

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Corohmni

South Africa . 382 parts In-Stock

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UHIMA Technologies

Türkiye . 37 parts In-Stock

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Overview

Elevate your imaging capabilities with the KAI-0330-AAA-CP-BA-DUALOUTPUT by Onsemi. As a leading manufacturer in the industry, Onsemi guarantees top-notch quality and reliability in their products. The KAI-0330-AAA-CP-BA-DUALOUTPUT is perfect for a wide range of applications in image sensors, offering unparalleled performance and precision. With its dual output design, this sensor provides customers with enhanced value, flexibility, and efficiency in their imaging needs. Upgrade to the KAI-0330-AAA-CP-BA-DUALOUTPUT today and experience the difference in quality and performance that Onsemi delivers.

Feature Benefit Bullets

Pixel Size (um): 9X9

Smaller pixel size allows for higher resolution images and better low-light performance.

Maximum Supply Voltage: 15.5 V

Higher supply voltage provides better flexibility in power management.

Body Width: 10.03 inch

Compact size makes it suitable for various applications where space is a constraint.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD sensors are known for their excellent image quality and low noise performance.

Body Height: 4.45 mm

Low profile design enables easy integration into slim devices.

Package Shape or Style: RECTANGULAR

Rectangular shape allows for efficient layout and placement in electronic systems.

Minimum Supply Voltage: 12 V

Lower minimum supply voltage helps in reducing power consumption.

Horizontal Pixel: 648

Higher number of horizontal pixels contribute to sharper images and better details.

Housing: CERAMIC

Ceramic housing offers better thermal conductivity and durability compared to plastic.

Dynamic Range: 57 dB

Wide dynamic range enables capturing both bright and dark areas without losing details.

Vertical Pixel: 484

Good vertical resolution for capturing images with accurate proportions.

Body Length/Diameter: 17.78 mm

Optimal size for balancing performance and ease of integration.

Optical Format (inch): 1/2

Standard optical format suitable for a wide range of imaging applications.

Data Rate: 30 Mbps

High data rate allows for fast and seamless transfer of image data.

Termination Type: SOLDER

Solder termination ensures reliable electrical connections for stable performance.

Array Type: INTERLINE

Interline CCD array offers improved readout speed and reduced image lag.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides secure and stable installation in electronic devices.

Technical Specifications

Image Sensors KAI-0330-AAA-CP-BA-DUALOUTPUT attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 11.5 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

10.03 inch

Body Height:

4.45 mm

Body Length/Diameter:

17.78 mm

Data Rate:

30 Mbps

Dynamic Range:

57 dB

Horizontal Pixel:

648

Housing:

CERAMIC

Mounting Feature:

Optical Format (inch):

1/2

Package Shape or Style:

Pixel Size (um):

9X9

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

12 V

Termination Type:

SOLDER

Vertical Pixel:

484

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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