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TC255P

Texas Instruments

TC255P by Texas Instruments

TC255P by Texas Instruments is an image sensor with 10x10 um pixel size, 324 horizontal pixels, and 243 vertical pixels. It operates b/w -10 to 55 °C with a supply voltage range of 11-13 V. Ideal for applications requiring high sensitivity and a dynamic range of 66 dB in a square package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 5,274 parts In-Stock

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Digiode

USA . 3,757 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Parana Technologies

USA . 547 parts In-Stock

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$2.037

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$2.560

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547

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DigiPath Technology Company

USA . 1,539 parts In-Stock

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$2.243

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$2.064

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$2.243

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ChromeModa Solutions

Germany . 6,563 parts In-Stock

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$2.289

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$1.877

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$2.289

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IDEA Electronic Components Group

UK . 1,064 parts In-Stock

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$2.289

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$2.060

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$2.289

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AZTECH Wire

Italy . 871 parts In-Stock

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$9.094

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Ampacity Inc.

Singapore . 631 parts In-Stock

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$36.750

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$36.750

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One Stop Electronics

USA . 526 parts In-Stock

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$51.750

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Corphita

USA . 2,101 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Kepictronics

USA . 126 parts In-Stock

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Overview

Elevate your imaging experience with the TC255P by Texas Instruments. Crafted with precision and excellence, this image sensor offers unparalleled quality and reliability. Perfect for a wide range of applications, this sensor delivers crisp and clear images with ease. Embrace the value of superior performance and innovation with the TC255P, providing customers with exceptional benefits and advantages. Upgrade your imaging capabilities today with Texas Instruments.

Feature Benefit Bullets

Pixel Size (um): 10X10

The small pixel size allows for high resolution image capture, making this sensor ideal for detailed imaging applications.

Maximum Supply Voltage: 13 V

With a high maximum supply voltage, this sensor is suitable for various power supply configurations without risking damage.

Body Width: 10 inch

The compact body width makes this sensor easy to integrate into a variety of systems while saving space.

Power Supplies (V): 13

The sensor's power supply requirement of 13V is common and easily achievable in many electronic setups.

Sensors or Transducers Type: IMAGE SENSOR,CCD

This CCD image sensor type offers high-quality image output, making it a reliable choice for imaging applications.

Body Height: 3.35 mm

The low body height allows for a slim profile, making it suitable for applications where space is limited.

Package Shape or Style: SQUARE

The square package shape is standard and allows for easy mounting and alignment in various systems.

Minimum Supply Voltage: 11 V

The low minimum supply voltage requirement ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 55 °C

With a high maximum operating temperature, this sensor can withstand elevated temperatures without impacting performance.

Horizontal Pixel: 324

The high number of horizontal pixels enables detailed image capture, making this sensor suitable for high-resolution imaging.

Output Type: ANALOG VOLTAGE

The analog voltage output simplifies integration with analog systems, ensuring compatibility and ease of use.

Minimum Operating Temperature: -10 °C

The low minimum operating temperature allows the sensor to function reliably in cold environments without compromising performance.

Maximum Operating Current: 10 mA

With a low maximum operating current, this sensor helps to minimize power consumption in electronic systems.

Housing: PLASTIC

The plastic housing provides a lightweight and durable enclosure for the sensor, making it suitable for a wide range of applications.

Dynamic Range: 66 dB

The high dynamic range allows the sensor to capture a wide range of light intensities, ensuring accurate and detailed image reproduction.

Vertical Pixel: 243

The vertical pixel count contributes to the sensor's overall image resolution, making it a good choice for applications requiring clear and detailed images.

Body Length/Diameter: 10 mm

The compact body length/diameter makes this sensor easy to handle and install in various systems.

Termination Type: SOLDER

The solder termination type ensures a secure connection between the sensor and other electronic components, enhancing reliability.

Array Type: FRAME TRANSFER

The frame transfer array type enables the sensor to capture images quickly and efficiently, making it suitable for dynamic imaging applications.

Sensitivity (V/lx.s): 0.045 V/lx.s

The high sensitivity of 0.045 V/lx.s allows the sensor to capture clear and detailed images even in low-light conditions.

Mounting Feature: THROUGH HOLE MOUNT

The through-hole mounting feature simplifies installation and enhances stability, making this sensor easy to incorporate into various systems.

Technical Specifications

Image Sensors TC255P attributes and parameters. Explore more Image Sensors devices from Texas Instruments

Specs

Additional Features:

ELECTRONIC SHUTTER

Array Type:

FRAME TRANSFER

Body Width:

10 inch

Body Height:

3.35 mm

Body Length/Diameter:

10 mm

Dynamic Range:

66 dB

Horizontal Pixel:

324

Housing:

PLASTIC

Mounting Feature:

Maximum Operating Current:

10 mA

Maximum Operating Temperature:

55 Cel

Minimum Operating Temperature:

-10 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

10X10

Power Supplies (V):

13

Sensitivity (V/lx.s):

.045 V/lx.s

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

13 V

Minimum Supply Voltage:

11 V

Termination Type:

SOLDER

Vertical Pixel:

243

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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