Loading...

AR0231AT7B00XUEA0-DPBR-E

Onsemi

AR0231AT7B00XUEA0-DPBR-E by Onsemi

Onsemi's AR0231AT7B00XUEA0-DPBR-E is a CMOS image sensor with 3um pixel size, 27 MHz master clock, and 120dB dynamic range. Ideal for applications requiring high-resolution imaging at up to 60fps, such as surveillance cameras and automotive vision systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 836 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

836

-

-

-

-

Digiode

USA . 482 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

482

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

TANS Electronics

Latvia . 8,288 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,288

-

-

-

-

Kulean Microsystems

USA . 4,178 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,178

-

-

-

-

SupplyDigital Components

Austria . 3,326 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,326

-

-

-

-

Corphita

USA . 2,198 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,198

-

-

-

-

Problanco Electronics

Mexico . 2,062 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,062

-

-

-

-

Northwest PG Solutions

USA . 1,757 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,757

-

-

-

-

Native Components

USA . 590 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

590

-

-

-

-

Corohmni

South Africa . 316 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

316

-

-

-

-

UHIMA Technologies

Türkiye . 200 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

200

-

-

-

-

Overview

Capture every moment in stunning detail with the Onsemi AR0231AT7B00XUEA0-DPBR-E image sensor. Manufactured by Onsemi, this sensor promises unmatched quality and reliability. Perfect for applications like security cameras, automotive systems, and drones, this sensor delivers crystal-clear images with a dynamic range of 120 dB. With a compact body and advanced features like a digital output interface and high frame rate, the AR0231AT7B00XUEA0-DPBR-E offers unparalleled value and performance to customers looking for top-of-the-line imaging solutions. Experience the difference with Onsemi.

Feature Benefit Bullets

Pixel Size (um): 3

Smaller pixel size allows for higher resolution images to be captured, making this image sensor suitable for applications requiring detailed imaging.

Maximum Supply Voltage: 1.26 V

Higher maximum supply voltage provides flexibility in power supply options and compatibility with a wide range of systems.

Master Clock: 27 MHz

High master clock frequency enables fast data processing and high-speed image capturing, making this sensor suitable for real-time applications.

Body Width: 10 inch

Compact body width allows for easy integration into various devices and applications without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS image sensors offer low power consumption, high sensitivity, and excellent image quality, making this product a reliable choice for imaging applications.

Body Height: 1.55 mm

Low body height allows for slim device designs and flexibility in placement within compact systems.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides easy mounting and integration options, making it convenient for various applications.

Minimum Supply Voltage: 1.14 V

Low minimum supply voltage helps in reducing power consumption and enhancing efficiency in energy-sensitive applications.

Maximum Operating Temperature: 125 °C

Wide operating temperature range allows this sensor to be used in a variety of environmental conditions, increasing its versatility.

Horizontal Pixel: 1928

High horizontal pixel count ensures high-resolution images with detailed clarity, making this sensor suitable for professional imaging applications.

Output Type: DIGITAL OUTPUT

Digital output simplifies data processing and transmission, enhancing compatibility and ease of use in digital systems.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows this sensor to be used in extreme cold conditions, increasing its usability in various environments.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

Durable terminal finish ensures strong connections and reliable performance, enhancing the overall lifespan and stability of the product.

Maximum Operating Current: 210 mA

Higher maximum operating current allows for power-hungry applications to be supported efficiently, making this sensor suitable for demanding tasks.

Dynamic Range: 120 dB

Wide dynamic range enables capturing of both bright and dark areas with detail, ensuring high-quality imaging results in diverse lighting conditions.

Vertical Pixel: 1208

Sufficient vertical pixel count allows for capturing images with good depth and clarity, making this sensor suitable for various imaging needs.

Body Length/Diameter: 11 mm

Compact body length enables easy integration and flexibility in placement within devices, enhancing the versatility of this sensor.

Optical Format (inch): 1/2.7

Common optical format ensures compatibility with various lenses and systems, making this sensor a practical choice for imaging applications.

Termination Type: SOLDER

Solder termination provides strong and reliable connections, ensuring stability and durability in various operating conditions.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface simplifies connectivity and communication with external devices, enhancing versatility and ease of use in different systems.

Frame Rate: 60 fps

High frame rate allows for smooth and fast image capturing, making this sensor suitable for applications requiring quick and dynamic imaging.

Array Type: LINEAR

Linear array type facilitates easy integration and seamless image capture, ensuring high quality and efficient performance in imaging tasks.

Mounting Feature: SURFACE MOUNT

Surface mount capability provides convenience in installation and integration, making this sensor suitable for space-constrained applications.

Technical Specifications

Image Sensors AR0231AT7B00XUEA0-DPBR-E attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

LINEAR

Body Width:

10 inch

Body Height:

1.55 mm

Body Length/Diameter:

11 mm

Dynamic Range:

120 dB

Frame Rate:

60 fps

Horizontal Pixel:

1928

JESD-609 Code:

e1

Master Clock:

27 MHz

Mounting Feature:

Maximum Operating Current:

210 mA

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/2.7

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Pixel Size (um):

3

Sensors or Transducers Type:

Maximum Supply Voltage:

1.26 V

Minimum Supply Voltage:

1.14 V

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

1208

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20