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KAI-1020-ABB-FD-AE

Onsemi

KAI-1020-ABB-FD-AE by Onsemi

KAI-1020-ABB-FD-AE by Onsemi is a 7.4x7.4 um CCD image sensor with 1000x1000 pixels, offering a dynamic range of 58 dB and spectral response of 300-1000 nm. Ideal for applications requiring high-resolution imaging in industrial cameras or scientific instruments due to its square package style and through-hole mounting feature.

Median Price

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Lifecycle Status

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2

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1k+

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Digiode

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Kulean Microsystems

USA . 7,008 parts In-Stock

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SupplyDigital Components

Austria . 6,745 parts In-Stock

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Problanco Electronics

Mexico . 6,125 parts In-Stock

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TANS Electronics

Latvia . 382 parts In-Stock

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Corphita

USA . 348 parts In-Stock

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UHIMA Technologies

Türkiye . 170 parts In-Stock

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Corohmni

South Africa . 63 parts In-Stock

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Overview

Capture every detail with the KAI-1020-ABB-FD-AE image sensor by Onsemi. Known for their top-notch quality and innovative technology, Onsemi delivers exceptional performance in image sensors. Ideal for a wide range of applications such as industrial imaging, surveillance systems, and medical equipment, this sensor offers unmatched value, precision, and reliability. Elevate your products with the superior image quality and advanced features of the KAI-1020-ABB-FD-AE, setting you apart from the competition.

Feature Benefit Bullets

Pixel Size (um)

The small pixel size of 7.4X7.4 um allows for high resolution images to be captured with this image sensor.

Body Width

The compact body width of 18.29 inch ensures that this image sensor can easily fit into various devices or systems.

Sensors or Transducers Type

Being a CCD image sensor, it offers high-quality imaging performance and is suitable for applications requiring precise image capture.

Body Height

The low body height of 2.92 mm allows for a slim design and easy integration of this image sensor into devices.

Package Shape or Style

The square package shape provides a stable and secure mounting option for the image sensor.

Horizontal Pixel

With 1000 horizontal pixels, this image sensor can capture detailed and high-resolution images.

Output Range

The 500mV output range provides a suitable signal level for further processing or analysis of captured images.

Output Type

The analog voltage output type allows for easy interfacing with other electronic components or systems.

Dynamic Range

The 58 dB dynamic range enables the image sensor to capture a wide range of light intensities, resulting in high-quality images.

Vertical Pixel

With 1000 vertical pixels, this image sensor can capture sharp and detailed images in both horizontal and vertical directions.

Body Length/Diameter

The compact body length of 18.6 mm ensures that this image sensor can be easily integrated into various devices or systems.

Spectral Response (nm)

The wide spectral response range of 300-1000 nm makes this image sensor suitable for capturing images across different wavelengths of light.

Data Rate

With a data rate of 40 Mbps, this image sensor can quickly transfer image data for real-time processing or storage.

Termination Type

The solder termination type provides a reliable and secure connection for the image sensor during installation or integration.

Array Type

The interline array type ensures efficient image capture and transfer, making this image sensor suitable for applications requiring fast imaging.

Mounting Feature

The through hole mount feature allows for easy and secure mounting of the image sensor onto circuit boards or other surfaces.

Technical Specifications

Image Sensors KAI-1020-ABB-FD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY 12 UV/ELECTRON, ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

18.29 inch

Body Height:

2.92 mm

Body Length/Diameter:

18.6 mm

Data Rate:

40 Mbps

Dynamic Range:

58 dB

Horizontal Pixel:

1000

Mounting Feature:

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Spectral Response (nm):

300-1000

Termination Type:

SOLDER

Vertical Pixel:

1000

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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