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KAI-02150-FBA-FD-BA

Onsemi

KAI-02150-FBA-FD-BA by Onsemi

KAI-02150-FBA-FD-BA by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70 °C, suitable for industrial imaging applications requiring high-resolution and low-light performance. The rectangular package with surface mounting feature makes it easy to integrate into various systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,295 parts In-Stock

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Digiode

USA . 793 parts In-Stock

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Kulean Microsystems

USA . 7,298 parts In-Stock

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Problanco Electronics

Mexico . 4,455 parts In-Stock

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SupplyDigital Components

Austria . 4,138 parts In-Stock

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TANS Electronics

Latvia . 572 parts In-Stock

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Corphita

USA . 409 parts In-Stock

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Corohmni

South Africa . 121 parts In-Stock

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UHIMA Technologies

Türkiye . 94 parts In-Stock

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Overview

Elevate your imaging capabilities with the KAI-02150-FBA-FD-BA by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality image sensors that are known for their reliability and performance. Ideal for a wide range of applications, this image sensor offers unparalleled value with its high resolution, dynamic range, and advanced features. Whether you're in the market for professional photography equipment or industrial machine vision systems, the KAI-02150-FBA-FD-BA provides the precision and clarity you need to achieve outstanding results. Experience the difference with Onsemi today.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Smaller pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 15.5 V

A higher maximum supply voltage ensures stable performance and reliability.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high image quality, making this product a good choice for applications requiring superior image reproduction.

Package Shape or Style: RECTANGULAR

Rectangular shape provides easy integration into various devices.

Minimum Supply Voltage: 14.5 V

Low minimum supply voltage helps in power efficiency and reduces power consumption.

Maximum Operating Temperature: 70 °C

Wide operating temperature range allows for use in diverse environments.

Horizontal Pixel: 1920

High horizontal pixel count results in higher resolution images.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures reliability even in extreme cold conditions.

Housing: CERAMIC

Ceramic housing provides durability and protection for the sensor.

Dynamic Range: 64 dB

High dynamic range allows for capturing a wide range of light intensities in a single shot.

Vertical Pixel: 1080

High vertical pixel count contributes to sharp and detailed images.

Optical Format (inch): 2/3

2/3 inch format is ideal for many standard applications and provides good image quality.

Termination Type: SOLDER

Solder termination ensures secure connections for reliable performance.

Array Type: INTERLINE

Interline array type is suitable for applications requiring fast readout speeds.

Mounting Feature: SURFACE MOUNT

Surface mount capability facilitates easy and secure mounting in various devices.

Technical Specifications

Image Sensors KAI-02150-FBA-FD-BA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Dynamic Range:

64 dB

Horizontal Pixel:

1920

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1080

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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