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VG6640CB1M/1

STMicroelectronics

VG6640CB1M/1 by STMicroelectronics

STMicroelectronics VG6640CB1M/1 is a 3.75x3.75 um CMOS image sensor with 132 dB dynamic range and 60 fps frame rate. Ideal for applications requiring high-quality imaging in temperatures ranging from -40 to 125°C, featuring a 1/2.7-inch optical format and I2C interface for seamless integration.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Anansix

USA . 1,602 parts In-Stock

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Digiode

USA . 1,451 parts In-Stock

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Vyrian

USA . 684 parts In-Stock

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684

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Nova Conductors

Japan . 550 parts In-Stock

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550

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Corohmni

South Africa . 196 parts In-Stock

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$1.959

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196

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IDEA Electronic Components Group

UK . 460 parts In-Stock

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$3.010

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$2.709

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Aztec Data Supply Inc.

USA . 1,656 parts In-Stock

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$3.360

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MKK Technologies

India . 1,499 parts In-Stock

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$5.661

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$5.661

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DigiPath Technology Company

USA . 1,499 parts In-Stock

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$5.661

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AZTECH Wire

Italy . 821 parts In-Stock

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$15.509

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Semicontronic

India . 488 parts In-Stock

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$29.750

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$29.006

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$28.858

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488

$29.750

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Ampacity Inc.

Singapore . 1,290 parts In-Stock

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$50.750

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Corphita

USA . 4,095 parts In-Stock

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Argo Parts USA

USA . 3,058 parts In-Stock

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Continental Prestige Electronics

USA . 2,230 parts In-Stock

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Parana Technologies

USA . 1,468 parts In-Stock

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$3.599

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Advanced Electronics

New Zealand . 488 parts In-Stock

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488

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Bastille Electronics

Australia . 200 parts In-Stock

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Overview

Elevate your imaging experience with the VG6640CB1M/1 from STMicroelectronics. As a leader in image sensor technology, STMicroelectronics delivers unrivaled quality and reliability in every product. This cutting-edge image sensor boasts a dynamic range of 132 dB and a frame rate of 60 fps, ensuring crystal-clear images in any environment. Whether you're capturing stunning visuals for security systems, automotive applications, or consumer electronics, the VG6640CB1M/1 provides unmatched value and performance. Upgrade your imaging capabilities today with STMicroelectronics.

Feature Benefit Bullets

Pixel Size (um): 3.75X3.75

The small pixel size allows for high resolution images to be captured with fine details.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption and high image quality, making this sensor a reliable choice for various applications.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this sensor can withstand extreme environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The wide operating temperature range ensures reliable operation in cold environments, making this sensor suitable for a variety of applications.

Dynamic Range: 132 dB

The high dynamic range allows for the capture of both bright and dark areas in an image, leading to more detailed and accurate imaging results.

Optical Format (inch): 1/2.7

The optical format is compatible with a wide range of lenses, providing flexibility in designing imaging systems with this sensor.

Termination Type: SOLDER

Solder termination offers a secure and reliable connection, ensuring stable operation of the sensor in different settings.

Output Interface Type: I2C INTERFACE

The I2C interface allows for easy communication with other devices, simplifying the integration of this sensor into a larger system.

Frame Rate: 60 fps

The high frame rate enables real-time image capture, making this sensor ideal for applications that require fast moving objects to be captured accurately.

Array Type: FRAME

The frame array type provides a structured arrangement of pixels, optimizing image sharpness and clarity.

Mounting Feature: SURFACE MOUNT

The surface mounting feature simplifies the installation process and allows for compact designs, making this sensor suitable for space-constrained applications.

Technical Specifications

Image Sensors VG6640CB1M/1 attributes and parameters. Explore more Image Sensors devices from STMicroelectronics

Specs

Additional Features:

ELECTRICAL ROLLING SHUTTER

Array Type:

FRAME

Dynamic Range:

132 dB

Frame Rate:

60 fps

Mounting Feature:

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/2.7

Output Interface Type:

I2C INTERFACE

Pixel Size (um):

3.75X3.75

Sensors or Transducers Type:

Termination Type:

SOLDER

Trade Compliance

VG6640CB1M/1 Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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