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AR1820HSSC12SHEA0-DP

Onsemi

AR1820HSSC12SHEA0-DP by Onsemi

AR1820HSSC12SHEA0-DP by Onsemi is a 1/2.3 inch CMOS image sensor with 1.25um pixel size and 24 fps frame rate. It features Tin/Silver/Copper terminal finish, ideal for high-quality imaging applications in consumer electronics, security cameras, and industrial automation systems.

Median Price

$61.880

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

AR1820HSSC12SHEA0-DP by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 29,077 parts In-Stock

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-

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$61.880

1k+ parts

$55.370

10k+ parts

$52.110

29,077

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$61.880

$55.370

$52.110

Flip Electronics (Authorized)

USA . 12,467 parts In-Stock

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12,467

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Digiode

USA . 614 parts In-Stock

1+ parts

$65.484

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614

$65.484

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Flip Electronics

USA . 12,467 parts In-Stock

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12,467

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Vyrian

USA . 4,865 parts In-Stock

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VNN

France . 2,135 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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AZTECH Wire

Italy . 62 parts In-Stock

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$10.830

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62

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Ampacity Inc.

Singapore . 20,306 parts In-Stock

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$58.590

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Corphita

USA . 801 parts In-Stock

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$62.037

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801

$62.037

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Corohmni

South Africa . 473 parts In-Stock

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$68.930

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473

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Kulean Microsystems

USA . 5,820 parts In-Stock

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Problanco Electronics

Mexico . 5,247 parts In-Stock

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Continental Prestige Electronics

USA . 4,469 parts In-Stock

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TANS Electronics

Latvia . 3,533 parts In-Stock

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Argo Parts USA

USA . 3,054 parts In-Stock

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Infinite Electronics LLP (Excess)

. 2,406 parts In-Stock

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Formix International (Excess)

India . 2,400 parts In-Stock

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SupplyDigital Components

Austria . 1,757 parts In-Stock

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Perfect Parts

USA . 1,515 parts In-Stock

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UHIMA Technologies

Türkiye . 768 parts In-Stock

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768

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Netroflash

USA . 100 parts In-Stock

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Overview

Capture stunning images with the AR1820HSSC12SHEA0-DP image sensor by Onsemi. Known for their top-quality products, Onsemi delivers advanced technology that surpasses industry standards. This sensor is perfect for a wide range of applications, from smartphones to security cameras, offering crisp and clear images with every shot. Experience the value and benefits of this cutting-edge sensor, providing unmatched performance and reliability for all your imaging needs. Elevate your product to new heights with the AR1820HSSC12SHEA0-DP by Onsemi.

Feature Benefit Bullets

Pixel Size (um): 1.25

The small pixel size of 1.25 um allows for capturing detailed images with high resolution, making this product suitable for applications where image clarity is crucial.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

The CMOS sensor technology offers low power consumption, high sensitivity, and fast image capture capabilities, making this product efficient and versatile for various imaging tasks.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of multiple materials for terminal finish ensures good conductivity, corrosion resistance, and durability, making this product reliable and long-lasting in diverse environmental conditions.

Optical Format (inch): 1/2.3

The 1/2.3-inch optical format provides a larger sensor area for capturing more light and improving the signal-to-noise ratio, resulting in better image quality and performance in low-light conditions.

Frame Rate: 24 fps

With a high frame rate of 24 frames per second, this product can capture smooth and fluid motion in videos, making it ideal for applications such as video recording, surveillance, and fast-moving subjects photography.

Array Type: FRAME

The frame array type offers a structured layout of pixels for efficient image processing and data output, contributing to faster image capture, processing, and transmission, making this product suitable for real-time imaging applications.

Technical Specifications

Image Sensors AR1820HSSC12SHEA0-DP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ELECTRONIC ROLLING SHUTTER

Array Type:

FRAME

Frame Rate:

24 fps

JESD-609 Code:

e1

Optical Format (inch):

1/2.3

Pixel Size (um):

1.25

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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