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KAI-16000-CXA-JD-B1

Onsemi

KAI-16000-CXA-JD-B1 by Onsemi

The Onsemi KAI-16000-CXA-JD-B1 is an image sensor with 7.4x7.4 um pixel size, 65 dB dynamic range, and 4872 horizontal pixels. It is used in applications requiring high-resolution imaging such as industrial machine vision systems and scientific cameras.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,087 parts In-Stock

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Digiode

USA . 717 parts In-Stock

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717

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Problanco Electronics

Mexico . 8,106 parts In-Stock

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SupplyDigital Components

Austria . 5,415 parts In-Stock

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Corphita

USA . 2,391 parts In-Stock

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Kulean Microsystems

USA . 1,355 parts In-Stock

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TANS Electronics

Latvia . 1,123 parts In-Stock

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Corohmni

South Africa . 95 parts In-Stock

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UHIMA Technologies

Türkiye . 19 parts In-Stock

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Overview

Experience superior image quality and performance with the KAI-16000-CXA-JD-B1 Image Sensor by Onsemi. As a leading manufacturer in the industry, Onsemi delivers cutting-edge technology and innovation, ensuring reliability and precision in every product. Ideal for a wide range of applications, this image sensor offers unparalleled value, providing customers with high-resolution images, exceptional dynamic range, and seamless analog output. Elevate your imaging capabilities with the KAI-16000-CXA-JD-B1 and discover the endless possibilities it brings to your projects.

Feature Benefit Bullets

Pixel Size (um)

A larger pixel size of 7.4x7.4 um allows for better light sensitivity and improved image quality, making this image sensor suitable for capturing detailed images.

Maximum Supply Voltage

With a maximum supply voltage of 15.5V, this image sensor can handle higher power input, ensuring stable operation even under challenging conditions.

Body Width

The compact body width of 45.34 inch allows for easy integration into various electronic devices without taking up too much space.

Sensors or Transducers Type

Being a CCD image sensor, it offers high-quality imaging with low noise, making it ideal for demanding applications such as surveillance or medical imaging.

Package Shape or Style

The rectangular package shape provides a standardized form factor for easy installation and compatibility with a wide range of mounting options.

Minimum Supply Voltage

The minimum supply voltage of 14.5V ensures reliable performance even with lower power input, making this image sensor versatile and energy-efficient.

Dynamic Range

With a dynamic range of 65dB, this image sensor can accurately capture both bright and dark areas in an image, resulting in well-balanced and detailed pictures.

Data Rate

The high data rate of 30 Mbps allows for fast and efficient image transfer, making this image sensor suitable for applications requiring real-time imaging or high-speed data processing.

Termination Type

The solder termination type ensures secure and reliable connections for seamless integration into electronic circuits or systems.

Array Type

The interline array type offers high sensitivity and improved image quality, making this image sensor a reliable choice for demanding imaging applications.

Mounting Feature

The through-hole mounting feature provides a sturdy and stable mounting option, ensuring secure placement of the image sensor in various electronic devices or systems.

Technical Specifications

Image Sensors KAI-16000-CXA-JD-B1 attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 30 UV/ELECTRON

Array Type:

INTERLINE

Body Width:

45.34 inch

Body Height:

4.88 mm

Body Length/Diameter:

44.45 mm

Data Rate:

30 Mbps

Dynamic Range:

65 dB

Horizontal Pixel:

4872

Mounting Feature:

Output Type:

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

3248

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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