Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Toshiba TCD1304DG is an 8x200 um image sensor with a 2 MHz master clock, ideal for applications requiring high sensitivity (160 V/lx.s) and a wide dynamic range (49.54 dB). With a spectral response of 400-1200 nm, this CCD sensor operates at temperatures from -25 to 60 °C, making it suitable for various imaging solutions.
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Vyrian
Nova Conductors
AZTECH Wire
$9.243
Ampacity Inc.
$22.750
Argo Parts USA
Continental Prestige Electronics
Kepictronics
Authorized Procurement Solutions
Bastille Electronics
The large pixel size of 8X200 um allows for greater light sensitivity, resulting in higher quality images with better low-light performance.
The high maximum supply voltage of 5.5 V provides compatibility with a wide range of power sources, ensuring flexibility in system design.
The fast master clock speed of 2 MHz allows for quick data processing and efficient operation of the image sensor.
The compact body width of 9.65 inches makes the image sensor suitable for applications where space is limited.
The image sensor requires only 4 power supplies (V), simplifying the power management in the system.
Being a high-quality CCD image sensor, it offers excellent image quality and precision, making it a top choice for imaging applications.
The low body height of 3.22 mm allows for easy integration into compact systems without adding bulk.
The rectangular package shape offers easy mounting and alignment in the system, enhancing the overall convenience of use.
The low minimum supply voltage of 3 V helps in reducing power consumption and improving energy efficiency.
With a high maximum operating temperature of 60 °C, the image sensor is suitable for use in various environmental conditions.
The wide output voltage range of 1.50-3.50V allows for flexible signal processing and compatibility with different input requirements.
The digital voltage output type simplifies interfacing with other digital components, ensuring seamless integration within the system.
The low minimum operating temperature of -25 °C ensures reliable performance even in cold environments.
The ceramic housing provides durability, thermal stability, and protection against external elements, ensuring long-term reliability of the image sensor.
The high dynamic range of 49.54 dB enables the image sensor to capture a wide range of light intensities, resulting in detailed and accurate image reproduction.
The moderate body length/diameter of 41.6 mm offers a balance between compactness and ease of handling during installation.
The broad spectral response range of 400-1200 nm allows the image sensor to capture a wide range of wavelengths, making it versatile for different imaging applications.
The high data rate of 1 Mbps enables fast and efficient data transfer, suitable for real-time imaging and high-speed applications.
The solder termination type ensures secure and reliable connections, minimizing the risk of signal loss or intermittent connections.
The linear array type offers precise and sequential image capture, making it ideal for applications where uniform image resolution is required.
The high sensitivity of 160 V/lx.s allows the image sensor to capture clear and detailed images even in low light conditions, ensuring high-quality image output.
The through hole mounting feature provides secure and stable installation, ensuring reliable performance in various operating conditions.
Image Sensors TCD1304DG attributes and parameters. Explore more Image Sensors devices from Toshiba
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TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
BSS138-7-F
Diodes Incorporated
Diodes Inc. BSS138-7-F is a N-channel FET with 50V DS breakdown voltage, 0.2A max drain current, and 3.5 ohm RDS(on). Ideal for switching applications in small outline packages with matte tin finish, operating up to 150°C peak reflow temp.
C1210C104K5RACTU
KEMET Corporation
KEMET C1210C104K5RACTU is a ceramic capacitor with 0.1uF capacitance, rated for 50V. It has X7R temperature characteristics and ±10% tolerance, suitable for surface mount applications in a wide temperature range from -55°C to 125°C. Its compact rectangular package makes it ideal for various electronic devices.
1N4148WS
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Lite-on Semiconductor
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N7002
Vishay Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; No. of Elements: 1; Terminal Form: GULL WING; Qualification: Not Qualified;
BAV99
Micro Commercial Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
OPA2227UA
Texas Instruments
OPA2227UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 200 uV and bias current of 0.01 uA. It operates at temperatures ranging from -40 to 85 °C, making it suitable for industrial applications requiring precise signal amplification. With a unity gain bandwidth of 8000 kHz, this op amp is ideal for high-frequency circuit designs.
SMBJ18CA
Alpha & Omega Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS138BKW,115
NXP Semiconductors
NXP Semiconductors' BSS138BKW,115 is a N-CHANNEL FET with 60V DS breakdown voltage and 0.32A ID. Ideal for SWITCHING applications, it features a built-in diode, 1.6 ohm RDS(on), and operates in ENHANCEMENT MODE. Suitable for surface mount with GULL WING terminals, it meets AEC-Q101 standards.
Rectron
EPCS4SI8N
Altera
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Parallel or Serial: SERIAL;
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Microchip Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
Comchip Technology
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
LM317T
Bay Linear
Other Regulators; No. of Terminals: 3; No. of Outputs: 1; Surface Mount: NO; Maximum Load Regulation (%): 1.5 %; Operating Temperature (TJ-Min): 0 Cel;
Hitano Enterprise
International Semiconductor
SS14
Sensitron Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
KAI-0340S
Onsemi
Image Sensors;
KAI-0330-CBA-CB-BA-DUAL
KAI-0330-CBA-CB-BA-DUAL by Onsemi is an image sensor with 9x9 um pixel size, 648 horizontal pixels, and 484 vertical pixels. It operates at temperatures ranging from -50 to 70 °C and requires a power supply of 15V. Ideal for applications requiring high-resolution imaging in challenging environments.
MT9V022I77ATM
Aptina
IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.30-2.90V; Pixel Size (um): 6X6;
AR0220AT4B00XUEA2-DRBR
Onsemi's AR0220AT4B00XUEA2-DRBR is a 1/1.8 inch CMOS image sensor with 1828x948 pixels, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in frame arrays, this sensor provides high-quality imaging solutions in compact devices.
AR1335HSSC11SMAA0-DPBR-E
Onsemi's AR1335HSSC11SMAA0-DPBR-E is a 1/3.2" CMOS image sensor with 4208x3120 pixels, offering a 69 dB dynamic range and operating at a max supply voltage of 1.3 V. This sensor, featuring a square package style, is ideal for applications requiring high-resolution imaging at 30 fps such as surveillance cameras or industrial machine vision systems.
AR0130CSSC00SPBA0-DR
Onsemi's AR0130CSSC00SPBA0-DR is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a pixel size of 3.75um. It operates at a max supply voltage of 1.95V and has a master clock frequency of 50MHz. Ideal for applications requiring high-resolution imaging in devices such as surveillance cameras and industrial inspection systems due to its compact square package design and digital current output interface.
AR023ZMCSC00SUEA0-DRBR
The Onsemi AR023ZMCSC00SUEA0-DRBR image sensor features 3x3 um pixel size, 48 MHz master clock, and 1928 horizontal pixels. Ideal for applications requiring a high dynamic range of 105 dB, such as surveillance cameras, automotive vision systems, and industrial imaging solutions.
KAI-1020-FBA-FD-AE
KAI-1020-FBA-FD-AE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1000x1000 resolution, and 58 dB dynamic range. It is used in applications requiring high-quality imaging such as surveillance cameras and industrial machine vision systems.
AMIS-720442-A
Image Sensors; Power Supplies (V): 5; Vertical Pixel: 1; Horizontal Pixel: 128; Minimum Operating Temperature: 0 Cel; Maximum Operating Temperature: 50 Cel;
AR0134CSSM00SUEA0-DPBR
The Onsemi AR0134CSSM00SUEA0-DPBR image sensor features 3.75um pixel size, 1.95V max supply voltage, and 50MHz master clock. Ideal for applications requiring high-resolution imaging with a 1280x960 pixel array, such as surveillance cameras or industrial machine vision systems.
NOIP1SN1300A-QDI
NOIP1SN1300A-QDI by Onsemi is an image sensor with 1280x1024 pixels, 360 MHz master clock, and 60 dB dynamic range. It operates at -40 to 85 °C and has a spectral response of 400-1000 nm. Ideal for high-speed imaging applications requiring precise digital voltage output.
KAC-9619-ABA-FB-AA
KAF-1402ME
KAI-29052-FXA-JD-AE
KAI-29052-FXA-JD-AE by Onsemi is an image sensor with 5.5x5.5 um pixel size, 6576 horizontal pixels, and 4384 vertical pixels. It operates at a max supply voltage of 15.5 V and has a dynamic range of 66 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-0340-CBA-CB-AE-D
IMAGE SENSOR,CCD;
MT9V022I77ATC
MT9V022I77ATC by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels. It operates at 26.6 MHz master clock, offers a dynamic range of 54.4 dB, and supports a frame rate of 60 fps. Ideal for applications requiring high-resolution imaging in industrial and automotive sectors.
TSL208R
Ams-taos Usa
IMAGE SENSOR,CCD; Mounting Feature: PANEL MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.60-2.40V; Body Height: 3.35 mm;
KAI-0330-CBA-CB-BA-SINGLE
AR0135CS2M00SUEA0-DRBR1
Onsemi's AR0135CS2M00SUEA0-DRBR1 is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a dynamic range of 71.1 dB and operating at temperatures from -30 to 70°C. With a max supply voltage of 1.95V and output interface type of 2-WIRE INTERFACE, it is ideal for applications requiring high-resolution imaging at up to 54 fps.
KAI-16050-CXA-JD-AE
The Onsemi KAI-16050-CXA-JD-AE is a 5.5x5.5 um CCD image sensor with 4896 (H) x 3264 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 °C to 70°C and features an interline array type, suitable for applications requiring high-resolution imaging in various environments.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TCD1208AP
Toshiba
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 3-4.50V; Minimum Operating Temperature: -25 Cel;
TCD1304DG(8Z,AW)
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-3.50V; Body Width: 9.65 inch;
TCD1304AP
Toshiba TCD1304AP is a CCD image sensor with 3648 horizontal pixels and 8x200 um pixel size. It operates b/w -25 to 60 °C, with output range of 1.50-3.50V. Ideal for applications requiring high sensitivity (160 V/lx.s) and a dynamic range of 50 dB in a ceramic, glass-sealed housing.
TCD1201D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Vertical Pixel: 1; Power Supplies (V): 8; Minimum Operating Temperature: -25 Cel; Horizontal Pixel: 2048;
TCD132D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -25 Cel; Power Supplies (V): 15; Vertical Pixel: 1; Horizontal Pixel: 1024;
TCD1254GFG(8Z,AA)
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.5-3.0V; Dynamic Range: 52.04 dB;
TCD1305DG
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.70-3.50V; Minimum Operating Temperature: -25 Cel;
TCD1205DG
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-4.50V; Body Length/Diameter: 41.6 mm;
TCD1103GFG
Toshiba TCD1103GFG is a 5.5X64 um CCD image sensor with 1-2V digital voltage output, ideal for applications requiring high sensitivity (79 V/lx.s) and a wide dynamic range of 46.02 dB. With a spectral response of 400-1100 nm, it operates b/w -25 to 60 °C, making it suitable for various imaging solutions in industrial settings.
TCD1209DG
TCD107D
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Vertical Pixel: 1; JESD-609 Code: e0; Minimum Operating Temperature: -25 Cel; Terminal Finish: Tin/Lead (Sn/Pb);
TCD1252AP
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 3.50-4.50V; Body Length/Diameter: 41.6 mm;
TCD1209D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 4-7V; Minimum Operating Temperature: -25 Cel;
TCD103C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Horizontal Pixel: 2592; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 60 Cel; Pixel Size (um): 11X11;
TCD101AC
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 12; Horizontal Pixel: 1728; Vertical Pixel: 1; Terminal Finish: Tin/Lead (Sn/Pb);
TCD105C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Horizontal Pixel: 3648; JESD-609 Code: e0; Pixel Size (um): 8X8; Vertical Pixel: 1;
TCD1105GFG
TCD106C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 12; JESD-609 Code: e0; Pixel Size (um): 7X7; Vertical Pixel: 1;
TCD1106GFG
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