Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 12; Horizontal Pixel: 1728; Vertical Pixel: 1; Terminal Finish: Tin/Lead (Sn/Pb);
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Image Sensors TCD101AC attributes and parameters. Explore more Image Sensors devices from Toshiba
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TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
LL4148
Temic Semiconductors
RECTIFIER DIODE; Terminal Position: END; Terminal Form: NO LEAD; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
2N2222A
Swampscott Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
1N4148
Sinyork
RECTIFIER DIODE; Surface Mount: NO; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Output Current: .15 A; Maximum Repetitive Peak Reverse Voltage: 100 V; No. of Phases: 1;
FDV304P
Onsemi
The Onsemi FDV304P is a P-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 0.46A and an Operating Temperature range of -55 to 150 °C. The transistor comes in a PLASTIC/EPOXY package with GULL WING terminals, suitable for surface mount configurations.
TCA6424ARGJR
Texas Instruments
TCA6424ARGJR by Texas Instruments is a CMOS parallel I/O port with 24 bits and 3 ports. It operates b/w -40 to 85°C, suitable for industrial applications. With a max clock frequency of 0.4 MHz, it offers low power consumption at only 0.03 mA supply current.
DS18B20Z
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Housing: PLASTIC; Maximum Accuracy (Cel): 0.50;
2N7002
National Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Package Style (Meter): SMALL OUTLINE; Terminal Position: DUAL;
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .5 A;
2N7002,215
NXP Semiconductors
2N7002,215 by NXP Semiconductors is a small signal N-CHANNEL FET with a min DS breakdown voltage of 60V and max drain current of 0.3A. It is used for switching applications in enhancement mode, operates b/w -65 to 150 °C, and has a max power dissipation of 0.2W.
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
SMMBT2222ALT1G
SMMBT2222ALT1G by Onsemi is a NPN BJT transistor with 3 terminals, 0.6A IC, and 40V VCE. It has a hFE of 75, fT of 300MHz, and operates up to 150°C. Ideal for small signal applications in automotive electronics due to AEC-Q101 compliance.
BAV99
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Forward Voltage (VF): 1 V; Maximum Operating Temperature: 150 Cel;
Surge Components
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM555CN
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Surface Mount: NO;
BSS138
Micro Commercial Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Terminal Position: DUAL;
Digitron Semiconductors
Taitron Components
USB3320C-EZK-TR
Standard Microsystems
INTERFACE CIRCUIT; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;
NDT2955
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
KAI-01050-FBA-FD-AE
The Onsemi KAI-01050-FBA-FD-AE is a 5.5x5.5 um CCD image sensor with 1024x1024 pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and requires a supply voltage of 14.5-15.5 V. Ideal for surface mount applications in devices requiring high-quality imaging capabilities in an optical format of 1/2 inch.
KAF-09000-ABA-DD-AE
The Onsemi KAF-09000-ABA-DD-AE is a 3056x3056 pixel CCD image sensor with 12x12 um pixel size. It operates b/w -60 to 60 °C and offers a dynamic range of 84 dB. Ideal for high-resolution imaging applications, it features a spectral response of 300-1100 nm and data rate of 10 Mbps.
KAI-2093-CBA-CB-BA
KAI-2093-CBA-CB-BA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 1920x1080 resolution, and 60 dB dynamic range. It is ideal for applications requiring high-quality imaging such as surveillance cameras, industrial inspection systems, and medical imaging devices.
KAE-08152-FBA-JP-FA
KAE-08152-FBA-JP-FA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 86 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
CMV2000-3E5M1PP
Ams Ag
CMV2000-3E5M1PP by Ams Ag is a 2/3-inch CMOS image sensor with 2048x1088 pixels, offering a high dynamic range of 90 dB. With a pixel size of 5.5um and SPI interface, it operates b/w -30°C to 70°C. Ideal for applications requiring fast frame rates up to 340 fps in industrial imaging systems.
AR0135AT2M25XUEA0-TRBR
The Onsemi AR0135AT2M25XUEA0-TRBR is a 1/3 inch CMOS image sensor with 3.75x3.75 um pixel size, offering a frame rate of 54 fps. It is designed for surface mount applications, featuring Tin/Silver/Copper terminal finish and a square package style.
KAF-50100-CAA-JD-AA
The Onsemi KAF-50100-CAA-JD-AA is a CCD image sensor with 6x6 um pixel size, offering a dynamic range of 70.2 dB. With a resolution of 8176x6132 pixels, it operates b/w 0-60 °C and supports data rates up to 18 Mbps. Ideal for high-resolution imaging applications in various industries.
KAI-0340-CBA-CB-AA-SINGLE
KAI-0340-CBA-CB-AA-SINGLE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
KAI-0340-AAA-CP-AE-DUAL
The Onsemi KAI-0340-AAA-CP-AE-DUAL is a 640x480 CCD image sensor with 7.4um pixel size, offering a dynamic range of 69dB. It operates b/w -50 to 70 °C, suitable for industrial imaging applications requiring high-quality images in varying conditions. The rectangular package style and through-hole mounting feature make it easy to integrate into systems.
KAI-02150-ABA-JD-BA
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 64 dB; Maximum Operating Temperature: 70 Cel; Pixel Size (um): 5.5X5.5;
AMIS-710214
Image Sensors; Maximum Operating Temperature: 50 Cel; Minimum Operating Temperature: 0 Cel; Power Supplies (V): 5; Horizontal Pixel: 1728;
KAI-02150-CBA-JB-AE
KAI-02150-CBA-JB-AE by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels. It operates b/w -50 °C to 70°C, with a dynamic range of 64 dB. Suitable for applications requiring high-resolution imaging in industrial and scientific fields.
NOIP1SN0480A-STI
NOIP1SN0480A-STI by Onsemi features 4.80X4.80 um pixel size, 68 MHz master clock, and 808 (H) x 608 (V) resolution. This image sensor is ideal for applications requiring high-speed imaging with a frame rate of up to 120 fps in a compact surface-mount package.
VSP7500ZWVR
VSP7500ZWVR by Texas Instruments is a 1.65-1.95V CCD image sensor with 8mm body length, suitable for applications requiring digital voltage output in temperatures ranging from -25 to 85°C. Its surface mount housing and tin/silver/copper terminal finish make it ideal for compact electronic devices.
AR0521SR2C09SURA0-DR1
Onsemi's AR0521SR2C09SURA0-DR1 is a 12x12mm CMOS image sensor with 2592x1944 pixels, 1/2.5" optical format, and 60fps frame rate. Ideal for high-resolution imaging applications in automotive cameras, drones, and surveillance systems due to its compact size and surface mounting feature.
KLI-2104-DAA-EB-AA
KLI-2104-DAA-EB-AA by Onsemi is an image sensor with 14X7 um pixel size, 2098 horizontal pixels, and 80 dB dynamic range. It operates at temperatures from -25 to 80 °C and uses a ceramic housing. Ideal for applications requiring high-quality imaging in various environments.
AR0134CSSM00SPCA0-TPBR
Onsemi's AR0134CSSM00SPCA0-TPBR is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70°C, with a max supply voltage of 1.95V and data rate of 700Mbps. Ideal for applications requiring high-resolution imaging in compact devices.
KAF-0402-ABA-CP-B1
Onsemi's KAF-0402-ABA-CP-B1 is a CCD image sensor with 9x9 um pixel size, offering 768H x 512V resolution. It operates at 14.75-15.5 V supply voltage range, providing a dynamic range of 76 dB. Ideal for full-frame applications requiring high-quality imaging with a data rate of 10 Mbps.
KAF-3200-ABA-CD-B2
The Onsemi KAF-3200-ABA-CD-B2 is a CCD image sensor with 6.8X6.8 um pixel size, offering 2184 horizontal and 1472 vertical pixels. It operates b/w -60 to 60 °C, has a dynamic range of 78 dB, and spectral response of 200-1100 nm. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
KAF-39000
Image Sensors;
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
TCD1304DG
Toshiba
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-3.50V; Data Rate: 1 Mbps;
TCD1208AP
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 3-4.50V; Minimum Operating Temperature: -25 Cel;
TCD1304DG(8Z,AW)
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-3.50V; Body Width: 9.65 inch;
TCD1304AP
Toshiba TCD1304AP is a CCD image sensor with 3648 horizontal pixels and 8x200 um pixel size. It operates b/w -25 to 60 °C, with output range of 1.50-3.50V. Ideal for applications requiring high sensitivity (160 V/lx.s) and a dynamic range of 50 dB in a ceramic, glass-sealed housing.
TCD1201D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Vertical Pixel: 1; Power Supplies (V): 8; Minimum Operating Temperature: -25 Cel; Horizontal Pixel: 2048;
TCD132D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -25 Cel; Power Supplies (V): 15; Vertical Pixel: 1; Horizontal Pixel: 1024;
TCD1254GFG(8Z,AA)
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.5-3.0V; Dynamic Range: 52.04 dB;
TCD1305DG
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.70-3.50V; Minimum Operating Temperature: -25 Cel;
TCD1205DG
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-4.50V; Body Length/Diameter: 41.6 mm;
TCD1103GFG
Toshiba TCD1103GFG is a 5.5X64 um CCD image sensor with 1-2V digital voltage output, ideal for applications requiring high sensitivity (79 V/lx.s) and a wide dynamic range of 46.02 dB. With a spectral response of 400-1100 nm, it operates b/w -25 to 60 °C, making it suitable for various imaging solutions in industrial settings.
TCD1209DG
IMAGE SENSOR,CCD;
TCD107D
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Vertical Pixel: 1; JESD-609 Code: e0; Minimum Operating Temperature: -25 Cel; Terminal Finish: Tin/Lead (Sn/Pb);
TCD1252AP
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 3.50-4.50V; Body Length/Diameter: 41.6 mm;
TCD1209D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 4-7V; Minimum Operating Temperature: -25 Cel;
TCD103C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Horizontal Pixel: 2592; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 60 Cel; Pixel Size (um): 11X11;
TCD105C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Horizontal Pixel: 3648; JESD-609 Code: e0; Pixel Size (um): 8X8; Vertical Pixel: 1;
TCD1105GFG
TCD106C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 12; JESD-609 Code: e0; Pixel Size (um): 7X7; Vertical Pixel: 1;
TCD1106GFG
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