Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 4-7V; Minimum Operating Temperature: -25 Cel;
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Image Sensors TCD1209D attributes and parameters. Explore more Image Sensors devices from Toshiba
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TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
BAV99
Motorola
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Maximum Reverse Recovery Time: .006 us; Maximum Repetitive Peak Reverse Voltage: 70 V; JESD-609 Code: e0;
SS14
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Technology: SCHOTTKY; Maximum Non Repetitive Peak Forward Current: 30 A; Maximum Forward Voltage (VF): .55 V; No. of Phases: 1;
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
2N2222A
Semitronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Jiangsu Changjiang Electronics Technology
RECTIFIER DIODE; Surface Mount: YES; Maximum Forward Voltage (VF): .715 V; Maximum Operating Temperature: 150 Cel; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .2 A;
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: YES; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Repetitive Peak Reverse Voltage: 70 V; Maximum Reverse Recovery Time: .006 us; Maximum Output Current: .1 A;
NDT2955
National Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 3 W; JESD-609 Code: e0; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
LM107H/883C
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Wideband: NO;
1N4148WS
Diodes Incorporated
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Infineon Technologies
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
FDC5614P
Onsemi
FDC5614P by Onsemi is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max IDM and 0.105 ohm RDS(ON), operating in ENHANCEMENT MODE at -55 to 150 °C. This SMALL OUTLINE transistor has a built-in diode, GULL WING terminals, and METAL-OXIDE SEMICONDUCTOR technology.
M24308/2-1F
Defense Logistics Agency
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; Mounting Type: CABLE AND PANEL; Mating Info.: MULTIPLE MATING PARTS AVAILABLE; Empty Shell: NO;
2N7002
Promax-johnton
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Terminal Form: GULL WING; Maximum Drain-Source On Resistance: 7.5 ohm; Minimum DS Breakdown Voltage: 60 V;
OPA2277UA
Texas Instruments
OPA2277UA by Texas Instruments is a dual operational amplifier with low-offset voltage of 100 uV and micropower consumption of 1.65 mA. Ideal for industrial applications, it offers high common mode rejection ratio of 140 dB and unity gain bandwidth of 1000 kHz in a small outline package.
Transys Electronics
LD1117S33CTR
STMicroelectronics
STMicroelectronics LD1117S33CTR is a fixed positive single output LDO regulator with a nominal output voltage of 3.3V and max output current of 1.3A. It operates within an input voltage range of 4.75V to 15V, making it suitable for various applications requiring stable voltage regulation in compact designs. The device features low dropout voltage of 1.3V, high temperature operation up to 125°C, and small outline package style for space-constrained PCB layouts.
SMBJ18CA
Leshan Radio
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM107H/883
Rochester Electronics
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Maximum Average Bias Current (IIB): .1 uA;
AR0134CSSM25SPCA0-TPBR
Onsemi's AR0134CSSM25SPCA0-TPBR is a 1/3-inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70 °C, with a max supply voltage of 1.95V and a data rate of 700Mbps. Ideal for applications requiring high-resolution imaging in varying environmental conditions.
KLI-4104-AAA-CB-AA
The Onsemi KLI-4104-AAA-CB-AA is an Image Sensor with 10x10 um pixel size, 4134 horizontal and vertical pixels. It operates b/w 0-70 °C, with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAF-3200-AAA-CB-B1
Image Sensors;
CYIS1SM0250AA-HHCS
CYIS1SM0250AA-HHCS by Onsemi is an Image Sensor with 25um pixel size, 8 MHz master clock, and 512x512 resolution. Ideal for applications requiring high-quality digital imaging in a compact form factor.
AR0135CS2M00SUEA0-TPBR
The Onsemi AR0135CS2M00SUEA0-TPBR is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a max supply voltage of 1.95V and operating temperature range from -30 to 70 °C. It features a digital output interface, 71.1 dB dynamic range, and is ideal for applications requiring high-resolution imaging at up to 54 fps.
KAF-0402-AAA-CP-B1
Onsemi's KAF-0402-AAA-CP-B1 is a CCD image sensor with 9x9 um pixel size, offering 768H x 512V resolution. It operates at 14.75-15.5 V, providing a dynamic range of 76 dB. Ideal for applications requiring high-quality imaging in full-frame array setups with through-hole mounting.
AR0430CSSC14SMRA0-DP
The Onsemi AR0430CSSC14SMRA0-DP is a 1/3 inch CMOS image sensor with a frame rate of 120 fps. It features a square plastic package, suitable for surface mount applications. With dimensions of 10.16mm x 10.16mm x 1.625mm, it is ideal for compact imaging devices like smartphones and action cameras.
KAC-00401-CBC-LB-A0
Onsemi's KAC-00401-CBC-LB-A0 Image Sensor features 6.7X6.7um pixel size, 3.3V power supply, and operates b/w -40 to 105 °C. With 768x488 pixels, it is ideal for surface mount applications in various imaging systems.
NOIP1SE0300A-QTI
NOIP1SE0300A-QTI by Onsemi features 4.80X4.80 um pixel size, 72 MHz master clock, and 640x480 resolution. Ideal for image sensing applications due to its CMOS sensor type, 60 dB dynamic range, and digital voltage output interface at a frame rate of 815 fps.
MT9V131C12STCES
Onsemi's MT9V131C12STCES image sensor features 5.6x5.6 um pixel size, 640x480 resolution, and 27 MHz master clock. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high sensitivity of 1.9 V/lx.s and frame rate of 30 fps.
AMIS-721250
Image Sensors; Power Supplies (V): 5; Minimum Operating Temperature: -10 Cel; Vertical Pixel: 1; Maximum Operating Temperature: 50 Cel; Horizontal Pixel: 688;
MT9V135C12STC
Aptina
Image Sensors; Mounting Feature: SURFACE MOUNT; Minimum Operating Temperature: -30 Cel; Maximum Operating Temperature: 70 Cel; Horizontal Pixel: 640; Power Supplies (V): 2.8;
IMX290LQR-C
Sony
Sony's IMX290LQR-C image sensor features 2.9x2.9 um pixel size, 74.25 MHz master clock, and 120 fps frame rate. Ideal for applications requiring high-quality imaging in a compact form factor such as surveillance cameras or industrial machine vision systems.
KAI-01050-CBA-JD-BA
KAI-01050-CBA-JD-BA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 1024 horizontal and vertical pixels, and a dynamic range of 64 dB. It operates b/w -50 to 70 °C, with a supply voltage range of 14.5V to 15.5V. Ideal for applications requiring high-quality digital imaging in various industries.
OV07955-N53V-PE
Omnivision Technologies
MT9J003I12STCU-DR
MT9J003I12STCU-DR by Onsemi is a 1/2.3" CMOS image sensor with 3856x2764 pixels, offering a dynamic range of 65.2 dB and digital output at 480 Mbps. It operates b/w -30 to 70 °C, with a supply voltage range of 1.7-1.9V, making it ideal for high-resolution imaging applications requiring fast frame rates up to 60 fps.
MT9M021IA3XTM-DRBR1
MT9M021IA3XTM-DRBR1 by Onsemi is an image sensor with 3.75um pixel size, 50 MHz master clock, and 1280x960 resolution. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high sensitivity (5.3 V/lx.s), 60 fps frame rate, and compact square package design.
KAI-29050-FXA-JD-AE
KAI-29050-FXA-JD-AE by Onsemi is an image sensor with 5.5X5.5 um pixel size, 6644 horizontal pixels, and 4452 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 64 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings at frame rates up to 4 fps.
KAI-2020M
KAI-2020M by Onsemi is an image sensor with 7.4X7.4 um pixel size, 40 MHz master clock, and 1600 horizontal pixels. Ideal for applications requiring high-quality imaging such as industrial machine vision systems or medical imaging devices due to its 68 dB dynamic range and 35 fps frame rate.
MT9V024IA7XTM-DR1
MT9V024IA7XTM-DR1 by Onsemi is a 1/3-inch CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for applications requiring high-quality imaging such as surveillance cameras and industrial machine vision systems.
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TCD1304DG
Toshiba
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-3.50V; Data Rate: 1 Mbps;
TCD1208AP
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 3-4.50V; Minimum Operating Temperature: -25 Cel;
TCD1304DG(8Z,AW)
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-3.50V; Body Width: 9.65 inch;
TCD1304AP
Toshiba TCD1304AP is a CCD image sensor with 3648 horizontal pixels and 8x200 um pixel size. It operates b/w -25 to 60 °C, with output range of 1.50-3.50V. Ideal for applications requiring high sensitivity (160 V/lx.s) and a dynamic range of 50 dB in a ceramic, glass-sealed housing.
TCD1201D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Vertical Pixel: 1; Power Supplies (V): 8; Minimum Operating Temperature: -25 Cel; Horizontal Pixel: 2048;
TCD132D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -25 Cel; Power Supplies (V): 15; Vertical Pixel: 1; Horizontal Pixel: 1024;
TCD1254GFG(8Z,AA)
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.5-3.0V; Dynamic Range: 52.04 dB;
TCD1305DG
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.70-3.50V; Minimum Operating Temperature: -25 Cel;
TCD1205DG
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-4.50V; Body Length/Diameter: 41.6 mm;
TCD1103GFG
Toshiba TCD1103GFG is a 5.5X64 um CCD image sensor with 1-2V digital voltage output, ideal for applications requiring high sensitivity (79 V/lx.s) and a wide dynamic range of 46.02 dB. With a spectral response of 400-1100 nm, it operates b/w -25 to 60 °C, making it suitable for various imaging solutions in industrial settings.
TCD1209DG
IMAGE SENSOR,CCD;
TCD107D
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Vertical Pixel: 1; JESD-609 Code: e0; Minimum Operating Temperature: -25 Cel; Terminal Finish: Tin/Lead (Sn/Pb);
TCD1252AP
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 3.50-4.50V; Body Length/Diameter: 41.6 mm;
TCD103C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Horizontal Pixel: 2592; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 60 Cel; Pixel Size (um): 11X11;
TCD101AC
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 12; Horizontal Pixel: 1728; Vertical Pixel: 1; Terminal Finish: Tin/Lead (Sn/Pb);
TCD105C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Horizontal Pixel: 3648; JESD-609 Code: e0; Pixel Size (um): 8X8; Vertical Pixel: 1;
TCD1105GFG
TCD106C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 12; JESD-609 Code: e0; Pixel Size (um): 7X7; Vertical Pixel: 1;
TCD1106GFG
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