Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
RC0603JR-070RL
Yageo
Yageo's RC0603JR-070RL is a SMT fixed resistor with 0 ohm resistance, rated for temperatures from -55 to 155 °C. Its metal glaze/thick film technology and 0.1 W power dissipation make it ideal for jumper applications in various electronic devices.
KSZ9031RNXIA
Micrel
ETHERNET TRANSCEIVER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 48; Package Code: HVQCCN; Package Shape: SQUARE;
2N7002
Transys Electronics
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 60 V; Maximum Operating Temperature: 150 Cel;
LL4148
Silicon Standard
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM107H/883
National Semiconductor
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Technology: BIPOLAR;
BAV99
Itt Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
SS14
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LM555CMX
Fairchild Semiconductor
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
1N4148
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
2N2222A
Bharat Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Micro Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138
General Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .35 W; Minimum DS Breakdown Voltage: 50 V; Qualification: Not Qualified;
STM32H753IIK6
STMicroelectronics
STM32H753IIK6 by STMicroelectronics is a 32-bit microcontroller with 176 terminals, operating at up to 48 MHz. It features 20-Ch 16-Bit ADCs, 2-Ch 12-Bit DACs, and peripherals like CAN, ETHERNET, and USB. Ideal for industrial applications requiring high-speed processing and extensive connectivity options.
Panjit International
USB2514BI-AEZG
Microchip Technology
USB2514BI-AEZG by Microchip is a BUS CONTROLLER IC with 36 terminals, operating at 3.3V, supporting I2C, SMBUS, and USB buses. It has a clock frequency of up to 24MHz and can withstand industrial temperatures from -40°C to 85°C. This chip carrier package is surface mountable and suitable for various applications requiring USB connectivity.
Bytesonic Electronics
BSS138BK,215
Nexperia
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Peak Reflow Temperature (C): 260; Additional Features: LOGIC LEVEL COMPATIBLE; Maximum Operating Temperature: 150 Cel;
1552200168
Molex
WIRE AND CABLE;
SMBJ18CA
Pulse Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123NH6327XTSA1
Infineon Technologies
Infineon BSS123NH6327XTSA1 is a N-CHANNEL FET with 100V DS breakdown voltage, 0.19A ID, and 6 ohm RDS(on). Ideal for small outline applications requiring high drain current and low on-resistance. AEC-Q101 compliant for automotive use.
KAI-1003-AAA-CR-B2
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Horizontal Pixel: 1024; Minimum Operating Temperature: 0 Cel;
NOIP1SN0500A-QDI
Onsemi
NOIP1SN0500A-QDI by Onsemi is an image sensor with 4.80x4.80 um pixel size, 72 MHz master clock, and 800x600 resolution. It operates at a voltage range of 1.7-1.9V and is ideal for digital imaging applications requiring high frame rates and dynamic range.
KAF-1402ME
AR0220AT3C00XUEA0-DRBR-E
Onsemi's AR0220AT3C00XUEA0-DRBR-E is a CMOS image sensor with 4.2x4.2 um pixel size, 50 MHz master clock, and 120 dB dynamic range. Ideal for applications requiring high-resolution imaging at up to 60 fps in a compact rectangular package measuring 12mm x 9 inch x 1.65 mm.
KAI-01150-QBA-FD-BA
The Onsemi KAI-01150-QBA-FD-BA is a 5.5x5.5 um CCD image sensor with 1280 (H) x 720 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 to 70 °C and has a square package style, suitable for surface mount applications in various imaging systems.
AR0134CSSM00SUEA0-TPBR
AR0134CSSM00SUEA0-TPBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70°C, has a max supply voltage of 1.95V, and uses a digital current output interface. Ideal for applications requiring high-resolution imaging in varying temperature conditions.
TC285SPD-B0
Texas Instruments
TC285SPD-B0 by Texas Instruments is an 8x8 um Image Sensor with 1004 horizontal and 1002 vertical pixels. It operates at -10 to 55 °C, powered by a 14V supply. Ideal for THROUGH HOLE MOUNT applications in various industries.
KAI-2020M
KAI-2020M by Onsemi is an image sensor with 7.4X7.4 um pixel size, 40 MHz master clock, and 1600 horizontal pixels. Ideal for applications requiring high-quality imaging such as industrial machine vision systems or medical imaging devices due to its 68 dB dynamic range and 35 fps frame rate.
CMV4000-3E5M1PP
Ams Ag
CMV4000-3E5M1PP by Ams Ag is an IMAGE SENSOR with a 60 dB dynamic range and 37 fps frame rate. It operates b/w -30°C to 70°C, featuring SPI INTERFACE output and THROUGH HOLE MOUNT for easy installation. Ideal for applications requiring high sensitivity at 5.56 V/lx.s, such as industrial imaging systems.
NOIV2SE1300A-QDC
NOIV2SE1300A-QDC by Onsemi is an image sensor with 1280x1024 resolution, 4.80um pixel size, and 62 MHz master clock. Ideal for applications requiring high-quality imaging at a max supply voltage of 2V, such as surveillance cameras or industrial machine vision systems.
MT9V034C12STM-DP
Onsemi's MT9V034C12STM-DP is a 1/3 inch CMOS image sensor with 752x480 pixels, offering a dynamic range of 100 dB. Operating at 60 fps with a pixel size of 6x6 um, it has an output interface type of 2-WIRE INTERFACE. Ideal for applications requiring high-resolution imaging and low-light sensitivity in compact devices.
CYIS1SM0250AA-HHCS
CYIS1SM0250AA-HHCS by Onsemi is an Image Sensor with 25um pixel size, 8 MHz master clock, and 512x512 resolution. Ideal for applications requiring high-quality digital imaging in a compact form factor.
KAI-02050-FBA-JD-AE
KAI-02050-FBA-JD-AE by Onsemi is an image sensor with 5.5um pixel size, 1600x1200 resolution, and 64dB dynamic range. It is ideal for applications requiring high-quality imaging in industrial cameras, surveillance systems, and medical devices.
KAI-16070-FXA-JD-B1
KAI-16070-FXA-JD-B1 by Onsemi is an image sensor with 7.4X7.4 um pixel size, 40 MHz master clock, and 70.5 dB dynamic range. Ideal for applications requiring high-resolution imaging in industrial cameras or scientific instruments due to its 4864x3232 pixel resolution and INTERLINE array type.
AR0330CM1C25SUD20
Onsemi's AR0330CM1C25SUD20 is a 2.2x2.2um CMOS image sensor with 2304H x 1536V pixels, operating at 27MHz clock rate. It offers a dynamic range of 69.5dB and spectral response of 350-1150nm, suitable for applications requiring high-resolution imaging in automotive cameras and surveillance systems.
AR0144CSSC00SUKA0-CPBR
The Onsemi AR0144CSSC00SUKA0-CPBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 60 fps frame rate. It features a rectangular package shape for surface mount applications.
MT9V111D00ATCK82AC1-305
MT9V111D00ATCK82AC1-305 by Onsemi is a 640x480 CMOS image sensor with 5.6um pixel size, 27 MHz master clock, and 60dB dynamic range. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high sensitivity and frame rate of 30 fps.
TSL1402R
TSL1402R by Ams Ag is an image sensor with a pixel size of 63.5X55.5 um and output range of 1.60-2.40V, suitable for applications requiring a dynamic range of 72 dB. With a spectral response of 300-1100 nm, this CCD sensor operates b/w temperatures of 0 to 70 °C, making it ideal for various imaging solutions.
KAI-01150-CBA-JD-BA
KAI-01150-CBA-JD-BA by Onsemi is an image sensor with 1280x720 pixels, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70 °C and has a supply voltage range of 14.5V to 15.5V. Ideal for applications requiring high-resolution imaging in various environments.
AS0260CSSC28SUKA0-CR
AS0260CSSC28SUKA0-CR by Onsemi is a CMOS image sensor with 1920x1080 pixels, 1.4um pixel size, and 65dB dynamic range. It operates at -30 to 70°C, with a supply voltage of 1.7-1.95V and output range of 0.40-1.50V. Ideal for digital cameras, surveillance systems, and machine vision applications due to its high resolution and sensitivity.
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TCD1304DG
Toshiba
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-3.50V; Data Rate: 1 Mbps;
TCD1208AP
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 3-4.50V; Minimum Operating Temperature: -25 Cel;
TCD1304DG(8Z,AW)
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-3.50V; Body Width: 9.65 inch;
TCD1304AP
Toshiba TCD1304AP is a CCD image sensor with 3648 horizontal pixels and 8x200 um pixel size. It operates b/w -25 to 60 °C, with output range of 1.50-3.50V. Ideal for applications requiring high sensitivity (160 V/lx.s) and a dynamic range of 50 dB in a ceramic, glass-sealed housing.
TCD1201D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Vertical Pixel: 1; Power Supplies (V): 8; Minimum Operating Temperature: -25 Cel; Horizontal Pixel: 2048;
TCD132D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -25 Cel; Power Supplies (V): 15; Vertical Pixel: 1; Horizontal Pixel: 1024;
TCD1254GFG(8Z,AA)
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.5-3.0V; Dynamic Range: 52.04 dB;
TCD1305DG
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.70-3.50V; Minimum Operating Temperature: -25 Cel;
TCD1205DG
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-4.50V; Body Length/Diameter: 41.6 mm;
TCD1103GFG
Toshiba TCD1103GFG is a 5.5X64 um CCD image sensor with 1-2V digital voltage output, ideal for applications requiring high sensitivity (79 V/lx.s) and a wide dynamic range of 46.02 dB. With a spectral response of 400-1100 nm, it operates b/w -25 to 60 °C, making it suitable for various imaging solutions in industrial settings.
TCD1209DG
IMAGE SENSOR,CCD;
TCD107D
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Vertical Pixel: 1; JESD-609 Code: e0; Minimum Operating Temperature: -25 Cel; Terminal Finish: Tin/Lead (Sn/Pb);
TCD1252AP
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 3.50-4.50V; Body Length/Diameter: 41.6 mm;
TCD1209D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 4-7V; Minimum Operating Temperature: -25 Cel;
TCD103C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Horizontal Pixel: 2592; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 60 Cel; Pixel Size (um): 11X11;
TCD101AC
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 12; Horizontal Pixel: 1728; Vertical Pixel: 1; Terminal Finish: Tin/Lead (Sn/Pb);
TCD105C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Horizontal Pixel: 3648; JESD-609 Code: e0; Pixel Size (um): 8X8; Vertical Pixel: 1;
TCD106C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 12; JESD-609 Code: e0; Pixel Size (um): 7X7; Vertical Pixel: 1;
TCD1106GFG
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