Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-4.50V; Body Length/Diameter: 41.6 mm;
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Image Sensors TCD1205DG attributes and parameters. Explore more Image Sensors devices from Toshiba
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TOSHIBA, is a Japanese multinational conglomerate corporation headquartered in Minato, Tokyo, Japan. Its diversified products and services include power, industrial and social infrastructure systems, elevators and escalators, electronic components, semiconductors, hard disk drives (HDD), printers, batteries, lighting, as well as IT solutions such as quantum cryptography which has been in development at Cambridge Research Laboratory, Toshiba Europe, located in the United Kingdom, now being commercialised.It was one of the biggest manufacturers of personal computers, consumer electronics, home appliances, and medical equipment. As a semiconductor company and the inventor of flash memory, Toshiba had been one of the top 10 in the chip industry until its flash memory unit was spun off as Toshiba Memory, later Kioxia, in the late 2010s.
FDN5618P
Fairchild Semiconductor
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .5 W; Transistor Element Material: SILICON; Moisture Sensitivity Level (MSL): 1;
BAV99
Diotec Semiconductor Ag
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Changzhou Starsea Electronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
DS18B20U
Dallas Semiconductor
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -55 Cel; Package Equivalence Code: TSSOP8,.19;
BSS138
Inter F E T
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Terminal Finish: TIN LEAD; Package Body Material: PLASTIC/EPOXY;
2N2222A
Ksl Microdevices
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
CGA3E2X7R1H104K080AA
TDK
CGA3E2X7R1H104K080AA by TDK is a fixed ceramic capacitor with a capacitance of 0.1 uF and a rated DC voltage of 50 V. It has a temperature coefficient of 15% and can operate at temperatures ranging from -55 to 125 °C. This capacitor is commonly used in surface mount applications for various electronic devices.
2N7002
Samsung
N-CHANNEL AND P-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain-Source On Resistance: 5 ohm; No. of Terminals: 3;
SMBJ18CA
Sangdest Microelectronics (Nanjing)
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
North American Philips Discrete Products Div
LM317T
Integrated Power Semiconductors
Other Regulators; No. of Terminals: 3; Operating Temperature (TJ-Min): 0 Cel; Terminal Pitch: 2.54 mm; Maximum Load Regulation (%): 1.5 %; Nominal Dropout Voltage-1: 3 V;
Rectron
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Maximum Operating Temperature: 150 Cel; Terminal Form: GULL WING;
EU2B-YS3303C
Idec
ROTARY SWITCH;
Continental Device India
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
Weitron Technology
Telcom Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Operating Temperature: 150 Cel; JESD-609 Code: e0;
BSS84-7-F
SPC TECHNOLOGY/ MULTICOMP
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Shape: RECTANGULAR; Transistor Element Material: SILICON;
SS14
Surge Components
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
Taitron Components
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Operating Mode: ENHANCEMENT MODE; Minimum DS Breakdown Voltage: 60 V; Package Shape: RECTANGULAR;
Microsemi
KAF-0402-ABA-CD-B1
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Data Rate: 10 Mbps; Body Length/Diameter: 30.48 mm; Termination Type: SOLDER;
KAI-29050-AXA-JR-B1
Onsemi
KAI-29050-AXA-JR-B1 by Onsemi is an image sensor with 5.5X5.5 um pixel size, 15.5 V max supply voltage, and 6576 horizontal pixels. It is ideal for applications requiring a dynamic range of 64 dB, such as industrial machine vision systems or surveillance cameras.
NOM02A6-AR77G
NOM02A6-AR77G by Onsemi is a CMOS image sensor with 3.1-3.5V supply voltage range, operating at 0-50 °C. It outputs analog voltage in the range of 2.40-2.60V, suitable for applications requiring precise imaging in compact spaces like panel-mounted devices.
AR0135AT2M00XUEA0-DPBR
The Onsemi AR0135AT2M00XUEA0-DPBR image sensor features 3.75um pixel size, 50MHz master clock, and 1/3 inch optical format. Ideal for applications requiring a digital voltage output interface, with a frame rate of 54fps and a dynamic range of 67.7dB.
MT9M413C36STC
The Onsemi MT9M413C36STC is a CMOS image sensor with 12x12 um pixel size, 1280H x 1024V resolution, and 66 MHz master clock. It operates at a voltage range of 3-3.6V, with a max current of 165mA. Ideal for high-speed imaging applications requiring digital output in industrial settings.
AR0330CSSC12SPBA0-DR
AR0330CSSC12SPBA0-DR by Onsemi is a 1/3 inch CMOS image sensor with 2304x1536 pixels, offering a pixel size of 2.2x2.2 um and a max supply voltage of 1.9V. With an output range of 0.40-2.40V and frame rate of 60 fps, it is ideal for applications requiring high-resolution imaging in devices such as cameras and surveillance systems.
KAI-16070-QXA-JD-B2
KAI-16070-QXA-JD-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 40 MHz master clock, and 4864 horizontal pixels. Ideal for applications requiring high-resolution imaging in industrial cameras or scientific instruments due to its 70.5 dB dynamic range and INTERLINE array type.
TSL1401CL
Ams Ag
TSL1401CL by Ams Ag is a linear image sensor with 128 horizontal pixels, offering a spectral response of 300-1100nm. It operates b/w 0-70°C, with an output range of 1.60-2.40V and a dynamic range of 72dB. Ideal for applications requiring precise imaging in various environments due to its compact size and surface mounting feature.
VSP7500ZWVR
Texas Instruments
VSP7500ZWVR by Texas Instruments is a 1.65-1.95V CCD image sensor with 8mm body length, suitable for applications requiring digital voltage output in temperatures ranging from -25 to 85°C. Its surface mount housing and tin/silver/copper terminal finish make it ideal for compact electronic devices.
KAI-02170-CBA-JD-BA
KAI-02170-CBA-JD-BA by Onsemi is an image sensor with 1920x1080 pixels, 7.4um pixel size, and 70.2dB dynamic range. It operates b/w -50 to 70 °C and is ideal for CCD imaging applications requiring high-quality images in a rectangular package style.
KAF-3200-AAA-CP-B2
Image Sensors;
MT9P031I12STM-TP
MT9P031I12STM-TP by Onsemi is a 2.2x2.2um CMOS image sensor with 2592H x 1944V resolution, operating at 48MHz clock speed. It offers a dynamic range of 70.1dB and outputs digital voltage in the range of 0.16-1.82V, suitable for applications requiring high-quality imaging such as surveillance cameras and industrial machine vision systems.
KAE-02152-FBB-SP-EE
Onsemi's KAE-02152-FBB-SP-EE is a 5.5x5.5 um CCD image sensor with 1920x1080 pixels, offering a dynamic range of 86 dB. Ideal for applications requiring high-resolution imaging in industrial and scientific fields due to its rectangular package style and through-hole mounting feature.
KAI-04022-AAA-CR-BA
KAI-04022-AAA-CR-BA by Onsemi is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 72dB dynamic range. It operates b/w -50 to 70 °C and has a supply voltage range of 14.5V to 15.5V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings due to its CCD technology and digital voltage output type.
MT9V024IA7XTR
MT9V024IA7XTR by Onsemi is an image sensor with 6x6 um pixel size, 27 MHz master clock, and 752 horizontal pixels. It is ideal for applications requiring a digital voltage output interface, such as surveillance cameras, automotive vision systems, and industrial imaging devices.
AR0134CSSC00SPCA0-TRBR
AR0134CSSC00SPCA0-TRBR by Onsemi is a 1/3 inch CMOS image sensor with 1280x960 resolution, 3.75um pixel size, and 64dB dynamic range. It operates at -30 to 70 °C, with a max supply voltage of 1.95V and frame rate of 60fps. Ideal for digital cameras, surveillance systems, and automotive applications due to its high-quality imaging capabilities.
NOIP1SN2000A-QTI
NOIP1SN2000A-QTI by Onsemi features 4.8x4.8 um pixel size, 360 MHz master clock, and 1920x1200 resolution. This image sensor is ideal for high-speed imaging applications requiring a dynamic range of 60 dB and a frame rate of 230 fps in an optical format of 2/3 inch.
AR0238CSSC12SHRA0-DP
Onsemi's AR0238CSSC12SHRA0-DP image sensor features 3x3 um pixel size, 48 MHz master clock, and 1/2.7 inch optical format. Ideal for applications requiring high-resolution imaging with a frame rate of 60 fps in a compact square package suitable for surface mounting.
KAI-02150-ABA-JD-BA
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Optical Format (inch): 2/3;
MT9M021IA3XTM-DPBR1
MT9M021IA3XTM-DPBR1 by Onsemi is a 1/3" CMOS image sensor with 1280x960 resolution. It operates at 50 MHz, offers 64 dB dynamic range, and has a sensitivity of 5.3 V/lx.s. Ideal for applications requiring high-quality digital imaging at up to 60 fps.
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TCD1205DG
Toshiba
TCD1304DG
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-3.50V; Data Rate: 1 Mbps;
TCD1208AP
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 3-4.50V; Minimum Operating Temperature: -25 Cel;
TCD1304DG(8Z,AW)
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.50-3.50V; Body Width: 9.65 inch;
TCD1304AP
Toshiba TCD1304AP is a CCD image sensor with 3648 horizontal pixels and 8x200 um pixel size. It operates b/w -25 to 60 °C, with output range of 1.50-3.50V. Ideal for applications requiring high sensitivity (160 V/lx.s) and a dynamic range of 50 dB in a ceramic, glass-sealed housing.
TCD1201D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Vertical Pixel: 1; Power Supplies (V): 8; Minimum Operating Temperature: -25 Cel; Horizontal Pixel: 2048;
TCD132D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Minimum Operating Temperature: -25 Cel; Power Supplies (V): 15; Vertical Pixel: 1; Horizontal Pixel: 1024;
TCD1254GFG(8Z,AA)
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.5-3.0V; Dynamic Range: 52.04 dB;
TCD1305DG
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 1.70-3.50V; Minimum Operating Temperature: -25 Cel;
TCD1103GFG
Toshiba TCD1103GFG is a 5.5X64 um CCD image sensor with 1-2V digital voltage output, ideal for applications requiring high sensitivity (79 V/lx.s) and a wide dynamic range of 46.02 dB. With a spectral response of 400-1100 nm, it operates b/w -25 to 60 °C, making it suitable for various imaging solutions in industrial settings.
TCD1209DG
IMAGE SENSOR,CCD;
TCD107D
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Vertical Pixel: 1; JESD-609 Code: e0; Minimum Operating Temperature: -25 Cel; Terminal Finish: Tin/Lead (Sn/Pb);
TCD1252AP
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 3.50-4.50V; Body Length/Diameter: 41.6 mm;
TCD1209D
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Output Range: 4-7V; Minimum Operating Temperature: -25 Cel;
TCD103C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Horizontal Pixel: 2592; Terminal Finish: Tin/Lead (Sn/Pb); Maximum Operating Temperature: 60 Cel; Pixel Size (um): 11X11;
TCD101AC
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 12; Horizontal Pixel: 1728; Vertical Pixel: 1; Terminal Finish: Tin/Lead (Sn/Pb);
TCD105C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Horizontal Pixel: 3648; JESD-609 Code: e0; Pixel Size (um): 8X8; Vertical Pixel: 1;
TCD1105GFG
TCD106C
Image Sensors; Mounting Feature: THROUGH HOLE MOUNT; Power Supplies (V): 12; JESD-609 Code: e0; Pixel Size (um): 7X7; Vertical Pixel: 1;
TCD1106GFG
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