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KAI-02050-FBA-JB-B2-T

Onsemi

KAI-02050-FBA-JB-B2-T by Onsemi

Onsemi's KAI-02050-FBA-JB-B2-T is a 5.5x5.5 um pixel size CCD image sensor with 1600H x 1200V resolution and 64 dB dynamic range. It operates b/w -50 to 70 °C, suitable for industrial imaging applications requiring high-quality images in varying temperatures.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,807 parts In-Stock

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Digiode

USA . 954 parts In-Stock

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Kulean Microsystems

USA . 8,253 parts In-Stock

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Problanco Electronics

Mexico . 3,144 parts In-Stock

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Corphita

USA . 1,890 parts In-Stock

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TANS Electronics

Latvia . 1,317 parts In-Stock

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SupplyDigital Components

Austria . 1,043 parts In-Stock

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Corohmni

South Africa . 383 parts In-Stock

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UHIMA Technologies

Türkiye . 343 parts In-Stock

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Overview

Elevate your imaging game with the KAI-02050-FBA-JB-B2-T by Onsemi. As a leading manufacturer in image sensors, Onsemi delivers top-notch quality and reliability. Ideal for a wide range of applications, this image sensor offers unparalleled value, providing customers with clear, crisp images and exceptional performance. Upgrade your imaging system today with the KAI-02050-FBA-JB-B2-T and experience the difference in quality and precision.

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Smaller pixel size allows for high resolution and detailed image capture, making it a good choice for applications requiring clear and sharp images.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage provides flexibility in power supply options and can accommodate various operating conditions, increasing the versatility of the product.

Body Width: 20.07 inch

Compact body width allows for easy integration into different devices or systems, making it a convenient choice for space-constrained applications.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD image sensors are known for their high-quality image capture capabilities, making this product a reliable choice for imaging applications requiring superior image quality.

Package Shape or Style: RECTANGULAR

Rectangular package shape offers ease of handling and integration into various setups, making it a practical choice for system designers.

Minimum Supply Voltage: 14.5 V

Relatively low minimum supply voltage helps in reducing power consumption and can be beneficial for energy-efficient applications, making it a sustainable choice.

Maximum Operating Temperature: 70 °C

Wide maximum operating temperature range enables operation in various environmental conditions, enhancing the product's durability and reliability in different settings.

Horizontal Pixel: 1600

Higher horizontal pixel count allows for wider image coverage and detailed imaging, making the product suitable for applications that require capturing larger or more detailed scenes.

Minimum Operating Temperature: -50 °C

Low minimum operating temperature ensures reliable performance even in extreme cold climates, making the product suitable for use in a wide range of environments.

Dynamic Range: 64 dB

Good dynamic range capability allows for accurately capturing both bright and dark areas in an image, making it a suitable choice for applications requiring high contrast imaging.

Vertical Pixel: 1200

Vertical pixel count provides sufficient resolution for detailed vertical image capture, making the product suitable for applications requiring precise vertical dimension detection.

Body Length/Diameter: 33.02 mm

Compact body length/diameter facilitates easy integration and placement within devices or systems, making the product a practical choice for space-constrained setups.

Optical Format (inch): 2/3

Standard 2/3 inch optical format ensures compatibility with a wide range of lenses and accessories, offering flexibility in adapting to different imaging requirements.

Termination Type: SOLDER

Solder termination provides a secure and reliable electrical connection, ensuring stable performance and durability in various operating conditions, making it a dependable choice for long-term use.

Array Type: INTERLINE

Interline array design offers fast readout and efficient image capture, making the product suitable for applications that require high-speed imaging and continuous data acquisition.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature allows for easy and secure installation in PCBs or other mounting surfaces, ensuring stable positioning and reliable operation, making it a user-friendly choice for integration.

Technical Specifications

Image Sensors KAI-02050-FBA-JB-B2-T attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER

Array Type:

INTERLINE

Body Width:

20.07 inch

Body Length/Diameter:

33.02 mm

Dynamic Range:

64 dB

Horizontal Pixel:

1600

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

2/3

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

1200

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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