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CYII4SC6600AA-HAC

Onsemi

CYII4SC6600AA-HAC by Onsemi

CYII4SC6600AA-HAC by Onsemi is an image sensor with 3.5x3.5 um pixel size, operating at a max supply voltage of 3.3V and a master clock of 40 MHz. Ideal for applications requiring high sensitivity and digital output interface, such as surveillance cameras or industrial imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,351 parts In-Stock

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Vyrian

USA . 2,053 parts In-Stock

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Problanco Electronics

Mexico . 5,812 parts In-Stock

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SupplyDigital Components

Austria . 5,185 parts In-Stock

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Kulean Microsystems

USA . 3,237 parts In-Stock

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TANS Electronics

Latvia . 1,644 parts In-Stock

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Corphita

USA . 637 parts In-Stock

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Corohmni

South Africa . 356 parts In-Stock

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Northwest PG Solutions

USA . 280 parts In-Stock

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$3.302

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Native Components

USA . 138 parts In-Stock

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$3.269

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UHIMA Technologies

Türkiye . 28 parts In-Stock

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Overview

Unlock a world of crystal-clear imaging with the CYII4SC6600AA-HAC by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality image sensors that guarantee superior performance and reliability. Ideal for a wide range of applications, this image sensor offers unparalleled value with its high sensitivity, impressive dynamic range, and seamless integration with a 3-wire interface. Elevate your imaging experience with the CYII4SC6600AA-HAC and capture every detail with precision and clarity.

Feature Benefit Bullets

Pixel Size (um): 3.5X3.5

Smaller pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 3.3 V

Higher supply voltage allows for better signal-to-noise ratio and overall performance.

Master Clock: 40 MHz

High master clock frequency enables fast image capture and processing.

Body Width: 24.13 inch

Compact body width makes it suitable for applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensors are known for their low power consumption and high image quality.

Body Height: 3.04 mm

Low body height allows for easy integration into various devices.

Package Shape or Style: SQUARE

Square package shape enables efficient use of space and easy mounting on circuit boards.

Minimum Supply Voltage: 2.5 V

Lower minimum supply voltage helps in reducing power consumption and heat generation.

Maximum Operating Temperature: 50 °C

High maximum operating temperature ensures reliable performance in harsh environments.

Output Range: 0.50-2V

Wide output range provides flexibility in signal processing and interfacing with other components.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies data processing and transmission.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for operation in cold conditions.

Maximum Operating Current: 80 mA

Low operating current helps in reducing power consumption and extending battery life.

Housing: CERAMIC, METAL-SEALED COFIRED

Ceramic housing provides durability and protection against environmental factors.

Dynamic Range: 61 dB

High dynamic range allows for capturing both bright and dark areas in an image with detail.

Body Length/Diameter: 24.13 mm

Compact body length/diameter makes it suitable for various applications.

Termination Type: SOLDER

Solder termination ensures secure and reliable connection to circuit boards.

Output Interface Type: 3-WIRE INTERFACE

3-wire interface simplifies communication with external devices.

Frame Rate: 5 fps

Decent frame rate for capturing videos or fast-moving objects.

Array Type: FULL FRAME

Full-frame array type ensures no cropping of the image and captures the entire scene.

Sensitivity (V/lx.s): 1.57 V/lx.s

High sensitivity allows for better performance in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount capability makes it easy to integrate into PCBs and other devices.

Technical Specifications

Image Sensors CYII4SC6600AA-HAC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FULL FRAME

Body Width:

24.13 inch

Body Height:

3.04 mm

Body Length/Diameter:

24.13 mm

Dynamic Range:

61 dB

Frame Rate:

5 fps

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Current:

80 mA

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

3-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.5X3.5

Sensitivity (V/lx.s):

1.57 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.5 V

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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