Loading...

CYII4SC6600AA-QAC

Onsemi

CYII4SC6600AA-QAC by Onsemi

CYII4SC6600AA-QAC by Onsemi is a 3.5x3.5 um CMOS image sensor with 40 MHz master clock, ideal for full-frame applications. Operating at 2.5-3.3V, it offers a dynamic range of 61 dB and sensitivity of 1.57 V/lx.s, suitable for digital voltage output interfaces in various imaging systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,403 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,403

-

-

-

-

Vyrian

USA . 839 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

839

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 79 parts In-Stock

1+ parts

$0.174

100+ parts

-

1k+ parts

-

10k+ parts

$0.167

79

$0.174

-

-

$0.167

Northwest PG Solutions

USA . 1,186 parts In-Stock

1+ parts

$0.192

100+ parts

-

1k+ parts

-

10k+ parts

$0.169

1,186

$0.192

-

-

$0.169

TANS Electronics

Latvia . 5,190 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,190

-

-

-

-

Problanco Electronics

Mexico . 4,448 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,448

-

-

-

-

Corphita

USA . 1,704 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,704

-

-

-

-

UHIMA Technologies

Türkiye . 880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

880

-

-

-

-

SupplyDigital Components

Austria . 521 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

521

-

-

-

-

Kulean Microsystems

USA . 438 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

438

-

-

-

-

Corohmni

South Africa . 351 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

351

-

-

-

-

Overview

Enhance your imaging applications with the CYII4SC6600AA-QAC Image Sensor by Onsemi. Designed with precision and innovation, this sensor offers unparalleled quality and reliability from a trusted manufacturer like Onsemi. With a wide range of applications in industries such as security, automotive, and medical imaging, this sensor delivers exceptional value and performance. Experience superior image quality, enhanced sensitivity, and advanced features that will take your projects to the next level. Invest in the CYII4SC6600AA-QAC for seamless integration and top-notch results every time.

Feature Benefit Bullets

Pixel Size (um): 3.5X3.5

Small pixel size allows for high resolution imaging and detailed capture of images.

Maximum Supply Voltage: 3.3 V

Operates efficiently within standard voltage range, ensuring compatibility with common power sources.

Master Clock: 40 MHz

High master clock frequency enables fast data processing and capture speed.

Body Width: 24.13 inch

Compact body size makes it suitable for a variety of applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS image sensor technology offers high image quality, low power consumption, and fast data readout.

Package Shape or Style: SQUARE

Square package shape ensures easy integration and alignment within devices or systems.

Minimum Supply Voltage: 2.5 V

Low minimum supply voltage allows for power-efficient operation and extends battery life in portable applications.

Maximum Operating Temperature: 50 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Output Range: 0.50-2V

Wide output voltage range provides flexibility in signal processing and compatibility with different circuit designs.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies signal processing and interface with digital systems.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for reliable performance even in cold environments.

Maximum Operating Current: 80 mA

Moderate operating current ensures efficient power consumption and extends device lifespan.

Housing: CERAMIC, METAL-SEALED COFIRED

Durable ceramic and metal-sealed housing provides robust protection against mechanical damage and environmental factors.

Dynamic Range: 61 dB

High dynamic range allows for capturing scenes with varying lighting conditions and maintaining detail in both dark and bright areas.

Body Length/Diameter: 24.13 mm

Compact body size makes it suitable for small form factor devices and easy integration into systems.

Termination Type: SOLDER

Solder termination ensures secure and reliable electrical connections for long-term performance.

Output Interface Type: 3-WIRE INTERFACE

3-wire interface simplifies connectivity and communication with external devices or systems.

Frame Rate: 5 fps

Decent frame rate allows for capturing smooth video footage and fast-moving scenes.

Array Type: FULL FRAME

Full-frame array design enables capturing the entire image in a single exposure, ensuring high-quality imaging.

Sensitivity (V/lx.s): 1.57 V/lx.s

High sensitivity allows for efficient light capture and produces clear and detailed images even in low light conditions.

Mounting Feature: SURFACE MOUNT

Surface mount design simplifies installation and allows for easy mounting on various PCBs or electronic assemblies.

Technical Specifications

Image Sensors CYII4SC6600AA-QAC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FULL FRAME

Body Width:

24.13 inch

Body Height:

3.04 mm

Body Length/Diameter:

24.13 mm

Dynamic Range:

61 dB

Frame Rate:

5 fps

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Current:

80 mA

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

3-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.5X3.5

Sensitivity (V/lx.s):

1.57 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.5 V

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20