Loading...

CYII4SM014KAA-GBC

Onsemi

CYII4SM014KAA-GBC by Onsemi

CYII4SM014KAA-GBC by Onsemi is an 8x8 um CMOS image sensor with a 15 MHz master clock and 65 dB dynamic range. It operates at temperatures from 0-50 °C and outputs analog voltage in the range of 0.50-3V. Ideal for applications requiring full-frame array sensors with SPI interface, such as industrial imaging systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,792 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,792

-

-

-

-

Digiode

USA . 185 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

185

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 763 parts In-Stock

1+ parts

$1.000

100+ parts

-

1k+ parts

-

10k+ parts

-

763

$1.000

-

-

-

Northwest PG Solutions

USA . 41 parts In-Stock

1+ parts

$1.100

100+ parts

-

1k+ parts

-

10k+ parts

-

41

$1.100

-

-

-

SupplyDigital Components

Austria . 4,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,976

-

-

-

-

TANS Electronics

Latvia . 3,808 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,808

-

-

-

-

Kulean Microsystems

USA . 747 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

747

-

-

-

-

Corphita

USA . 581 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

581

-

-

-

-

UHIMA Technologies

Türkiye . 497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

497

-

-

-

-

Problanco Electronics

Mexico . 466 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

466

-

-

-

-

Corohmni

South Africa . 61 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

61

-

-

-

-

Overview

Experience the unparalleled quality of Onsemi with the CYII4SM014KAA-GBC image sensor. Perfect for a wide range of applications, this cutting-edge technology offers customers exceptional value and benefits. With a sleek design and advanced features, this sensor provides high-quality images and precise data capture. Trust in Onsemi's reputation for excellence and discover the advantages of the CYII4SM014KAA-GBC today.

Feature Benefit Bullets

Pixel Size (um): 8X8

Small pixel size allows for high resolution images to be captured, making this image sensor ideal for applications requiring detailed imaging.

Maximum Supply Voltage: 3.3 V

The low maximum supply voltage ensures compatibility with a wide range of electronic devices and simplifies the power supply requirements for the sensor.

Master Clock: 15 MHz

High master clock frequency enables rapid data capture and processing, making this sensor suitable for applications requiring fast image acquisition.

Body Width: 32.4 inch

Compact body width allows for easy integration into various devices and systems without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS image sensors are known for their low power consumption, high sensitivity, and excellent image quality, making this sensor a reliable choice for imaging applications.

Body Height: 3.38 mm

Low body height ensures the sensor can be easily mounted in space-constrained environments or devices.

Package Shape or Style: RECTANGULAR

Rectangular package shape provides a standard form factor for easy mounting and compatibility with existing designs.

Maximum Operating Temperature: 50 °C

High maximum operating temperature tolerance ensures the sensor can withstand a wide range of environmental conditions and operate reliably in various applications.

Output Range: 0.50-3V

Wide output voltage range allows for flexibility in signal processing and interfacing with other electronic components.

Output Type: ANALOG VOLTAGE

Analog voltage output simplifies the interface with analog-to-digital converters and other signal processing components, enabling easy integration into existing systems.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the sensor can function in cold environments or during startup conditions without any issues.

Dynamic Range: 65 dB

Wide dynamic range allows the sensor to capture both bright and dark areas in a scene with high fidelity, resulting in accurate image reproduction.

Body Length/Diameter: 45.5 mm

Moderate body length provides a balance between compact size and ease of handling during installation and maintenance.

Termination Type: SOLDER

Solder termination ensures secure electrical connections and reliability in various operating conditions, making this sensor suitable for long-term use.

Output Interface Type: SPI INTERFACE

SPI interface allows for easy communication with microcontrollers and other devices, enabling seamless integration into digital systems.

Frame Rate: 3.25 fps

Moderate frame rate is suitable for applications where real-time image capture is not critical, such as surveillance or monitoring systems.

Array Type: FULL FRAME

Full-frame array type ensures that the entire sensor area is utilized for image capture, resulting in high-quality images with no cropping or loss of detail.

Mounting Feature: THROUGH HOLE MOUNT

Through-hole mounting feature provides secure mechanical attachment and reliable electrical connections, ensuring the sensor remains stable during operation.

Technical Specifications

Image Sensors CYII4SM014KAA-GBC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FULL FRAME

Body Width:

32.4 inch

Body Height:

3.38 mm

Body Length/Diameter:

45.5 mm

Dynamic Range:

65 dB

Frame Rate:

3.25 fps

Master Clock:

15 MHz

Mounting Feature:

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

SPI INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

8X8

Sensors or Transducers Type:

Maximum Supply Voltage:

3.3 V

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20