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CYII4SM6600AA-HBC

Onsemi

CYII4SM6600AA-HBC by Onsemi

CYII4SM6600AA-HBC by Onsemi is a 3.5x3.5 um CMOS image sensor with a 40 MHz master clock and 61 dB dynamic range. Ideal for applications requiring a digital voltage output interface, such as full-frame array cameras in industrial imaging systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,152 parts In-Stock

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Digiode

USA . 1,087 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 608 parts In-Stock

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$0.452

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$0.434

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Northwest PG Solutions

USA . 691 parts In-Stock

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$0.497

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$0.438

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Kulean Microsystems

USA . 7,341 parts In-Stock

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Problanco Electronics

Mexico . 7,276 parts In-Stock

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TANS Electronics

Latvia . 1,622 parts In-Stock

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SupplyDigital Components

Austria . 754 parts In-Stock

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UHIMA Technologies

Türkiye . 661 parts In-Stock

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Corphita

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Corohmni

South Africa . 275 parts In-Stock

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Overview

Capture every moment with crystal clear precision using the CYII4SM6600AA-HBC Image Sensor by Onsemi. Featuring cutting-edge technology and unparalleled quality, this sensor offers a wide range of applications that will elevate your imaging experience to new heights. From photography to security systems, this sensor provides exceptional value, benefits, and advantages that will exceed your expectations. Trust in Onsemi's reputation for excellence and choose the CYII4SM6600AA-HBC for all your imaging needs.

Feature Benefit Bullets

Pixel Size (um) 3.5X3.5

Smaller pixel size allows for higher resolution images with greater detail.

Maximum Supply Voltage 3.3 V

Wide operating voltage range provides flexibility in power supply options.

Master Clock 40 MHz

High master clock frequency enables fast image capture and processing.

Body Width 24.13 inch

Compact size allows for easy integration and placement in various devices.

Sensors or Transducers Type IMAGE SENSOR,CMOS

CMOS technology offers low power consumption and high sensitivity for accurate image capture.

Body Height 3.04 mm

Low profile design is suitable for applications with space constraints.

Package Shape or Style SQUARE

Square package shape simplifies assembly and mounting processes.

Minimum Supply Voltage 2.5 V

Low minimum supply voltage helps in reducing power consumption and extending battery life.

Maximum Operating Temperature 50 °C

Wide operating temperature range ensures reliable performance in various environmental conditions.

Output Range 0.50-2V

Wide output voltage range allows for accurate image signal processing and analysis.

Output Type DIGITAL VOLTAGE

Digital output simplifies connectivity and interface with other digital devices.

Minimum Operating Temperature 0 °C

Low minimum operating temperature ensures functionality in colder environments.

Maximum Operating Current 80 mA

Low operating current consumption helps in energy efficiency and heat management.

Housing CERAMIC, METAL-SEALED COFIRED

Durable housing materials provide protection and reliability in harsh industrial environments.

Dynamic Range 61 dB

Wide dynamic range ensures accurate representation of both dark and bright areas in the captured images.

Body Length/Diameter 24.13 mm

Compact form factor makes it suitable for integration in small devices without compromising performance.

Termination Type SOLDER

Solder termination offers secure and reliable electrical connections during installation.

Output Interface Type 3-WIRE INTERFACE

Simple 3-wire interface allows for easy communication and integration with external systems.

Frame Rate 5 fps

Decent frame rate ensures smooth video recording and real-time imaging applications.

Array Type FULL FRAME

Full-frame array design captures the entire image with high resolution and clarity.

Sensitivity (V/lx.s) 1.57 V/lx.s

High sensitivity enables accurate image capture even in low-light conditions.

Mounting Feature SURFACE MOUNT

Surface mountable design simplifies installation and integration in compact devices.

Technical Specifications

Image Sensors CYII4SM6600AA-HBC attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FULL FRAME

Body Width:

24.13 inch

Body Height:

3.04 mm

Body Length/Diameter:

24.13 mm

Dynamic Range:

61 dB

Frame Rate:

5 fps

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Current:

80 mA

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

3-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.5X3.5

Sensitivity (V/lx.s):

1.57 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.5 V

Termination Type:

SOLDER

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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