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KAI-0340-FBA-CB-AE-SINGLE

Onsemi

KAI-0340-FBA-CB-AE-SINGLE by Onsemi

KAI-0340-FBA-CB-AE-SINGLE by Onsemi is an image sensor with 7.4x7.4 um pixel size, 640x480 resolution, and 69 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor such as industrial cameras or medical devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,179 parts In-Stock

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Vyrian

USA . 1,650 parts In-Stock

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1,650

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Distributors (Availability)

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Problanco Electronics

Mexico . 4,183 parts In-Stock

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TANS Electronics

Latvia . 3,639 parts In-Stock

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Kulean Microsystems

USA . 3,115 parts In-Stock

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SupplyDigital Components

Austria . 2,936 parts In-Stock

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Corphita

USA . 538 parts In-Stock

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Corohmni

South Africa . 324 parts In-Stock

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UHIMA Technologies

Türkiye . 201 parts In-Stock

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Overview

Experience stunning image quality like never before with the KAI-0340-FBA-CB-AE-SINGLE by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch image sensors that are perfect for a wide range of applications. Whether you're capturing breathtaking landscapes or creating captivating videos, this product offers unmatched value, benefits, and advantages to customers. Upgrade your imaging capabilities with the KAI-0340-FBA-CB-AE-SINGLE and see the difference for yourself.

Feature Benefit Bullets

Pixel Size (um): 7.4X7.4

The small pixel size provides high resolution and detailed images.

Maximum Supply Voltage: 15.25 V

Allows for efficient power usage and prevents damage from overvoltage.

Body Width: 12.7 inch

Compact size makes it suitable for various applications and installations.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors provide high-quality image capture and are commonly used in professional imaging devices.

Body Height: 5.15 mm

Thin profile allows for easy integration into slim devices or assemblies.

Package Shape or Style: RECTANGULAR

Standard shape for easy mounting and compatibility with existing equipment.

Minimum Supply Voltage: 14.75 V

Allows for flexibility in power input while maintaining stable performance.

Maximum Operating Temperature: 70 °C

Can operate in high-temperature environments without risk of damage or malfunction.

Horizontal Pixel: 640

Higher pixel count allows for sharper and more detailed images.

Minimum Operating Temperature: -50 °C

Capable of functioning in extremely low-temperature conditions without issues.

Housing: CERAMIC

Provides durability and reliability, suitable for harsh environments or prolonged use.

Dynamic Range: 69 dB

Wide dynamic range ensures accurate and precise imaging in varying lighting conditions.

Vertical Pixel: 480

Combined with horizontal pixels, offers a balanced resolution for clear images.

Body Length/Diameter: 15.87 mm

Compact design for easy installation in space-constrained applications.

Optical Format (inch): 1/3

Popular format for image sensors, providing compatibility with a wide range of lenses and accessories.

Termination Type: SOLDER

Secure connection method for reliable data transmission and power supply.

Array Type: INTERLINE

Interline CCD arrays offer fast readout speeds and reduced blooming effects.

Mounting Feature: THROUGH HOLE MOUNT

Sturdy mounting option for secure attachment to PCBs or other surfaces.

Technical Specifications

Image Sensors KAI-0340-FBA-CB-AE-SINGLE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAS A SENSITIVITY OF 30 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER; IT ALSO HAVE DYNAMIC RANGE 62 DB

Array Type:

INTERLINE

Body Width:

12.7 inch

Body Height:

5.15 mm

Body Length/Diameter:

15.87 mm

Dynamic Range:

69 dB

Horizontal Pixel:

640

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-50 Cel

Optical Format (inch):

1/3

Package Shape or Style:

Pixel Size (um):

7.4X7.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.25 V

Minimum Supply Voltage:

14.75 V

Termination Type:

SOLDER

Vertical Pixel:

480

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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