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AR0220AT4R00XUEA1-DPBM

Onsemi

AR0220AT4R00XUEA1-DPBM by Onsemi

Onsemi's AR0220AT4R00XUEA1-DPBM is a 1/1.8 inch CMOS image sensor with 1828x948 pixels, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in frame arrays, this sensor provides high-quality imaging solutions in compact devices.

Median Price

$43.700

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

AR0220AT4R00XUEA1-DPBM by Onsemi
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,000 parts In-Stock

1+ parts

$58.890

100+ parts

$36.768

1k+ parts

-

10k+ parts

$35.042

2,000

$58.890

$36.768

-

$35.042

Rochester

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

$34.960

1k+ parts

$31.280

10k+ parts

$29.440

14,000

-

$34.960

$31.280

$29.440

Verical

USA . 14,000 parts In-Stock

1+ parts

-

100+ parts

$43.700

1k+ parts

$39.100

10k+ parts

$36.800

14,000

-

$43.700

$39.100

$36.800

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,323 parts In-Stock

1+ parts

$35.042

100+ parts

-

1k+ parts

-

10k+ parts

-

1,323

$35.042

-

-

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Digiode

USA . 1,156 parts In-Stock

1+ parts

$36.993

100+ parts

-

1k+ parts

-

10k+ parts

-

1,156

$36.993

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 360 parts In-Stock

1+ parts

$35.042

100+ parts

-

1k+ parts

-

10k+ parts

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360

$35.042

-

-

-

Corphita

USA . 228 parts In-Stock

1+ parts

$35.046

100+ parts

-

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-

10k+ parts

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228

$35.046

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Kulean Microsystems

USA . 5,819 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,819

-

-

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SupplyDigital Components

Austria . 5,122 parts In-Stock

1+ parts

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5,122

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TANS Electronics

Latvia . 3,910 parts In-Stock

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3,910

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

1+ parts

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2,500

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GreenTree Electronics

Israel . 1,880 parts In-Stock

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1,880

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Problanco Electronics

Mexico . 1,632 parts In-Stock

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1,632

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Northwest PG Solutions

USA . 1,531 parts In-Stock

1+ parts

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1,531

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Native Components

USA . 964 parts In-Stock

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964

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UHIMA Technologies

Türkiye . 311 parts In-Stock

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311

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Overview

Capture every moment with crystal-clear precision using the AR0220AT4R00XUEA1-DPBM image sensor by Onsemi. As a leader in image sensor technology, Onsemi delivers top-quality products that guarantee unmatched performance and reliability. This image sensor is perfect for a wide range of applications, from security cameras to automotive systems, providing customers with exceptional value, benefits, and advantages in capturing high-resolution images with ease. Trust Onsemi for cutting-edge technology that brings your visions to life.

Feature Benefit Bullets

Body Width: 9 inch

The compact size of the body makes this image sensor suitable for small handheld devices or applications where space is limited.

Sensors or Transducers Type: IMAGE SENSOR, CMOS

CMOS sensors are known for their low power consumption and high-quality image output, making this image sensor an efficient and reliable choice for imaging applications.

Body Height: 1.675 mm

The low profile of the body allows for easy integration into slim designs or applications requiring a thin form factor.

Package Shape or Style: RECTANGULAR

The rectangular package shape provides stability and ease of mounting, ensuring secure placement within the device.

Horizontal Pixel: 1828

With a high pixel count, this image sensor is capable of capturing detailed and sharp images, making it ideal for applications requiring high-resolution imaging.

Output Type: DIGITAL OUTPUT

Digital output simplifies the process of transferring and processing image data, making this image sensor suitable for digital imaging applications.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

The use of high-quality terminal finish materials like Tin, Silver, and Copper ensures reliable connectivity and longevity of the image sensor.

Vertical Pixel: 948

The vertical pixel count complements the high horizontal pixel count, enabling this image sensor to capture detailed and balanced images.

Body Length/Diameter: 12 mm

The compact body length/diameter of 12mm further enhances the versatility and ease of integration of this image sensor into various devices or systems.

Optical Format (inch): 1/1.8

The 1/1.8-inch optical format provides a good balance between sensor size and image quality, making this image sensor suitable for a wide range of imaging applications.

Termination Type: SOLDER

Solder termination ensures secure and stable connections, making this image sensor reliable and durable for long-term use.

Output Interface Type: 2-WIRE INTERFACE

The 2-wire interface simplifies the communication between the image sensor and other components, enabling seamless integration into various systems or devices.

Frame Rate: 60 fps

With a high frame rate of 60 fps, this image sensor can capture fast-moving objects or scenes with smooth and clear motion, making it ideal for dynamic imaging applications.

Array Type: FRAME

The frame array type allows for efficient and organized image capture, ensuring consistent and accurate results in imaging applications.

Mounting Feature: SURFACE MOUNT

The surface mount feature simplifies the installation and mounting process of this image sensor, making it suitable for automated assembly or production processes.

Technical Specifications

Image Sensors AR0220AT4R00XUEA1-DPBM attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

AEC-Q100, ROLLING SHUTTER

Array Type:

FRAME

Body Width:

9 inch

Body Height:

1.675 mm

Body Length/Diameter:

12 mm

Frame Rate:

60 fps

Horizontal Pixel:

1828

JESD-609 Code:

e1

Mounting Feature:

Optical Format (inch):

1/1.8

Output Interface Type:

2-WIRE INTERFACE

Output Type:

Package Shape or Style:

Sensors or Transducers Type:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Termination Type:

SOLDER

Vertical Pixel:

948

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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