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CYII4SC6600AA-HAC

Cypress Semiconductor

CYII4SC6600AA-HAC by Cypress Semiconductor

IMAGE SENSOR,CMOS; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Output Range: 0.50-2V; Body Height: 3.04 mm;

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Technical Specifications

Image Sensors CYII4SC6600AA-HAC attributes and parameters. Explore more Image Sensors devices from Cypress Semiconductor

Specs

Additional Features:

ROLLING SHUTTER

Array Type:

FULL FRAME

Body Width:

24.13 inch

Body Height:

3.04 mm

Body Length/Diameter:

24.13 mm

Dynamic Range:

61 dB

Frame Rate:

5 fps

Housing:

CERAMIC, METAL-SEALED COFIRED

Master Clock:

40 MHz

Mounting Feature:

Maximum Operating Current:

80 mA

Maximum Operating Temperature:

50 Cel

Minimum Operating Temperature:

0 Cel

Output Interface Type:

3-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

3.5X3.5

Sensitivity (V/lx.s):

1.57 V/lx.s

Sensors or Transducers Type:

Maximum Supply Voltage:

3.3 V

Minimum Supply Voltage:

2.5 V

Termination Type:

SOLDER

Manufacturer Highlights

Cypress Semiconductor

Cypress Semiconductor was an American semiconductor design and manufacturing company. It offered NOR flash memories, F-RAM and SRAM Traveo microcontrollers, PSoC programmable system-on-chip solutions, analog and PMIC Power Management ICs, CapSense capacitive touch-sensing controllers, Wireless BLE Bluetooth Low-Energy and USB connectivity solutions. Its headquarters were in San Jose, California, with operations in the United States, Ireland, India and the Philippines. In April 2016, Cypress Semiconductors announced the acquisition of Broadcom’s Wireless Internet of Things Business. The deal was closed in July 2016. In June 2019, Infineon Technologies announced it would acquire Cypress for $9.4 billion.The deal closed in April 2020, making Infineon one of the world's top 10 semiconductor manufacturers. Some of its main competitors included Microchip Technology, NXP Semiconductors, Renesas Electronics and Micron Technology.

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