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VG6640AB1M/1

STMicroelectronics

VG6640AB1M/1 by STMicroelectronics

VG6640AB1M/1 by STMicroelectronics is a CMOS image sensor featuring a 3.75x3.75 µm pixel size and a dynamic range of 132 dB. It operates b/w -40 °C to 125 °C, supports I2C interface, and delivers 60 fps for high-performance imaging applications. Ideal for advanced surveillance and automotive systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Avnet

USA . 1,750 parts In-Stock

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Anansix

USA . 2,838 parts In-Stock

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2,838

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Vyrian

USA . 2,549 parts In-Stock

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2,549

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Digiode

USA . 2,174 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,318 parts In-Stock

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$2.414

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$2.173

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1,318

$2.414

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$2.173

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MKK Technologies

India . 47 parts In-Stock

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$4.540

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47

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DigiPath Technology Company

USA . 47 parts In-Stock

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$4.540

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47

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Parana Technologies

USA . 2,328 parts In-Stock

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$2.886

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$2.886

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Corphita

USA . 892 parts In-Stock

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892

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Overview

Unlock the power of visual clarity with the VG6640AB1M/1 image sensor from STMicroelectronics, a leader in innovative semiconductor solutions. Designed for diverse applications, from automotive to industrial imaging, this high-performance CMOS sensor boasts exceptional dynamic range and reliability in extreme temperatures. With its rapid frame rate and user-friendly I2C interface, elevate your projects with superior quality and versatility, ensuring you achieve outstanding results every time.

Feature Benefit Bullets

Pixel Size: 3.75 x 3.75 µm

The compact pixel size allows for a higher resolution in a smaller sensor area, making it ideal for applications requiring detailed image capture without compromising size.

Sensor Type: IMAGE SENSOR, CMOS

CMOS technology offers low power consumption and high speed, making this sensor suitable for battery-operated devices or applications requiring fast image processing.

Maximum Operating Temperature: 125 °C

Withstanding high temperatures, this sensor is reliable for use in extreme environments, such as automotive and industrial applications.

Minimum Operating Temperature: -40 °C

The ability to operate in low temperatures ensures reliability in harsh conditions, making it suitable for outdoor and remote applications.

Dynamic Range: 132 dB

A high dynamic range allows the sensor to capture a greater variety of light levels, improving performance in both bright and dim conditions and enhancing image quality.

Optical Format: 1/2.7 inch

This optical format offers a balance between size and performance, making it versatile for various camera systems, particularly in compact devices.

Termination Type: SOLDER

The solder termination type ensures robust connections, which is crucial for maintaining sensor performance in high-vibration environments.

Output Interface Type: I2C INTERFACE

The I2C interface allows for easy integration with microcontrollers and other devices, enhancing design flexibility and simplifying communication.

Frame Rate: 60 fps

A frame rate of 60 fps supports smooth video capture, making the sensor suitable for high-definition video applications such as surveillance or action cameras.

Array Type: FRAME

The frame array type is optimal for capturing complete images at once, which is essential for traditional photography and video recording.

Mounting Feature: SURFACE MOUNT

Surface mount technology facilitates compact designs and efficient assembly processes, making this sensor a great choice for modern electronics.

Technical Specifications

Image Sensors VG6640AB1M/1 attributes and parameters. Explore more Image Sensors devices from STMicroelectronics

Specs

Additional Features:

AEC-Q100; ELECTRICAL ROLLING SHUTTER

Array Type:

FRAME

Dynamic Range:

132 dB

Frame Rate:

60 fps

Mounting Feature:

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/2.7

Output Interface Type:

I2C INTERFACE

Pixel Size (um):

3.75X3.75

Sensors or Transducers Type:

Termination Type:

SOLDER

Trade Compliance

VG6640AB1M/1 Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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