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KAE-02152-FBB-SD-EE

Onsemi

KAE-02152-FBB-SD-EE by Onsemi

KAE-02152-FBB-SD-EE by Onsemi is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 86dB dynamic range. Ideal for applications requiring high-quality imaging in industrial cameras, surveillance systems, and medical devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,500 parts In-Stock

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Digiode

USA . 90 parts In-Stock

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90

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SupplyDigital Components

Austria . 7,328 parts In-Stock

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Kulean Microsystems

USA . 7,302 parts In-Stock

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Problanco Electronics

Mexico . 1,130 parts In-Stock

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Corphita

USA . 1,116 parts In-Stock

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TANS Electronics

Latvia . 638 parts In-Stock

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Corohmni

South Africa . 498 parts In-Stock

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UHIMA Technologies

Türkiye . 207 parts In-Stock

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Overview

Unleash the power of crystal-clear imaging with the KAE-02152-FBB-SD-EE by Onsemi. As a leader in image sensor technology, Onsemi delivers top-notch quality and reliability. Ideal for a wide range of applications, this CCD image sensor boasts a high dynamic range and exceptional pixel size for stunning visuals. Say goodbye to blurred images and hello to precision with the KAE-02152-FBB-SD-EE. Dive into a world of endless possibilities and elevate your imaging experience today!

Feature Benefit Bullets

Pixel Size (um): 5.5X5.5

Provides high resolution images with detailed and sharp results.

Body Width: 29.97 inch

Sufficiently compact size for easy integration into various devices.

Sensors or Transducers Type: IMAGE SENSOR,CCD

CCD sensors offer high-quality image capture and low noise performance.

Body Height: 5.38 mm

Slim profile allows for versatile mounting options.

Package Shape or Style: RECTANGULAR

Standard shape for easy handling and installation.

Maximum Operating Temperature: 40 °C

Suitable for use in a wide range of environments and conditions.

Horizontal Pixel: 1920

High pixel count enables detailed and clear horizontal image capture.

Output Type: CURRENT OUTPUT

Provides accurate and efficient data transfer for image processing.

Minimum Operating Temperature: -40 °C

Ensures reliability even in extreme cold temperatures.

Housing: CERAMIC

Durable and reliable material for protecting the sensitive components.

Dynamic Range: 86 dB

Wide dynamic range for capturing both bright and dark areas in the image.

Vertical Pixel: 1080

High pixel count ensures detailed vertical image capture.

Body Length/Diameter: 33 mm

Compact design for easy integration into various devices.

Optical Format (inch): 2/3

Compatible with a wide range of lenses for different imaging applications.

Termination Type: SOLDER

Robust termination method for secure connections.

Array Type: INTERLINE

Efficient and reliable array design for capturing images.

Mounting Feature: THROUGH HOLE MOUNT

Secure mounting option for stable installation in devices.

Technical Specifications

Image Sensors KAE-02152-FBB-SD-EE attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

IT HAVE OUTPUT SENSTIVITY OF 44 MICRO VOLT PER ELECTRON

Array Type:

INTERLINE

Body Width:

29.97 inch

Body Height:

5.38 mm

Body Length/Diameter:

33 mm

Dynamic Range:

86 dB

Horizontal Pixel:

1920

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

40 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

2/3

Output Type:

Package Shape or Style:

Pixel Size (um):

5.5X5.5

Sensors or Transducers Type:

Termination Type:

SOLDER

Vertical Pixel:

1080

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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