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MT9V032C12STM-TP

Onsemi

MT9V032C12STM-TP by Onsemi

Onsemi's MT9V032C12STM-TP is a 1/3" CMOS image sensor with 6x6 um pixel size, offering 752H x 480V resolution. Operating at up to 26.6 MHz master clock, it provides a dynamic range of 54.4 dB and supports digital current output interface. Ideal for applications requiring high-quality imaging at temperatures ranging from -30°C to 70°C.

Median Price

$15.413

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

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$15.413

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Vyrian

USA . 8,593 parts In-Stock

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Digiode

USA . 697 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 812 parts In-Stock

1+ parts

$10.907

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$10.907

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Ampacity Inc.

Singapore . 253 parts In-Stock

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$13.750

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Corohmni

South Africa . 83 parts In-Stock

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$15.102

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Bastille Electronics

Australia . 300 parts In-Stock

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$15.410

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$14.640

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$13.715

300

$15.410

$14.640

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$13.715

Continental Prestige Electronics

USA . 2,202 parts In-Stock

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$15.413

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$15.105

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Kulean Microsystems

USA . 8,094 parts In-Stock

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Problanco Electronics

Mexico . 6,184 parts In-Stock

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SupplyDigital Components

Austria . 5,971 parts In-Stock

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TANS Electronics

Latvia . 3,661 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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Corphita

USA . 1,194 parts In-Stock

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Argo Parts USA

USA . 1,159 parts In-Stock

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UHIMA Technologies

Türkiye . 260 parts In-Stock

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Overview

Enhance your imaging solutions with the MT9V032C12STM-TP Image Sensor from Onsemi. Known for their superior quality and cutting-edge technology, Onsemi delivers top-of-the-line products that exceed industry standards. This sensor is perfect for a wide range of applications, offering unparalleled performance and reliability. Experience exceptional value and benefits with the MT9V032C12STM-TP, providing customers with the advantage they need to stay ahead in today's competitive market. Elevate your imaging projects with this innovative sensor and unlock endless possibilities.

Feature Benefit Bullets

Pixel Size (um): 6X6

The small pixel size allows for high resolution images to be captured with great detail.

Maximum Supply Voltage: 3.6 V

Provides sufficient power for optimal performance without risking damage to the sensor.

Master Clock: 26.6 MHz

The high master clock frequency enables fast data readout and processing, leading to quicker image capturing.

Body Width: 11.43 inch

The compact body width makes it suitable for integration into various devices without taking up much space.

Sensors or Transducers Type: IMAGE SENSOR,CMOS

CMOS sensor technology offers low power consumption and high sensitivity, leading to efficient performance.

Body Height: 2.3 mm

The slim body height allows for easy incorporation into slim devices or applications.

Package Shape or Style: SQUARE

The square package shape provides stability and ease of mounting.

Minimum Supply Voltage: 3 V

Provides reliable operation even at low power supply levels.

Maximum Operating Temperature: 70 °C

Can withstand higher temperatures, making it suitable for various environmental conditions.

Horizontal Pixel: 752

Higher number of horizontal pixels result in sharper and more detailed images.

Output Range: -9-9mA

The wide output range allows for flexibility in signal processing and adjustment.

Output Type: DIGITAL CURRENT

Provides digital output signals for easy integration with other digital systems.

Minimum Operating Temperature: -30 °C

Capable of functioning even in very low temperatures, increasing its versatility.

Maximum Operating Current: 60 mA

Operates within a reasonable current range, ensuring efficient power consumption.

Housing: CERAMIC

The ceramic housing offers durability and protection to the sensitive components within.

Dynamic Range: 54.4 dB

A high dynamic range allows for capturing both bright and dark areas in a scene accurately.

Vertical Pixel: 480

Higher number of vertical pixels result in clearer and more detailed images.

Body Length/Diameter: 11.43 mm

Compact body length makes it easy to fit into various designs or applications.

Optical Format (inch): 1/3

The 1/3 inch optical format is commonly used in various imaging applications, ensuring compatibility.

Termination Type: SOLDER

Solder termination allows for secure connections and reliable performance.

Output Interface Type: 2-WIRE INTERFACE

2-wire interface enables easy communication with other devices or systems.

Frame Rate: 60 fps

High frame rate allows for smooth and detailed video capture without motion blur.

Array Type: FRAME

The frame array type enables capturing images in a structured grid pattern for better image quality.

Mounting Feature: SURFACE MOUNT

Surface mount capability allows for easy and secure installation in various electronic devices or PCBs.

Technical Specifications

Image Sensors MT9V032C12STM-TP attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

GLOBAL SHUTTER, IT ALSO HAVE DYNAMIC RANGE 80 DB-100 DB IN HDR MODE

Array Type:

FRAME

Body Width:

11.43 inch

Body Height:

2.3 mm

Body Length/Diameter:

11.43 mm

Dynamic Range:

54.4 dB

Frame Rate:

60 fps

Horizontal Pixel:

752

Housing:

CERAMIC

Master Clock:

26.6 MHz

Mounting Feature:

Maximum Operating Current:

60 mA

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Optical Format (inch):

1/3

Output Interface Type:

2-WIRE INTERFACE

Output Range:

Output Type:

Package Shape or Style:

Pixel Size (um):

6X6

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Termination Type:

SOLDER

Vertical Pixel:

480

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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