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VG6640AB1M

STMicroelectronics

VG6640AB1M by STMicroelectronics

VG6640AB1M by STMicroelectronics is a high-performance CMOS image sensor featuring a 3.75µm pixel size and a dynamic range of 132 dB. It operates in extreme temperatures from -40 °C to 125 °C, making it ideal for demanding applications. With a frame rate of 60 fps and I2C interface, it's perfect for advanced imaging solutions.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,112 parts In-Stock

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4,112

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Digiode

USA . 1,109 parts In-Stock

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Anansix

USA . 1,041 parts In-Stock

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1,041

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 792 parts In-Stock

1+ parts

$1.636

100+ parts

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$1.472

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792

$1.636

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$1.472

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MKK Technologies

India . 1,059 parts In-Stock

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$3.076

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$3.076

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DigiPath Technology Company

USA . 1,059 parts In-Stock

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$3.076

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1,059

$3.076

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Corphita

USA . 4,140 parts In-Stock

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4,140

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GreenTree Electronics

Israel . 2,400 parts In-Stock

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2,400

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Parana Technologies

USA . 943 parts In-Stock

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$1.956

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943

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$1.956

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Overview

Elevate your imaging solutions with the VG6640AB1M image sensor from STMicroelectronics, a leader in high-performance semiconductor technology. Boasting exceptional dynamic range and robust temperature resilience, this CMOS sensor is designed for a variety of applications, from industrial automation to advanced surveillance systems. Experience unparalleled image clarity and reliability that empower your innovations, ensuring your projects shine with quality and precision. Choose VG6640AB1M for superior performance and peace of mind in every frame!

Feature Benefit Bullets

Pixel Size: 3.75X3.75 um

The small pixel size allows for high pixel density, resulting in greater detail and improved image quality, making it ideal for applications requiring high-resolution imagery.

Sensor Type: IMAGE SENSOR, CMOS

CMOS technology enables lower power consumption and faster readout times, enhancing the sensor's performance in various lighting conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this sensor can function reliably in demanding environments, making it suitable for industrial and automotive applications.

Minimum Operating Temperature: -40 °C

The wide temperature range ensures functionality in extreme conditions, enhancing versatility for outdoor or harsh environment use.

Dynamic Range: 132 dB

A high dynamic range allows the sensor to capture a wider range of light intensities, resulting in better image quality in scenes with both bright and dark areas.

Optical Format: 1/2.7 inch

This optical format allows for compatibility with various lenses and systems, providing flexibility in design and application.

Termination Type: SOLDER

Solder termination ensures a solid and reliable electrical connection, which is critical for maintaining signal integrity in various applications.

Output Interface Type: I2C INTERFACE

The I2C interface simplifies communication with microcontrollers and other peripherals, enabling easy integration into systems.

Frame Rate: 60 fps

A frame rate of 60 fps provides smooth video capture, making this sensor ideal for applications requiring real-time imaging, such as surveillance or video conferencing.

Array Type: FRAME

A frame array type allows for full-frame imaging, which is beneficial for capturing complete scenes without the risk of missing important information.

Mounting Feature: SURFACE MOUNT

Surface mount technology offers compact and efficient installation, saving space on the PCB and facilitating integration into a wide range of devices.

Technical Specifications

Image Sensors VG6640AB1M attributes and parameters. Explore more Image Sensors devices from STMicroelectronics

Specs

Additional Features:

AEC-Q100; ELECTRICAL ROLLING SHUTTER

Array Type:

FRAME

Dynamic Range:

132 dB

Frame Rate:

60 fps

Mounting Feature:

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Optical Format (inch):

1/2.7

Output Interface Type:

I2C INTERFACE

Pixel Size (um):

3.75X3.75

Sensors or Transducers Type:

Termination Type:

SOLDER

Trade Compliance

VG6640AB1M Sensors & Transducers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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