Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
Choose from over than a million of proven quality materials. Over 300 manufacturers are presented. From renowned major international players to small independent companies with a proven track record in local markets.
Featured manufacturers
IMAGE SENSOR,CCD;
Median Price
-
Lifecycle Status
Suppliers In-Stock
2
In-Stock Inventory
1k+
Vyrian
1+ parts
100+ parts
1k+ parts
10k+ parts
Digiode
Kulean Microsystems
Problanco Electronics
SupplyDigital Components
TANS Electronics
Corphita
Corohmni
UHIMA Technologies
Image Sensors KAI-0340-AAA-CP-AA-S attributes and parameters. Explore more Image Sensors devices from Onsemi
Sensors or Transducers Type:
PCN Obsolescence/ EOL - Mult Dev EOL 17/Apr/2019
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
2N2222A
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
SMBJ18CA
Taiwan Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Siliconix
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Drain Current (ID): .115 A; Operating Mode: ENHANCEMENT MODE;
LM358M
Onsemi
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
LM317T
Comset Semiconductors
Other Regulators; No. of Terminals: 3; Terminal Pitch: 2.54 mm; Minimum Output Voltage-1: 1.2 V; Technology: BIPOLAR; Operating Temperature (TJ-Max): 125 Cel;
Fairchild Semiconductor
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Maximum Time At Peak Reflow Temperature (s): 30; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR;
DS18B20Z+
Maxim Integrated
TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL; Mounting Feature: SURFACE MOUNT; No. of Terminals: 8; Package Shape or Style: RECTANGULAR; Body Width: 3.9 inch; Maximum Supply Voltage: 5.5 V;
FDC5614P
TAIZHOU ELECTRONICS CO LTD
P-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): 1.92 W; Maximum Operating Temperature: 150 Cel; Package Body Material: PLASTIC/EPOXY;
LM555CM
Intersil
Analog Waveform Generation Functions; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
BAV99
Silicon Standard
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
USB2514BI-AEZG
Standard Microsystems
BUS CONTROLLER, UNIVERSAL SERIAL BUS; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 36; Package Code: HVQCCN; Package Shape: SQUARE;
Dionics-usa
NPN; Configuration: SINGLE; Surface Mount: YES; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
BSS138NH6327XTSA2
Infineon Technologies
BSS138NH6327XTSA2 by Infineon is a N-CHANNEL FET with 60V DS Breakdown Voltage, ideal for small signal applications. Operating in Enhancement Mode, it has 0.36W Power Dissipation and 3.5 ohm Drain-Source Resistance. With Gull Wing terminals and AEC-Q101 reference standard, it's suitable for automotive electronics due to its high temperature range of -55 to 150 °C.
Meritek Electronics
1N4148
Laube Technology
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
261
Micronetics
Other Interface ICs; Temperature Grade: MILITARY; Terminal Form: FLAT; No. of Terminals: 14; Package Code: DFP; Package Shape: SQUARE;
LL4148
Rectron
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
Shanghai Lunsure Electronic Technology
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; JESD-30 Code: O-MBCY-W3;
Eic Semiconductor
KAF-10500-CXA-JH-AE-OFFSET
Image Sensors;
KAI-43140-AXA-JD-B2
Onsemi's KAI-43140-AXA-JD-B2 is a 4.5x4.5 um CCD image sensor with 8040 (H) x 5360 (V) pixels, offering a dynamic range of 60 dB. Operating at temperatures from -50 to 70 °C, it has a data rate of 60 Mbps and is ideal for high-resolution imaging applications.
AR0220AT4B00XUEA2-TPBR-E
Onsemi's AR0220AT4B00XUEA2-TPBR-E is a 1/1.8" CMOS image sensor with 1828x948 pixels, offering digital output via a 2-wire interface at 60 fps. Ideal for surface mount applications in frame arrays, this sensor measures 9"x12mm and has a height of 1.7mm, making it suitable for compact imaging devices.
KAF-0402-ABA-CP-B1
Onsemi's KAF-0402-ABA-CP-B1 is a CCD image sensor with 9x9 um pixel size, offering 768H x 512V resolution. It operates at 14.75-15.5 V supply voltage range, providing a dynamic range of 76 dB. Ideal for full-frame applications requiring high-quality imaging with a data rate of 10 Mbps.
KAI-0340-AAA-CP-AE-DUAL
The Onsemi KAI-0340-AAA-CP-AE-DUAL is a 640x480 CCD image sensor with 7.4um pixel size, offering a dynamic range of 69dB. It operates b/w -50 to 70 °C, suitable for industrial imaging applications requiring high-quality images in varying conditions. The rectangular package style and through-hole mounting feature make it easy to integrate into systems.
MN34041PLJ
Panasonic
MT9V022IA7ATM-DR
The Onsemi MT9V022IA7ATM-DR is a CMOS image sensor with 6x6 um pixel size, 752H x 480V resolution, and 26.6 MHz master clock. It operates at -40 to 85°C, has a dynamic range of 54.4 dB, and uses a digital current output interface. Ideal for applications requiring high-quality imaging in a compact form factor like surveillance cameras or industrial machine vision systems.
MT9V128IA3XTC-DR1
IMAGE SENSOR,CMOS; JESD-609 Code: e1; Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu);
NOIX3SE012KB-LTI1
NOIX3SE012KB-LTI1 by Onsemi is an Image Sensor with 3.2X3.2 um Pixel Size, 32.4 MHz Master Clock, and 4096 Horizontal Pixels. Ideal for applications requiring high-resolution imaging such as surveillance cameras, industrial inspection systems, and medical imaging devices due to its superior performance and digital output interface (I2C/SPI).
MT9P031I12STC
The Onsemi MT9P031I12STC image sensor features 2.2x2.2 um pixel size, 96 MHz master clock, and 2592 horizontal pixels. Ideal for applications requiring a digital voltage output interface, such as surveillance cameras and industrial imaging systems.
KAI-0330-ABA-CB-AA
The Onsemi KAI-0330-ABA-CB-AA is a 9x9 um CCD image sensor with 648 (H) x 484 (V) pixels. It operates at temperatures from -50 to 70 °C and has a dynamic range of 57 dB. Ideal for applications requiring high-quality imaging in industrial or scientific settings.
KAI-16000-AAA-JD-B2
KAI-16000-AAA-JD-B2 by Onsemi is an image sensor with 7.4x7.4 um pixel size, 65 dB dynamic range, and 4872 horizontal pixels. It is used in applications requiring high-resolution imaging such as industrial machine vision systems and scientific cameras.
AR0522SRSC09SURA0-DP
Onsemi's AR0522SRSC09SURA0-DP is a 12x1.62mm CMOS image sensor with 2592x1944 resolution, 1/2.5" optical format, and 60fps frame rate. It offers digital output via a 2-wire interface and is housed in a plastic package for surface mount applications.
CMV2000-3E5C1PP
Ams Ag
CMV2000-3E5C1PP by Ams Ag is a 2/3-inch CMOS image sensor with 2048x1088 pixels, offering a high dynamic range of 90 dB. With a pixel size of 5.5um, it operates b/w -30°C to 70°C and features an SPI interface for fast data transfer. Ideal for applications requiring high-speed imaging such as machine vision and industrial inspection.
NOIP1FN025KA-GDI
NOIP1FN025KA-GDI by Onsemi is an image sensor with 4.5x4.5 um pixel size, 360 MHz master clock, and 5120x5120 resolution. It operates b/w -40 to 85 °C and has a dynamic range of 59 dB. Ideal for high-resolution imaging applications requiring fast frame rates up to 80 fps.
KAI-08050-ABA-JD-AE
The Onsemi KAI-08050-ABA-JD-AE is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 °C to 70°C and has an optical format of 4/3 inch. Ideal for applications requiring high-quality imaging in industrial and scientific fields at a frame rate of 16 fps.
MT9V024IA7XTM-DP2
MT9V024IA7XTM-DP2 by Onsemi is a 1/3" CMOS image sensor with 6x6 um pixel size, offering 60 fps frame rate. Ideal for surface mount applications in various imaging devices due to its compact 9mm square package design.
KAI-04050-AAA-JP-AE
KAI-04050-AAA-JP-AE by Onsemi is a 5.5x5.5um CCD image sensor with 2336H x 1752V pixels, offering a dynamic range of 64dB. It features an interline array type and through-hole mounting, suitable for applications in high-resolution imaging systems requiring precise color reproduction and low-light performance.
MT9V034C12STC-DR
MT9V034C12STC-DR by Onsemi is a 1/3-inch CMOS image sensor with 752x480 pixels, 6x6 um pixel size, and 27 MHz master clock. Ideal for applications requiring high-resolution imaging at up to 60 fps, it offers a dynamic range of 100 dB and operates b/w -30 to 70 °C.
KAI-0372M
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAI-02150-CBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Optical Format (inch): 2/3; Pixel Size (um): 5.5X5.5; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON;
Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Minimum Operating Temperature: -50 Cel; Minimum Supply Voltage: 14.5 V;
KAI-02150-ABA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 64 dB; Maximum Operating Temperature: 70 Cel; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Additional Features: IT HAS OUTPUT SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Optical Format (inch): 2/3;
Onsemi's KAI-02150-ABA-JD-BA is a 2/3" CCD image sensor with 1920x1080 resolution, 5.5um pixel size, and 64dB dynamic range. It operates b/w -50 to 70°C, suitable for industrial cameras and machine vision applications.
KAI-04050-FBA-JB-B2
KAI-04050-FBA-JB-B2 by Onsemi is an image sensor with 5.5x5.5 um pixel size, 2336 horizontal pixels, and 1752 vertical pixels. It operates b/w -50 to 70°C, has a dynamic range of 64 dB, and requires a supply voltage of 14.5-15.5 V. This rectangular CCD sensor is ideal for applications requiring high-quality imaging in various environments.
KAI-02150-AAA-JP-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Array Type: INTERLINE; Vertical Pixel: 1080; Pixel Size (um): 5.5X5.5;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Minimum Operating Temperature: -50 Cel; Dynamic Range: 64 dB;
KAI-01150-CBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Dynamic Range: 64 dB; Array Type: INTERLINE;
KAI-01050-FBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Package Shape or Style: SQUARE; Body Width: 18.29 inch; Housing: CERAMIC; Horizontal Pixel: 1024;
KAI-01150-CBA-JB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33.02 mm; Array Type: INTERLINE;
KAI-01150-ABA-JD-BA
KAI-01050-CBA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 5.5X5.5; Maximum Operating Temperature: 70 Cel;
KAI-01150-CBA-FD-BA
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Horizontal Pixel: 1280; Body Length/Diameter: 18.29 mm;
KAI-01050-ABA-JD-BA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Termination Type: SOLDER; Array Type: INTERLINE;
KAI-01150-CBA-JB-B2
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Optical Format (inch): 1/2;
KAI-01050-ABA-FD-BA
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Optical Format (inch): 1/2; Minimum Operating Temperature: -50 Cel;
KAI-01050-CBA-FD-AE
IMAGE SENSOR,CCD; Mounting Feature: SURFACE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: SQUARE; Maximum Supply Voltage: 15.5 V; Minimum Operating Temperature: -50 Cel;
KAI-01050-FBA-JD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Additional Features: IT HAS SENSITIVITY OF 34 MICRO VOLT PER ELECTRON; Maximum Supply Voltage: 15.5 V; Termination Type: SOLDER;
Supply Digital Components
$106.00
$54.25
$11.90
$7.29
Quantity
12,000 In-Stock
Total price ≈ $80,197.29
© 2023 All rights reserved