Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi KAF-8300-AXC-CD-AE is a CCD image sensor with 5.4x5.4 um pixel size, offering a dynamic range of 64.4 dB and 3326 horizontal pixels. It operates b/w -10 to 70 °C, making it suitable for high-resolution imaging applications in various industries such as astronomy and microscopy.
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Kulean Microsystems
This small pixel size allows for high resolution images to be captured, making this product ideal for applications requiring detailed image quality.
The higher maximum supply voltage enables the sensor to operate efficiently and reliably even under fluctuating power conditions.
The compact body width makes it easy to integrate this image sensor into various devices or systems without taking up too much space.
The CCD sensor type provides high-quality images with low noise, making it suitable for demanding imaging applications.
The rectangular package shape offers ease of handling and mounting, ensuring straightforward integration into different setups.
The lower minimum supply voltage ensures efficient power consumption, making this image sensor energy-efficient and cost-effective.
The high maximum operating temperature range allows this sensor to be used in various environmental conditions without performance degradation.
The high horizontal pixel count results in detailed and sharp images, making this sensor suitable for applications requiring precise image capture.
The analog voltage output provides compatibility with a wide range of signal processing systems, offering flexibility in data processing.
The low minimum operating temperature ensures the sensor can operate reliably even in cold environments, making it versatile in various settings.
The ceramic housing offers durability and thermal stability, protecting the sensor components and ensuring long-term performance reliability.
The high dynamic range allows the sensor to capture both bright and dark areas of an image accurately, making it suitable for high-contrast scenes.
The vertical pixel count contributes to the sensor's high-resolution capabilities, ensuring detailed image capture in both horizontal and vertical dimensions.
The compact body length provides flexibility in mounting options and compatibility with a range of devices, making this sensor versatile in various applications.
The high data rate allows for fast and efficient transfer of image data, ensuring real-time imaging and responsiveness in data-intensive applications.
The solder termination offers secure and reliable connections, ensuring stable operation and reducing the risk of signal loss or interference.
The full-frame array type provides uniform image quality and resolution across the entire sensor area, making it suitable for professional imaging applications.
The through-hole mounting feature simplifies the installation process, providing secure placement and alignment for the sensor in various setups or configurations.
Image Sensors KAF-8300-AXC-CD-AE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Data Rate:
Dynamic Range:
Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Maximum Supply Voltage:
Minimum Supply Voltage:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
1N4148
Continental Device India
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
ATMEGA328P-AU
Microchip Technology
ATMEGA328P-AU by Microchip: 8-bit RISC CPU, 20 MHz clock, 23 I/O lines. Ideal for industrial applications with SPI, TWI, USART connectivity and low power mode. Features include 2048 RAM bytes, 1024 EEPROM size, and 16384 ROM words.
LL4148
Changzhou Galaxy Century Microelectronics
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
LM107H
General Electric Solid State
OPERATIONAL AMPLIFIER; Temperature Grade: MILITARY; Terminal Form: WIRE; No. of Terminals: 8; Package Shape: ROUND; Minimum Voltage Gain: 25000;
BAV99
Philips Semiconductors
RECTIFIER DIODE; Surface Mount: YES; Maximum Output Current: .1 A; Peak Reflow Temperature (C): 260; Terminal Finish: MATTE TIN; Maximum Reverse Recovery Time: .006 us;
SMMBT3904LT1G
Onsemi
SMMBT3904LT1G by Onsemi is a NPN BJT with 3 terminals, 0.3W power dissipation, and 40V max collector-emitter voltage. Ideal for small outline applications requiring a transistor with hFE of at least 30, it operates up to 150°C and has a transition frequency of 300MHz.
M24308/2-1F
Cristek Interconnects
D SUBMINIATURE CONNECTOR; Option: GENERAL PURPOSE; Contact Gender: FEMALE; No. of Rows Loaded: 2; Shell Size: 1/E; Filter Feature: NO;
2N7002
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .83 W; Package Body Material: PLASTIC/EPOXY; JEDEC-95 Code: TO-236AB;
BSS138
Weitron Technology
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; Maximum Power Dissipation (Abs): .225 W; Terminal Form: GULL WING; Terminal Position: DUAL;
1N4148WS
Fairchild Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BSS123-7-F
Diodes Incorporated
BSS123-7-F by Diodes Inc. is a N-channel FET with 100V DS breakdown voltage and 0.17A drain current. Ideal for switching applications, it features a single configuration with built-in diode, operates in enhancement mode, and has a max power dissipation of 0.3W.
ABS10-32.768KHZ-T
Abracon
Abracon's ABS10-32.768KHZ-T crystal oscillator offers 20 ppm frequency tolerance, 122% stability, and 70000 ohm series resistance. Ideal for applications requiring precise timing at 0.032768 MHz, such as IoT devices and wearables due to its compact size and low power consumption.
2N2222A
SPC TECHNOLOGY/ MULTICOMP
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
New England Semiconductor
General Semiconductor
CL31B104KBCNNNC
Samsung Electro-mechanics
Samsung Electro-mechanics CL31B104KBCNNNC is a ceramic capacitor with 0.1uF capacitance and 50V rated DC voltage. It features X7R temperature characteristics, -55 to 125 °C operating range, and compact SMT package style. Ideal for applications requiring high reliability in compact electronic devices.
MMBT3904-7-F
Diodes Inc. MMBT3904-7-F is a NPN BJT transistor for switching applications. Features include VCEsat of 0.3V, hFE of 30, and IC of 0.2A. With a max operating temp of 150°C, it's ideal for small outline SMT designs in automotive electronics.
SS14
Goodwork Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
RC0805FR-0710RL
Yageo
Yageo's RC0805FR-0710RL is a 10 ohm SMT fixed resistor with 1% tolerance and 0.125 W power dissipation. With a temperature range of -55 to 155 °C, it suits applications requiring precise resistance values in compact surface mount designs.
BSS138PS,115
Nexperia
N-CHANNEL; Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE; Surface Mount: YES; No. of Elements: 2; No. of Terminals: 6; Minimum DS Breakdown Voltage: 60 V;
AR1820HSSC12SHEA0-DP
AR1820HSSC12SHEA0-DP by Onsemi is a 1/2.3 inch CMOS image sensor with 1.25um pixel size and 24 fps frame rate. It features Tin/Silver/Copper terminal finish, ideal for high-quality imaging applications in consumer electronics, security cameras, and industrial automation systems.
KAI-43140-FXA-JD-AE
KAI-43140-FXA-JD-AE by Onsemi is an image sensor with 4.5x4.5 um pixel size, 8040 horizontal pixels, and 5360 vertical pixels. It operates b/w -50 to 70 °C with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
EV76C560ABT-EQV
Teledyne E2v (Uk)
Teledyne E2v's EV76C560ABT-EQV is a 1280x1024 CMOS image sensor with 5.3um pixel size, operating at -30 to 65°C. It has a digital output range of 0.55-1.25V and supports frame rates up to 60 fps, making it ideal for high-resolution imaging applications in various industries.
KAI-2001M
Image Sensors;
KAI-16050-CXA-JD-B1
The Onsemi KAI-16050-CXA-JD-B1 is a 5.5x5.5 um CCD image sensor with 4896 (H) x 3264 (V) pixels, offering a dynamic range of 64 dB. It operates at temperatures ranging from -50 to 70 °C and requires a power supply of 15V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-29050-PXA-JD-B1
Onsemi's KAI-29050-PXA-JD-B1 is a 5.5X5.5 um CCD image sensor with 6576Hx4384V pixels, offering a dynamic range of 64 dB. Operating b/w -50 to 70 °C, it requires a 15V power supply and has an optical format of 4/2.99 inch. Ideal for applications requiring high-resolution imaging in varying temperatures.
NOIP1FN016KA-GTI
NOIP1FN016KA-GTI by Onsemi is an Image Sensor with 4.5x4.5 um pixel size, 360 MHz master clock, and 4096x4096 resolution. It operates b/w -40 to 85 °C and has a dynamic range of 59 dB. Ideal for high-speed imaging applications requiring precise detail capture at varying light levels.
AMIS-710317-A6
Image Sensors; Minimum Operating Temperature: 0 Cel; Horizontal Pixel: 1248; Power Supplies (V): 5; Vertical Pixel: 1; Maximum Operating Temperature: 50 Cel;
AR0239ATSH00XUD20-E
Onsemi's AR0239ATSH00XUD20-E is a CMOS image sensor with 3x3 um pixel size, offering 1936 (H) x 1188 (V) resolution. It operates at -40 to 105 °C with a dynamic range of 128 dB and outputs digital voltage from 0.40-2.50V. Ideal for applications requiring high-speed imaging such as surveillance cameras and automotive vision systems due to its frame rate of 90 fps and compact 1/2.7 inch optical format.
MT9M114D00STCZK24BC1-200
Onsemi's MT9M114D00STCZK24BC1-200 is a CMOS image sensor with 1.90x1.90 um pixel size, 54 MHz master clock, and 70.8 dB dynamic range. Ideal for applications requiring a digital voltage output interface, such as frame arrays in surveillance cameras or industrial imaging systems at temperatures ranging from -30 to 70°C.
CMV2000-3E12M1PP
Ams Ag
CMV2000-3E12M1PP by Ams Ag is a 2/3-inch CMOS image sensor with 2048x1088 pixels, offering a high dynamic range of 90 dB. With a pixel size of 5.5um and SPI interface, it operates b/w -30°C to 70°C. Ideal for applications requiring fast frame rates up to 340 fps in industrial imaging systems.
KAE-02150-FBB-SP-FA
The Onsemi KAE-02150-FBB-SP-FA is a 2/3 inch CCD image sensor with 1920x1080 pixels, offering a dynamic range of 68 dB. Operating b/w -40 to 40 °C, it has a supply voltage range of 4.5V to 6V. Ideal for high-resolution imaging applications requiring high frame rates up to 60 fps.
KAE-04472-ABA-SD-FA
KAE-04472-ABA-SD-FA by Onsemi is an image sensor with 7.4x7.4 um pixel size, 2096 horizontal and vertical pixels, and a dynamic range of 92 dB. It operates b/w -50 to 60 °C and outputs current at a rate of 40 Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-4021-AAA-CR-BA
The Onsemi KAI-4021-AAA-CR-BA is a 2048x2048 CCD image sensor with 7.4um pixel size, offering a dynamic range of 60dB. It operates b/w -50 °C to 70°C and has a data rate of 40Mbps. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
AR0330CS1C12SPKA0-CP2
The Onsemi AR0330CS1C12SPKA0-CP2 image sensor features 2304x1536 pixels, 27 MHz master clock, and 69.5 dB dynamic range. Ideal for applications requiring high-resolution imaging with a frame rate of 60 fps in a compact rectangular package.
KAE-08152-FBA-JP-FA
KAE-08152-FBA-JP-FA by Onsemi is an image sensor with 5.5x5.5 um pixel size, 40 MHz master clock, and 86 dB dynamic range. Ideal for applications requiring high-quality imaging in a compact form factor, such as industrial machine vision systems or medical imaging devices.
AR0239ATSC00XUD20
IMAGE SENSOR,CMOS;
AR0135CS2M00SUEA0-DRBR1
Onsemi's AR0135CS2M00SUEA0-DRBR1 is a 1/3 inch CMOS image sensor with 1280x960 pixels, offering a dynamic range of 71.1 dB and operating at temperatures from -30 to 70°C. With a max supply voltage of 1.95V and output interface type of 2-WIRE INTERFACE, it is ideal for applications requiring high-resolution imaging at up to 54 fps.
KAI-50140-AXA-JD-B1
KAI-50140-AXA-JD-B1 by Onsemi is an image sensor with 4.5X4.5 um pixel size, 60 MHz master clock, and 10440 horizontal pixels. It operates b/w -50 to 60 °C and has a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in various industries.
KAF-8300-AXC-CP-AA
The Onsemi KAF-8300-AXC-CP-AA is an image sensor with 5.4x5.4 um pixel size, offering a dynamic range of 64.4 dB and 3326 horizontal pixels. It operates b/w -10 to 70 °C, making it suitable for high-resolution imaging applications in various industries such as astronomy and microscopy.
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Kodak Image Sensor Solutions
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Pixel Size (um): 5.4X5.4;
Truesense Imaging
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON; Maximum Operating Temperature: 70 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Operating Temperature: -10 Cel; Body Length/Diameter: 29.21 mm;
KAF-8300-AXC-CD-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Data Rate: 28 Mbps; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON; Minimum Operating Temperature: -10 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Additional Features: SENSITIVITY IS 23 MICRO V/ELECTRON; Housing: CERAMIC;
KAF-8300-AAB-CB-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Horizontal Pixel: 3326;
KAF-8300-AAB-CB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2504; Termination Type: SOLDER;
KAF-8300-AXC-CB-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Data Rate: 28 Mbps;
KAF-8300-AXC-CB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Array Type: FULL FRAME;
KAF-8300-AXC-CP-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 70 Cel; Dynamic Range: 64.4 dB;
KAF-8300CE
KAF-8300-CXB-CB-AA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 64.4 dB; Maximum Operating Temperature: 60 Cel; Pixel Size (um): 5.4X5.4;
KAF-8300-CXB-CB-AA-OFFSET
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Body Length/Diameter: 29.21 mm;
KAF-8300-CXB-CB-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 14.5 V; Body Length/Diameter: 29.21 mm; Termination Type: SOLDER;
KAF-8300-CXB-CB-AE-OFFSET
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Supply Voltage: 15.5 V; Maximum Operating Temperature: 70 Cel;
KAF-8300-AXC-CD-AE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Data Rate: 28 Mbps; Minimum Operating Temperature: -10 Cel;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Body Height: 4.42 mm; Minimum Supply Voltage: 14.5 V;
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: ANALOG VOLTAGE; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 3326; Maximum Supply Voltage: 15.5 V;
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