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KAF-8300-CXB-CB-AA

Onsemi

KAF-8300-CXB-CB-AA by Onsemi

The Onsemi KAF-8300-CXB-CB-AA image sensor features 5.4x5.4 um pixel size, 3448 horizontal pixels, and 2574 vertical pixels. With a max supply voltage of 15.5 V, it is ideal for high-resolution imaging applications in industries such as astronomy and microscopy.

Median Price

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Lifecycle Status

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1k+

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Vyrian

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Digiode

USA . 1,955 parts In-Stock

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TANS Electronics

Latvia . 6,241 parts In-Stock

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SupplyDigital Components

Austria . 6,119 parts In-Stock

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Kulean Microsystems

USA . 3,612 parts In-Stock

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Problanco Electronics

Mexico . 2,909 parts In-Stock

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Corphita

USA . 288 parts In-Stock

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UHIMA Technologies

Türkiye . 264 parts In-Stock

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Corohmni

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Overview

Experience the unparalleled quality and precision of Onsemi with the KAF-8300-CXB-CB-AA Image Sensor. Perfect for a wide range of applications, this cutting-edge sensor offers exceptional performance and reliability. Whether you're in the fields of machine vision, medical imaging, or scientific research, this sensor delivers unmatched value, benefits, and advantages to elevate your projects to new heights. Trust Onsemi for superior technology that exceeds expectations every time.

Feature Benefit Bullets

Pixel Size (um): 5.4X5.4

Smaller pixel sizes result in higher resolution images, making this image sensor ideal for capturing detailed images with clarity.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage allows for better performance and flexibility in different operating conditions.

Body Width: 20.07 inch

The compact body width of this image sensor makes it suitable for space-constrained applications.

Power Supplies (V): 15

The standard power supply voltage of 15V ensures compatibility with commonly used power sources.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality image capture and low noise, making this product a reliable choice for imaging applications.

Package Shape or Style: RECTANGULAR

Rectangular package shape allows for easy integration and mounting in various devices.

Minimum Supply Voltage: 14.5 V

Having a low minimum supply voltage ensures efficient power consumption and flexibility in power management.

Maximum Operating Temperature: 60 °C

High maximum operating temperature range enables this image sensor to be used in a wide range of environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Housing: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed housing provides durability and protection for the sensitive components of the image sensor.

Dynamic Range: 64.4 dB

High dynamic range results in better image quality with improved contrast and color accuracy.

Vertical Pixel: 2574

Higher vertical pixel count allows for detailed and high-resolution images to be captured.

Body Length/Diameter: 29.21 mm

Compact body size makes this image sensor suitable for small devices and applications.

Data Rate: 28 Mbps

High data rate enables fast and efficient image capture and processing.

Termination Type: SOLDER

Solder termination provides a reliable connection for easy integration into circuit boards.

Array Type: FULL FRAME

Full frame array type ensures that the entire image sensor area is utilized for capturing images, resulting in high-quality photos.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting feature provides secure and stable mounting of the image sensor in various devices and applications.

Technical Specifications

Image Sensors KAF-8300-CXB-CB-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Array Type:

FULL FRAME

Body Width:

20.07 inch

Body Length/Diameter:

29.21 mm

Data Rate:

28 Mbps

Dynamic Range:

64.4 dB

Horizontal Pixel:

3448

Housing:

CERAMIC, GLASS-SEALED

Mounting Feature:

Maximum Operating Temperature:

60 Cel

Minimum Operating Temperature:

0 Cel

Package Shape or Style:

Pixel Size (um):

5.4X5.4

Power Supplies (V):

15

Sensors or Transducers Type:

Sub-Category:

CCD Image Sensors

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2574

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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