Loading...

KAF-8300-AAB-CB-AA

Onsemi

KAF-8300-AAB-CB-AA by Onsemi

The Onsemi KAF-8300-AAB-CB-AA is a CCD image sensor with 5.4x5.4 um pixel size, offering a dynamic range of 64.4 dB and outputting analog voltage signals. It has 3326 horizontal pixels and 2504 vertical pixels, suitable for applications requiring high-resolution imaging in environments with temperatures ranging from -10 to 70 °C.

Median Price

$4,653.770

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1 parts In-Stock

1+ parts

$3,723.020

100+ parts

$3,499.640

1k+ parts

$3,276.260

10k+ parts

-

1

$3,723.020

$3,499.640

$3,276.260

-

DigiKey

USA . 1 parts In-Stock

1+ parts

$4,653.770

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$4,653.770

-

-

-

Verical

USA . 1 parts In-Stock

1+ parts

$4,653.775

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$4,653.775

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,051 parts In-Stock

1+ parts

$3,528.300

100+ parts

-

1k+ parts

-

10k+ parts

-

1,051

$3,528.300

-

-

-

Vyrian

USA . 4,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,171

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,315 parts In-Stock

1+ parts

$3,342.600

100+ parts

-

1k+ parts

-

10k+ parts

-

2,315

$3,342.600

-

-

-

Continental Prestige Electronics

USA . 1 parts In-Stock

1+ parts

$3,493.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$3,493.000

-

-

-

Corohmni

South Africa . 114 parts In-Stock

1+ parts

$3,714.000

100+ parts

-

1k+ parts

-

10k+ parts

-

114

$3,714.000

-

-

-

Problanco Electronics

Mexico . 5,064 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,064

-

-

-

-

SupplyDigital Components

Austria . 4,057 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,057

-

-

-

-

Kulean Microsystems

USA . 3,714 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,714

-

-

-

-

TANS Electronics

Latvia . 941 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

941

-

-

-

-

UHIMA Technologies

Türkiye . 936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

936

-

-

-

-

Overview

Experience exceptional image quality with the KAF-8300-AAB-CB-AA by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch image sensors that are ideal for various applications. The KAF-8300-AAB-CB-AA offers unparalleled performance, reliability, and precision, making it a valuable asset for professionals looking to capture stunning images with ease. Elevate your projects with this innovative image sensor and unlock endless possibilities in the world of imaging technology.

Feature Benefit Bullets

Pixel Size (um): 5.4X5.4

Smaller pixel size allows for higher resolution images with more detail.

Maximum Supply Voltage: 15.5 V

Higher maximum supply voltage provides flexibility in power supply options.

Body Width: 20.32 inch

Compact size makes it easier to integrate into various devices or systems.

Sensors or Transducers Type: IMAGE SENSOR, CCD

CCD image sensors are known for their high-quality image output and low noise levels.

Body Height: 4.42 mm

Low profile design allows for use in thin devices or tight spaces.

Package Shape or Style: RECTANGULAR

Rectangular shape is commonly used and easy to mount or integrate.

Minimum Supply Voltage: 14.5 V

Lower minimum supply voltage helps in reducing power consumption.

Maximum Operating Temperature: 70 °C

Wide operating temperature range ensures performance in various environments.

Horizontal Pixel: 3326

High horizontal pixel count results in detailed and sharp images.

Output Type: ANALOG VOLTAGE

Analog voltage output is compatible with many existing systems and interfaces.

Minimum Operating Temperature: -10 °C

Low minimum operating temperature allows for use in cold environments.

Housing: CERAMIC

Ceramic housing provides durability and protection for the sensor components.

Dynamic Range: 64.4 dB

High dynamic range enables capturing of both bright and dark details in the same image.

Vertical Pixel: 2504

Vertical pixel count contributes to the overall image quality and resolution.

Body Length/Diameter: 29.21 mm

Compact body size allows for versatile mounting options and space-saving designs.

Data Rate: 28 Mbps

High data rate allows for fast and efficient transfer of image data.

Termination Type: SOLDER

Solder termination ensures secure and reliable connections during installation.

Array Type: FULL FRAME

Full frame array type offers uniform image quality across the entire sensor area.

Mounting Feature: THROUGH HOLE MOUNT

Through hole mounting provides stability and ease of installation in various setups.

Technical Specifications

Image Sensors KAF-8300-AAB-CB-AA attributes and parameters. Explore more Image Sensors devices from Onsemi

Specs

Additional Features:

SENSITIVITY IS 23 MICRO V/ELECTRON

Array Type:

FULL FRAME

Body Width:

20.32 inch

Body Height:

4.42 mm

Body Length/Diameter:

29.21 mm

Data Rate:

28 Mbps

Dynamic Range:

64.4 dB

Horizontal Pixel:

3326

Housing:

CERAMIC

Mounting Feature:

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Output Type:

Package Shape or Style:

Pixel Size (um):

5.4X5.4

Sensors or Transducers Type:

Maximum Supply Voltage:

15.5 V

Minimum Supply Voltage:

14.5 V

Termination Type:

SOLDER

Vertical Pixel:

2504

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20