Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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The Onsemi KAE-02152-ABB-SD-EE is a 5.5x5.5um CCD image sensor with 1920x1080 pixels, offering a dynamic range of 86dB. It operates b/w -40 °C to +40°C and comes in a rectangular ceramic housing. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
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1k+
Vyrian
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UHIMA Technologies
The small pixel size allows for detailed and high-resolution image capture, making this product suitable for applications requiring clear and sharp images.
The compact body width makes the image sensor easy to integrate into various devices without taking up too much space, making it versatile for different applications.
The use of CCD sensor technology ensures high-quality image capture with accurate color reproduction, making it ideal for professional and demanding imaging tasks.
The low body height allows for a slim profile design, making it suitable for applications where space is limited and a compact form factor is required.
The rectangular package shape is commonly used and easily mountable, making it convenient for integration into various devices and equipment.
The high maximum operating temperature range ensures the image sensor can withstand harsh environmental conditions, making it reliable for use in a wide range of applications.
The high horizontal pixel count enables high-definition image capture with fine details, making it ideal for applications that require precise imaging and detailed analysis.
The current output type provides a stable and reliable signal output, ensuring accurate image data transmission for consistent performance in various imaging applications.
The low minimum operating temperature range allows the image sensor to function in cold environments or during temperature fluctuations, making it suitable for outdoor and industrial applications.
The ceramic housing offers durability and protection for the internal components, ensuring long-term reliability and stability in harsh operating conditions.
The wide dynamic range capability allows the image sensor to capture both bright and dark areas in the same frame, providing balanced exposure and detailed image quality in high-contrast scenes.
The vertical pixel count contributes to the overall image resolution and clarity, allowing for high-quality image capture and visualization in applications that require detailed image analysis.
The moderate body length/diameter provides a balance between compact size and functionality, making the image sensor suitable for various integration options and applications.
The 2/3 inch optical format is a popular standard in the industry, offering compatibility with a wide range of lenses and accessories for flexible imaging solutions.
The solder termination type ensures secure and reliable connections for easy installation and integration of the image sensor into different devices and systems.
The interline array type enables fast and efficient image capture with reduced image lag, making it suitable for real-time imaging applications that require quick response and minimal delay.
The through hole mount feature allows for easy and secure mounting of the image sensor onto circuit boards or mounting platforms, ensuring stable positioning and alignment for consistent performance.
Image Sensors KAE-02152-ABB-SD-EE attributes and parameters. Explore more Image Sensors devices from Onsemi
Additional Features:
Array Type:
Body Width:
Body Height:
Body Length/Diameter:
Dynamic Range:
Horizontal Pixel:
Housing:
Mounting Feature:
Maximum Operating Temperature:
Minimum Operating Temperature:
Optical Format (inch):
Output Type:
Package Shape or Style:
Pixel Size (um):
Sensors or Transducers Type:
Termination Type:
Vertical Pixel:
Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).
President, CEO
Hassane El-Khoury
Executive VP, CFO, Treasurer
Thad Trent
Senior VP
Ross F. Jatou
Aizu Fab
Fabrication
Fab Initiation
1995
Japan
Aizu Wakamatsu
Wafer Capacity
52,000
Si/EPI Fab
2018
Czech Republic
Rožnov pod Radhoštěm
10,000
Expansion Phase 1 for SiC / EPI
2019
14,500
Expansion Phase 2 for SiC / EPI
2024
SiC Fab
2022
USA
Hudson
Bucheon
2013
South Korea
61,000
ISMF - Malaysia
1990
Malaysia
Seremban
95,000
Roznov Device Fab
1987
80,000
Fab 10
2002
East Fishkill
15,000
Burlington
1986
Canada
Gresham
1998
45,000
Bucheon 150mm
2000
50,000
Rochester
1983
Nampa
Pennsylvania
1997
Mountain Top
36,000
BAV99
General Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
1N4148
Crimson Semiconductor
RECTIFIER DIODE; Terminal Position: AXIAL; Terminal Form: WIRE; No. of Terminals: 2; Surface Mount: NO; Package Shape: ROUND;
SMBJ18CA
Fairchild Semiconductor
TRANS VOLTAGE SUPPRESSOR DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
2N7002
Sipex
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .2 W; Peak Reflow Temperature (C): 240; Terminal Finish: TIN LEAD;
ULN2803A
Sanken Electric
NPN; Configuration: 8 BANKS, DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Maximum Collector Current (IC): .5 A; JESD-30 Code: R-PDIP-T18; Package Body Material: PLASTIC/EPOXY;
Itt Semiconductor
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Package Body Material: PLASTIC/EPOXY; Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR; Package Shape: RECTANGULAR;
Dc Components
NE555D
PULSE; RECTANGULAR; Temperature Grade: COMMERCIAL; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR; Surface Mount: YES;
LL4148
RECTIFIER DIODE; Terminal Position: END; Terminal Form: WRAP AROUND; No. of Terminals: 2; Surface Mount: YES; Package Shape: ROUND;
M39029/58-360
Amphenol
CONNECTOR ACCESSORY; MIL Conformity: YES; Associated Military - Specifications: MIL-DTL-38999; Contact Gender: MALE; Terminal Type: CRIMP; IEC Conformity: NO;
Brightking
Bytesonic Electronics
Forward International Electronics
RECTIFIER DIODE; Surface Mount: NO; Maximum Output Current: .15 A; Maximum Reverse Recovery Time: .004 us; Maximum Operating Temperature: 200 Cel; No. of Phases: 1;
MBRM140T1G
Onsemi
MBRM140T1G by Onsemi is a Schottky rectifier diode with 40V max repetitive peak reverse voltage, 1A max output current, and 0.3V max forward voltage. It is used in applications requiring small outline surface mount diodes for efficient power management.
Good-ark Electronics
TRANS VOLTAGE SUPPRESSOR DIODE; Surface Mount: YES; Maximum Repetitive Peak Reverse Voltage: 18 V; Nominal Breakdown Voltage: 21.05 V; Maximum Time At Peak Reflow Temperature (s): 10; JESD-609 Code: e3;
N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: YES; JEDEC-95 Code: TO-236AB; Qualification: Not Qualified; Package Style (Meter): SMALL OUTLINE;
Surge Components
CDSOT23-SM712
Bourns
Bourns CDSOT23-SM712 is a bidirectional Transient Voltage Suppressor diode with 400W peak power dissipation and 20uA reverse current. Ideal for surge protection in applications requiring a max clamping voltage of 14V, such as IEC-61000-4-2 compliant systems. Operates b/w -55°C to 150°C with matte tin finish and Gull Wing terminals.
Sensitron Semiconductor
North American Philips Discrete Products Div
RECTIFIER DIODE; Surface Mount: NO; Maximum Forward Voltage (VF): 1 V; JESD-609 Code: e0; Maximum Repetitive Peak Reverse Voltage: 100 V; Terminal Finish: Tin/Lead (Sn/Pb);
MT9V022I77ATM
The Onsemi MT9V022I77ATM is a CMOS image sensor with 6x6 um pixel size, 752H x 480V resolution, and 26.6 MHz master clock. It operates at -40 to 85 °C with a dynamic range of 54.4 dB. Ideal for applications requiring high-quality digital imaging at up to 60 fps frame rate in a compact square package suitable for surface mounting.
KLI-4104-AAA-CB-AA
The Onsemi KLI-4104-AAA-CB-AA is an Image Sensor with 10x10 um pixel size, 4134 horizontal and vertical pixels. It operates b/w 0-70 °C, with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
NOIP1FN5000A-LTI
NOIP1FN5000A-LTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592x2048 pixels, offering a dynamic range of 60 dB and sensitivity of 7.5 V/lx.s. It operates b/w -40 to 85 °C, has a max supply voltage of 1.9 V, and supports a frame rate of 100 fps. Ideal for applications requiring high-resolution imaging in various lighting conditions.
AR0141CS2M00SUEA0-DPBR
The Onsemi AR0141CS2M00SUEA0-DPBR image sensor features a pixel size of 3x3 um, operates at a max supply voltage of 1.95V, and has a master clock speed of 50 MHz. Ideal for applications requiring high-resolution imaging such as surveillance cameras, automotive vision systems, and industrial inspection equipment.
NOIP3SE5000A-LTI
NOIP3SE5000A-LTI by Onsemi is a 4.8x4.8 um CMOS image sensor with 2592 (H) x 2048 (V) pixels, operating at 45 fps. It has a dynamic range of 60 dB and spectral response of 400-1000 nm. Ideal for applications requiring high-resolution imaging in industrial automation and surveillance systems.
AS0142ATSC00XUSM0-DPBR-E
AS0142ATSC00XUSM0-DPBR-E by Onsemi is an image sensor with 3x3 um pixel size, 27 MHz master clock, and 1.89V max supply voltage. Ideal for digital cameras, surveillance systems, and automotive applications due to its high resolution and wide operating temperature range.
MT9M001C12STM-TP
Onsemi's MT9M001C12STM-TP is a 1/2 inch CMOS image sensor with 1280x1024 resolution, offering a pixel size of 5.2um. Operating at up to 70°C, it has a max supply voltage of 3.6V and supports a master clock of 48MHz. Ideal for applications requiring high-resolution imaging in compact devices.
KLI-8023-AAA-ER-AA
KLI-8023-AAA-ER-AA by Onsemi is an Image Sensor with 9x9 um pixel size, 8002 horizontal and vertical pixels. It operates b/w 0 to 70 °C, with a dynamic range of 84 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
NOIP1FN025KA-GDI
NOIP1FN025KA-GDI by Onsemi is an image sensor with 4.5x4.5 um pixel size, 360 MHz master clock, and 5120x5120 resolution. It operates b/w -40 to 85 °C and has a dynamic range of 59 dB. Ideal for high-resolution imaging applications requiring fast frame rates up to 80 fps.
TC281
Texas Instruments
TC281 by Texas Instruments is an image sensor with 8x8 um pixel size, 13V power supply, and max operating temp of 45°C. With 1010 horizontal pixels and 1030 vertical pixels, it's ideal for THROUGH HOLE MOUNT applications in various industries.
AR0144CSSM20SUKA0-CPBR
Onsemi's AR0144CSSM20SUKA0-CPBR is a 1/4 inch CMOS image sensor with 1280x800 resolution, 3x3 um pixel size, and 60 fps frame rate. Ideal for surface mount applications, it features a solder termination type and 2-wire interface for seamless integration in various imaging systems.
KAI-0373-EBA-CB-AE
KAI-0373-EBA-CB-AE by Onsemi is an image sensor with 768x484 pixels, 11.6X13.6 um pixel size, and 60 dB dynamic range. It operates b/w -25 to +40 °C and has a supply voltage range of 14.5V to 15.5V. Ideal for applications requiring high-quality imaging in a compact form factor such as industrial cameras or medical devices.
KAE-02152-FBB-SD-FA
The Onsemi KAE-02152-FBB-SD-FA is a 2/3 inch CCD image sensor with 1920x1080 pixels, 5.5um pixel size, and 86dB dynamic range. It operates b/w -40 °C to +40°C and features current output. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-08050-ABA-JD-BA
KAI-08050-ABA-JD-BA by Onsemi is a 5.5x5.5 um CCD image sensor with 3296 (H) x 2472 (V) pixels, offering a dynamic range of 64 dB. It operates b/w -50 °C to 70°C and has an optical format of 4/3 inch. Ideal for applications requiring high-quality imaging in industrial and scientific fields.
KLI-4104-AAA-CP-AE
KLI-4104-AAA-CP-AE by Onsemi is an Image Sensor with 10x10 um pixel size, 4134 horizontal and vertical pixels. It operates b/w 0 to 70 °C with a dynamic range of 60 dB. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
KAI-04022-ABA-CR-BA
KAI-04022-ABA-CR-BA by Onsemi is an image sensor with 2048x2048 pixels, 7.4um pixel size, and 72dB dynamic range. It operates b/w -50 to 70 °C and has a supply voltage range of 14.5V to 15.5V. Ideal for applications requiring high-resolution imaging in industrial or scientific settings.
MT9V137C12STC-DP
Onsemi's MT9V137C12STC-DP is a 5.6x5.6 um CMOS image sensor with 680H x 512V pixels, offering a dynamic range of 74.6 dB and sensitivity of 11.9 V/lx.s. It operates at temperatures from -30 to 70 °C, with a max supply voltage of 1.9 V and frame rate of 30 fps, suitable for surface mount applications in various imaging systems.
MT9V126IA3XTC-TP
MT9V126IA3XTC-TP by Onsemi is a 1/4 inch CMOS image sensor with 5.60x5.60 um pixel size, offering 680x512 resolution and 30 fps frame rate. Ideal for digital cameras, surveillance systems, and industrial imaging applications due to its high dynamic range of 74.6 dB and compact square package design.
AR0143ATSC00XUEA0-DRBR
Onsemi's AR0143ATSC00XUEA0-DRBR is a 9mm x 1.55mm CMOS image sensor with 1344x968 resolution, suitable for frame array applications. It features a 1/4" optical format, Tin/Silver/Copper terminal finish, and operates at 30 fps with a 2-wire interface for surface mount installation.
KAI-4011-CBA-CD-BA
KAI-4011-CBA-CD-BA by Onsemi is a 2048x2048 CCD image sensor with 7.4um pixel size and 60dB dynamic range. It operates b/w -50 °C to 70°C, making it suitable for industrial imaging applications requiring high-resolution and low-light performance. The sensor comes in a rectangular ceramic housing with through-hole mounting feature, offering reliable performance at data rates up to 40 Mbps.
Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.
KAE-04471-ABA-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: VOLTAGE OUTPUT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 2096; Frame Rate: 30 fps;
KAE-01093-QBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Body Width: 30 inch; Maximum Operating Temperature: 60 Cel;
KAE-02150-FBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Length/Diameter: 33 mm; Termination Type: SOLDER; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB;
KAE-02150-ABB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 86 DB; Maximum Operating Temperature: 40 Cel;
KAE-02150-FBB-JP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Horizontal Pixel: 1920; Array Type: INTERLINE; Power Supplies (V): 15;
KAE-02150-ABB-JP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Power Supplies (V): 15; Optical Format (inch): 2/3; Minimum Operating Temperature: -70 Cel;
KAE-02150-FBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1080; Minimum Operating Temperature: -40 Cel; Additional Features: IT HAS A SENSITIVITY OF 44 MICRO VOLT PER ELECTRON, ELECTRONIC SHUTTER, IT ALSO HAVE DYNAMIC RANGE 60 AND 86 DB;
KAE-01093-ABB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1024; Horizontal Pixel: 1024;
KAE-01093-QBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Maximum Operating Temperature: 60 Cel; Body Length/Diameter: 33 mm;
KAE-02150-ABB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Housing: ALUMINIUM; Optical Format (inch): 2/3;
KAE-02150-ABB-SP-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Height: 4.61 mm; Body Length/Diameter: 33 mm; Horizontal Pixel: 1920;
KAE-02150-FBA-JP-FE
IMAGE SENSOR,CCD;
KAE-02150-ABA-JP-FE
KAE-02150-FBB-JP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Optical Format (inch): 2/3; Vertical Pixel: 1080;
KAE-01093-FBB-SD-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Minimum Supply Voltage: 4.5 V; Termination Type: SOLDER;
KAE-02150-ABB-SP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Body Width: 29.97 inch; Minimum Supply Voltage: 4.5 V; Termination Type: SOLDER;
KAE-02150-ABB-JP-FA
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Package Shape or Style: RECTANGULAR; Dynamic Range: 68 dB; Termination Type: SOLDER; Maximum Operating Temperature: 40 Cel;
KAE-01093-ABB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Vertical Pixel: 1024; Frame Rate: 91 fps;
KAE-01093-FBB-SD-EE
IMAGE SENSOR,CCD; Mounting Feature: THROUGH HOLE MOUNT; Output Type: DIGITAL VOLTAGE; Package Shape or Style: RECTANGULAR; Pixel Size (um): 9X9; Minimum Operating Temperature: -50 Cel;
KAE-02150-ABA-JP-FA
IMAGE SENSOR,CCD; Array Type: INTERLINE; Vertical Pixel: 1080; Additional Features: IT ALSO HAVE DYNAMIC RANGE 86 DB; IT HAS SENSITIVITY OF 44 MICRO VOLT PER ELECTRON; ELECTRONIC SHUTTER; Horizontal Pixel: 1920; Dynamic Range: 68 dB;
Supply Digital Components
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Quantity
12,000 In-Stock
Total price ≈ $80,197.29
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